Texas Instruments TPS5430EVM-173F

Overview

TPS5430EVM-173F from Texas Instruments is an evaluation module designed to demonstrate and validate the TPS5430 3A, wide-input (5.5V–36V), synchronous step-down DC/DC converter in its thermally enhanced 8-pin SOIC PowerPAD™ package. It delivers up to 3A continuous output current at adjustable voltages down to 1.22V with 1.5% initial reference accuracy, fixed 500kHz switching frequency, and integrated 100mΩ high-side MOSFET - enabling compact, high-efficiency power supply designs for 12V/24V distributed systems.

For engineers reviewing the TPS5430EVM-173F datasheet, TPS5430EVM-173F test setup, TPS5430EVM-173F application circuit, or TPS5430EVM-173F design files, this module provides validated layout, thermal performance data, WEBENCH®-compatible reference design files, and real-world efficiency vs. load curves - accelerating prototyping of industrial, automotive audio, and high-power LED supplies.

Technical Context

The TPS5430EVM-173F implements a voltage-mode PWM control architecture with input voltage feed-forward to maintain stable loop gain across input variations, enabling fast line transient response and simplified compensation. Its onboard TPS5430 IC integrates a bootstrap-recharge diode, internal slow-start (8ms typical), undervoltage lockout (5.3V rising threshold), and cycle-by-cycle overcurrent protection with hiccup-mode fault recovery.

This EVM supports fixed 500kHz operation, uses a 15µH power inductor and B340A Schottky output rectifier, and features soldered PowerPAD™ thermal interface for junction-to-board R_θJB = 15°C/W. The board includes test points for VIN, VOUT, PH, BOOT, ENA, and VSENSE - facilitating direct oscilloscope probing of gate drive, current sense, and feedback dynamics.

Key Specifications

Availability

TPS5430EVM-173F is available at Aetrix Electronics and suitable for industrial embedded developers, automotive audio system designers, high-power LED lighting engineers, and connected-device designers requiring stable component supply, rapid power architecture validation, and production-ready reference layouts.

Supply support for TPS5430EVM-173F includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, delivering analog and embedded processing solutions for industrial, automotive, personal electronics, and communications markets.

The TPS5430EVM-173F belongs to TI's Power Management EVM family, specifically engineered to accelerate adoption of the TPS543x buck converter series by providing fully assembled, tested, and characterized hardware with documented thermal performance, efficiency curves, and WEBENCH®-linked design files.

FAQ

What is the primary function of the TPS5430EVM-173F?

The TPS5430EVM-173F is an evaluation module that demonstrates the TPS5430 3A synchronous step-down converter in operation. It provides a complete, tested hardware platform - including input/output filtering, thermal management, and test points - to validate performance, verify layout practices, and generate design files using TI's WEBENCH® Power Designer. The TPS5430EVM-173F itself is not a production component but a development tool for the TPS5430 IC.

Does the TPS5430EVM-173F support adjustable output voltage?

Yes, the TPS5430EVM-173F supports adjustable output voltage via external resistor divider on the VSENSE pin. The onboard configuration delivers 5.0V (using 10kΩ and 3.24kΩ resistors), but users can replace R1/R2 to set any output from 1.22V up to near VIN minus dropout. The TPS5430EVM-173F's feedback network is fully accessible, and the 1.221V internal reference ensures ±1.5% initial accuracy across the adjustment range.

What thermal performance can be expected from the TPS5430EVM-173F at full 3A load?

When operated at 12V input and 5V/3A output, the TPS5430EVM-173F achieves junction temperatures below 105°C at +25°C ambient, verified per TI's EVM User's Guide. This relies on proper soldering of the PowerPAD™ thermal pad to a ≥2 oz internal copper plane. The module's R_θJB = 15°C/W and measured 95% peak efficiency minimize self-heating, making the TPS5430EVM-173F suitable for thermal validation of high-density power stages.

Can the TPS5430EVM-173F be used to evaluate the TPS5431 as well?

No - the TPS5430EVM-173F is specifically configured for the TPS5430, which supports 5.5V–36V input. The TPS5431 has a lower 5.5V–23V input rating and different internal UVLO thresholds; substituting it on the TPS5430EVM-173F risks overvoltage stress on the IC during 24V+ operation. TI provides separate evaluation modules (e.g., TPS5431EVM) for the TPS5431 variant.

What design resources accompany the TPS5430EVM-173F?

The TPS5430EVM-173F ships with TI's official EVM User's Guide (SLVU201), schematic and layout files (Gerber), BOM, and WEBENCH®-compatible design project files. These enable immediate simulation of efficiency, thermal behavior, and transient response - plus one-click generation of custom variants. All resources are publicly available on TI's product folder for TPS5430EVM-173F and require no license.