Texas Instruments TPS61010DGS

Overview

TPS61010DGS from Texas Instruments is a high-efficiency, adjustable-output synchronous boost converter IC designed for single- or dual-cell battery-powered systems. It delivers up to 200 mA output current from a 0.9 V input, supports programmable output voltage from 1.5 V to 3.3 V via external resistor divider, integrates synchronous rectification (no external Schottky diode required), and features autodischarge, low-battery detection, and power-save mode - enabling reliable operation in portable medical diagnostics and wireless headsets.

For engineers reviewing the TPS61010DGS datasheet, TPS61010DGS pinout, TPS61010DGS application, or TPS61010DGS equivalent, key selection considerations include its 0.8 V minimum operating input voltage, 500 kHz typical switching frequency, 10-pin MSOP (DGS) package with thermal pad, integrated 1.3 A switch current limit, and compatibility with low-ESR ceramic capacitors and 10–33 µH inductors in compact battery-powered designs.

Technical Context

The TPS61010DGS implements a fixed-frequency (420–780 kHz), current-mode PWM boost controller with pulse-by-pulse switch current limiting and internal slope compensation. Its synchronous rectifier uses integrated NMOS and PMOS switches (rDS(on) ≤ 0.51 Ω / 0.54 Ω at VO = 1.5 V) to achieve >95% peak efficiency without external diodes.

It operates across 0.8–3.6 V input range, enters power-save mode below ~10 mA load to maintain high light-load efficiency, and isolates load from battery during shutdown using backgate-diode disconnect circuitry - eliminating need for external load switches in battery-sensitive applications.

Key Specifications

Pinout & Package

TPS61010DGS is housed in a 10-pin MSOP (DGS) package with exposed thermal pad (3.00 mm × 3.00 mm body size), optimized for space-constrained portable PCBs and thermal performance in battery-operated systems.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar boost converter applications.

Compared with TPS61010DGS, TPS61022DRVR offers higher current and frequency but sacrifices adjustability and battery monitoring; MAX17222ETA+ saves space and cost but omits critical safety features like LBO and autodischarge - making TPS61010DGS optimal for battery-critical, feature-rich portable instrumentation.

Availability

TPS61010DGS is available at Aetrix Electronics and suitable for portable medical diagnostic equipment, wireless headsets, internet audio players, and remote controls requiring stable component supply, long-term lifecycle support, and guaranteed traceable sourcing.

Supply support for TPS61010DGS includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and power management technologies, with decades of expertise in battery-efficient power conversion ICs.

The TPS6101x family was engineered specifically for ultra-low-voltage, high-efficiency boost conversion in single/dual-cell battery systems - prioritizing startup reliability, light-load efficiency, and integrated protection features for portable electronics.

FAQ

What is the minimum input voltage required for TPS61010DGS to start up under full load?

The TPS61010DGS starts up into full load at a minimum input voltage of 0.9 V (typical), with guaranteed operation down to 0.8 V once running. This capability enables reliable operation across the full discharge curve of NiMH and alkaline batteries. The device incorporates undervoltage lockout (UVLO) that disables operation below ~0.7 V to prevent malfunction. For designs targeting lowest possible startup voltage, ensure proper layout and low-ESR input capacitance (≥10 µF) near the VBAT pin to sustain transient current demand during initial switching cycles of the TPS61010DGS.

How does the autodischarge function work on TPS61010DGS, and what is its design impact?

The autodischarge function on TPS61010DGS activates when the ADEN pin is connected to VBAT, engaging an internal 300 Ω switch between VOUT and GND after EN is pulled low. This discharges output capacitors to <0.4 V within milliseconds, preventing residual voltage from causing undefined states in microcontrollers or memory. If ADEN is tied to GND, autodischarge is disabled. This feature eliminates need for external discharge circuits, saving board space and BOM cost - especially valuable in portable medical and audio devices where deterministic power-down behavior is mandatory for regulatory compliance and user experience of the TPS61010DGS.

Can TPS61010DGS replace fixed-output variants like TPS61012DGS in an existing design?

Yes, TPS61010DGS can replace fixed-output variants such as TPS61012DGS, but requires modifying the feedback network: leave FB unconnected for fixed versions, whereas TPS61010DGS requires an external resistor divider from VOUT to GND to set output voltage (e.g., 1.5 V to 3.3 V). The pinout, package, and most electrical characteristics (startup voltage, efficiency, shutdown current) are identical across the TPS6101x family. However, TPS61010DGS does not have factory-trimmed output - design validation of output accuracy and load regulation under all conditions is required before substitution in production. All other functions (LBO, ADEN, COMP, etc.) remain fully compatible in the TPS61010DGS.

What thermal considerations apply to TPS61010DGS in a 10-pin MSOP (DGS) package?

The TPS61010DGS in the DGS package has a junction-to-ambient thermal resistance (RθJA) of 161.8°C/W and requires connection of the exposed thermal pad to a solid copper pour for effective heat dissipation. At maximum 200 mA output and 3.3 V, power dissipation reaches ~247 mW - resulting in ~40°C junction rise above ambient with proper PCB thermal design. Avoid floating the thermal pad or using insufficient copper area, as this degrades RθJA and risks thermal shutdown. TI recommends minimum 250 mm² of inner-layer copper connected via ≥4 thermal vias (0.3 mm diameter) to the pad. These guidelines ensure reliable operation within the specified –40°C to 85°C ambient range for the TPS61010DGS.

Does TPS61010DGS support discontinuous conduction mode (DCM), and how does it affect EMI?

Yes, TPS61010DGS automatically enters discontinuous conduction mode (DCM) at light loads, and implements a low-EMI mode to reduce radiated emissions during DCM transitions. In this mode, the controller modulates switching frequency and suppresses high-frequency harmonics generated by inductor current zero-crossing. Measured EMI profiles show reduced broadband noise above 30 MHz compared to forced continuous conduction mode (CCM) operation. This behavior is transparent to the user and requires no external configuration - enhancing electromagnetic compatibility in sensitive RF environments like wireless headsets and remote controls powered by the TPS61010DGS.