Texas Instruments TPS54519RTER

Overview

TPS54519RTER from Texas Instruments is a 6-V input, 5-A synchronous step-down DC/DC converter with integrated high- and low-side 30 mΩ MOSFETs, 0.6 V ±1% reference, adjustable 200–2000 kHz switching frequency via RT pin, and power-good monitoring - designed for point-of-load regulation in FPGA, ASIC, and microprocessor power rails.

For engineers reviewing the TPS54519RTER datasheet, TPS54519RTER pinout, TPS54519RTER application, or TPS54519RTER equivalent, this page delivers verified electrical parameters, thermal performance data, slow-start sequencing behavior, UVLO programmability, and real-world protection features including cycle-by-cycle current limit, thermal shutdown at 155°C, and reverse current limiting at –2.7 A.

Technical Context

The TPS54519RTER implements constant-frequency peak-current-mode control with internal slope compensation to prevent subharmonic oscillation across duty cycles up to 100%. Its transconductance error amplifier (250 μA/V normal, 85 μA/V during slow start) compares VSENSE against either the 0.6 V reference or SS/TR voltage, enabling precise output regulation and tracking capability.

Bootstrap operation enables near-100% duty cycle: the BOOT-PH UVLO threshold is 2.1 V (typ), and an integrated boot charge circuit maintains gate drive. Frequency foldback reduces switching frequency during overcurrent or startup to limit inductor current, while PWRGD provides open-drain fault signaling with 2% hysteresis and 93–107% VREF window.

Key Specifications

Pinout & Package

TPS54519RTER uses a thermally enhanced 3 mm × 3 mm, 16-pin QFN package (RTE) with exposed PowerPAD (Pin 17) requiring solder connection to PCB ground plane for optimal thermal and electrical performance.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous buck converter applications.

Compared with MP2315DJ-LF-Z, TPS54519RTER offers wider VIN range, higher current, and full programmability - critical for low-input, high-transient FPGA/ASIC rails. Against TPS54319RTER, it delivers 67% more output current in identical footprint and thermal interface, justifying use where 4–5 A load headroom is required.

Availability

TPS54519RTER is available at Aetrix Electronics and suitable for FPGA power delivery, ASIC I/O regulation, and industrial PLC CPU modules requiring stable component supply, long-term lifecycle assurance, and consistent parametric performance across production batches.

Supply support for TPS54519RTER includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and power management technologies, with decades of expertise in high-reliability DC/DC conversion.

The TPS54519 belongs to TI's SWIFT™ synchronous buck converter product line, engineered for high-density point-of-load power delivery in computing, networking, and industrial systems where efficiency, thermal performance, and feature integration are critical.

FAQ

What is the minimum controllable on-time of the TPS54519RTER, and how does it affect maximum duty cycle?

The TPS54519RTER has a minimum controllable on-time of 60 ns (at full 5-A load) and 100 ns (at no load). This parameter limits the highest achievable duty cycle at a given switching frequency and input-output voltage ratio. For example, at 2 MHz and VIN = 5 V, VOUT = 1.2 V (24% duty cycle), the required on-time is ~120 ns - well above the 100 ns minimum, ensuring stable operation. At lower frequencies or higher VOUT/VIN ratios, the constraint relaxes. The TPS54519RTER achieves near-100% duty cycle when BOOT-PH remains above 2.1 V, supported by its integrated boot charge circuit.

Can the TPS54519RTER safely start up into a pre-biased output, and what protection mechanisms enable this?

Yes, the TPS54519RTER supports safe start-up into pre-biased outputs. It employs two key mechanisms: (1) a dedicated low-side reverse current limit of –2.7 A that disables the low-side FET when sinking excessive current, and (2) frequency foldback that reduces switching frequency during startup to limit inductor current slew rate. Additionally, the SS/TR pin is actively discharged to 0 V after any fault (UVLO, thermal shutdown, or EN deassertion), ensuring repeatable, controlled re-ramp. These features collectively prevent output collapse, shoot-through, or uncontrolled current surges when powering into an already charged rail - a requirement for hot-swap and modular power systems.

How is the switching frequency set on the TPS54519RTER, and what is the recommended tolerance for the RT resistor?

The switching frequency of the TPS54519RTER is set by connecting a single resistor from the RT pin to GND. The device holds RT at a nominal 0.5 V, and frequency scales inversely with resistance: 200 kHz at 218 kΩ and 2000 kHz at 16.9 kΩ. For a target of 490 kHz, a standard 84.5 kΩ ±1% metal-film resistor is recommended. TI's datasheet curve (Figure 8) shows ±5% frequency variation over temperature with a ±1% resistor; tighter tolerance (±0.1%) yields <±1% frequency drift but is rarely necessary. Avoid carbon composition or thick-film resistors due to thermal coefficient and noise sensitivity.

What thermal performance can be expected from the TPS54519RTER on a standard 4-layer PCB, and how does the PowerPAD impact this?

On a standard JEDEC 2s2p test board (2″×2″, 4 layers, 2 oz copper), the TPS54519RTER exhibits θJA = 49.1°C/W. The exposed PowerPAD (Pin 17) is essential to achieving this: it must be soldered to a solid internal ground plane using ≥4 thermal vias (10 mil diameter) to transfer heat efficiently from the die to the PCB. With optimized layout - including direct GND connections for Pins 3, 4, and PowerPAD, and short, wide VIN/PH traces - junction temperature rise is predictable: ΔTJ = 49.1 × PD. At 5-A load and 5 V input → 1.2 V output (85% efficiency), power dissipation is ~3.5 W, resulting in ~172°C rise above ambient - underscoring the need for proper heatsinking or derating in high-ambient environments. Custom board designs with enhanced copper and vias achieve θJA = 37.0°C/W.

Does the TPS54519RTER require an external bootstrap diode, and how is the BOOT capacitor selected?

No, the TPS54519RTER does not require an external bootstrap diode - it integrates the boot recharge circuit, eliminating one external component and associated layout complexity. A 0.1 μF ceramic capacitor (X7R or X5R dielectric, 10 V rating minimum) must be placed between BOOT and PH pins. This value ensures sufficient charge storage for gate drive across the full 200–2000 kHz frequency range and load conditions. Larger values (e.g., 0.22 μF) offer margin but increase board area and cost; smaller values (<0.047 μF) risk BOOT-PH droop below the 2.1 V UVLO threshold during high-duty-cycle operation, causing intermittent high-side FET disablement and regulation loss. Placement must be adjacent to the IC with shortest possible traces.