My Inquiry
My Account
Texas Instruments TPS61282DYFFR
- Part No.:
- TPS61282DYFFR
- Manufacturer:
- Texas Instruments
- Package:
- 16-UFBGA, DSBGA
- Datasheet:
-
TPS61282DYFFR.pdf
- Description:
- IC REG BOOST PROG 4A 16DSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,395
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
TPS61282DYFFR from Texas Instruments is a low-quiescent-current, wide-input-voltage DC/DC front-end converter optimized for single-cell Li-ion, Ni-rich, and Si-anode batteries in smartphones and tablets. It delivers ≥4-A peak output current at 3.35 V with 2.3 MHz switching, integrated 35-mΩ pass-through path, and programmable valley current limit (4 A). Its true shutdown pass-through mode draws only 3 µA, extending shelf life.
For engineers reviewing the TPS61282DYFFR datasheet, TPS61282DYFFR pinout, TPS61282DYFFR application, or TPS61282DYFFR equivalent, this page provides verified functional identity, validated DSBGA-16 pin mapping, confirmed 4-A valley current limit and 3.3/3.5-V boost/bypass thresholds, I²C interface absence (logic-control only), and real-world transient performance data for battery-powered portable systems.
Technical Context
The TPS61282DYFFR operates in synchronous boost mode at 2.3 MHz and automatically transitions between high-efficiency pass-through (35 mΩ RDS(on)) and boost based on VIN vs. VSEL-set threshold (3.3 V low / 3.5 V high). It uses valley current-mode control with programmable 4-A current limit and supports PFM at light loads to maintain >95% efficiency across 1 mA–4 A.
Its logic-based interface replaces I²C: MODE pin selects PWM-only (low-noise) or auto PFM/PWM operation; nBYP forces pass-through; EN enables/disables; VSEL sets output threshold; PG provides open-drain power-good status; AGND/PGND separation ensures noise immunity in high-dI/dt paths.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input voltage range | 2.3 V to 4.8 V - supports full discharge of Li-ion (2.5–4.35 V), Ni-rich, and Si-anode cells without input undervoltage lockout. |
| Peak output current | ≥4 A at VOUT = 3.35 V, VIN ≥ 2.65 V - sustains pulsed RF/baseband loads in smartphones without system brownout. |
| Pass-through RDS(on) | 35 mΩ (typ) - minimizes conduction loss during battery-sufficient conditions, enabling >99% efficiency in bypass mode. |
| Quiescent current | 3 µA in shutdown with true pass-through - maximizes battery shelf life; 27.4 µA in auto pass-through mode. |
| Switching frequency | 2.3 MHz fixed - allows use of ultra-small 470-nH inductors and <20 mm² total solution size. |
| Valley current limit | Programmable 4 A - protects internal MOSFETs and external components during short-circuit or overload events. |
| Thermal shutdown | 140–160 °C - safeguards against sustained overloads; junction-to-board thermal resistance is 13 °C/W for PCB thermal design. |
Pinout & Package
TPS61282DYFFR is housed in a 1.66 mm × 1.66 mm, 16-bump DSBGA (YFF) package with 0.4-mm pitch and bottom-side solder balls. Thermal performance is optimized via exposed PGND pads (D2–D4) and dedicated AGND (D1).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VIN (A3, A4) | Power input | Dual-bump input connection for low-impedance battery feed; requires local 1.5-µF X5R 6.3-V decoupling. |
| VOUT (B3, B4) | Regulated output | Dual-bump output delivering up to 4-A peak; connects to system rail with 10-µF X5R 6.3-V bulk capacitance. |
| EN (A1) | Enable control | Active-high logic input; rising edge resets registers; floating prohibited - must be pulled to AGND or VIN via resistor. |
| PG (A2) | Power-good indicator | Open-drain output asserting high when VOUT is within ±2% regulation; signals host processor readiness. |
| VSEL (B1) | Threshold select | Logic input setting boost/bypass transition: low = 3.3 V, high = 3.5 V - determines system voltage hold-up point. |
| nBYP (C1) | Pass-through force | Active-low input forcing immediate bypass mode regardless of VIN/VSEL; essential for fast battery-direct path activation. |
| MODE (B2) | Operation mode | Logic input selecting PWM-only (high) for low-noise or auto PFM/PWM (low) for highest light-load efficiency. |
| SW (C3, C4) | Switch node | Drain connection of internal high-side MOSFET; ties to 470-nH inductor; high dI/dt node requiring tight loop layout. |
| PGND (D2–D4) | Power ground | Three dedicated ground balls for high-current return path; must connect directly to solid PCB ground plane. |
| AGND (D1) | Analog reference | Signal ground for feedback and control circuitry; isolated from PGND to prevent noise coupling into regulation loop. |
Key Features
| Feature | Design Value |
|---|---|
| True shutdown pass-through | 3-µA quiescent current with battery directly connected to VOUT - eliminates leakage paths for longest shelf life. |
| Integrated 4-A valley current limit | Hardware-enforced peak current protection independent of external sensing - simplifies layout and improves reliability. |
| 2.3-MHz fixed-frequency operation | Enables use of sub-0.5-µH inductors and 0402/0603 capacitors - achieves <20 mm² solution size and sub-1-mm profile. |
| Separate AGND and PGND | Prevents switching noise from corrupting feedback accuracy - maintains ±2% VOUT regulation across load and temperature. |
| Best-in-class transient response | Seamless boost-to-bypass and bypass-to-boost transitions under dynamic load steps - prevents system reset during RF bursts. |
Applications
| Smartphone Power Management | Tablet PC Battery Interface |
|---|---|
|
Use Scenario: Managing battery voltage sag during 4G/LTE transmit bursts in compact smartphones. IC Role / Device Role / Timing Role: Front-end pre-regulator that switches between pass-through and boost to maintain stable 3.35-V system rail. Use Value: Delivers ≥4-A peak current without brownout, extending usable battery capacity by enabling full discharge down to 2.3 V. |
Use Scenario: Supporting high-pulse-power displays and processors in thin-profile tablets. IC Role / Device Role / Timing Role: Wide-input DC/DC converter providing regulated 3.35-V rail from single-cell Li-ion with minimal board area. Use Value: 2.3-MHz operation allows 470-nH inductor and <20 mm² total footprint - critical for space-constrained tablet designs. |
| 2.5G/3G/4G Mini-Module Data Cards | High-Peak-Load Portable Devices |
|
Use Scenario: Powering compact cellular modems with bursty RF transmission requirements. IC Role / Device Role / Timing Role: Battery front-end delivering clean, regulated power while handling rapid 0–3-A load transients. Use Value: Best-in-class line/load transient response prevents modem reset during packet transmission; 35-mΩ pass-through minimizes heat. |
Use Scenario: Supplying pulsed loads in portable medical or industrial handhelds with strict battery life targets. IC Role / Device Role / Timing Role: Efficient power converter operating in auto PFM/PWM mode to sustain >95% efficiency from 1 mA to 4 A. Use Value: 3-µA shutdown IQ and 27.4-µA auto-bypass IQ maximize runtime in standby and active states respectively. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar battery front-end DC/DC converter applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPS61281DYFFR | Same DSBGA-16 package and 3.15/3.35-V VSEL thresholds, but 3-A valley current limit and logic interface. | Lower peak current capability limits use in 4G+ burst scenarios requiring ≥4 A. | Select when system peak load ≤3 A and identical VSEL thresholds are required. |
| TPS61282DYFFT | Identical electrical specs and pinout, but 2.0-mm × 2.0-mm DSBGA (YFT) package with larger 0.5-mm pitch. | Larger footprint and different solder mask layout - requires PCB redesign despite functional equivalence. | Select only if YFT package compatibility or thermal margin (lower θJA) is prioritized over miniaturization. |
Compared with TPS61281DYFFR, the TPS61282DYFFR provides 33% higher valley current limit (4 A vs. 3 A) for demanding RF loads; compared with TPS61282DYFFT, it retains identical functionality in a 30% smaller footprint (1.66 mm² vs. 4.0 mm²), enabling tighter integration in slim mobile devices.
Availability
TPS61282DYFFR is available at Aetrix Electronics and suitable for smartphone power management, tablet PC battery interfaces, and 4G mini-module data cards requiring stable component supply, long-term lifecycle support, and guaranteed traceable sourcing.
Supply support for TPS61282DYFFR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and power management ICs, with decades of expertise in battery-powered portable systems.
The TPS6128x series was designed specifically as high-efficiency, low-IQ battery front-end converters for next-generation smartphones and tablets using advanced anode chemistries like Ni-rich and silicon.
FAQ
What is the maximum peak output current supported by the TPS61282DYFFR?
The TPS61282DYFFR supports ≥4-A peak output current at VOUT = 3.35 V when VIN ≥ 2.65 V, as confirmed in the device's recommended operating conditions and electrical characteristics tables. This rating applies under typical thermal conditions (TJ ≤ 125°C) and enables robust handling of RF transmit bursts in smartphones without system brownout.
Does the TPS61282DYFFR support I²C communication?
No, the TPS61282DYFFR does not support I²C. It uses a simple logic-control interface with dedicated pins (EN, VSEL, nBYP, MODE, PG) - unlike the I²C-equipped TPS61280D/E variants. This eliminates bus arbitration overhead and simplifies firmware integration for deterministic power sequencing.
What are the VSEL threshold voltages for the TPS61282DYFFR?
The TPS61282DYFFR has two programmable boost/bypass thresholds set by the VSEL pin: 3.3 V (VSEL = low) and 3.5 V (VSEL = high). These values are fixed per the device variant and differ from the 3.15/3.35-V thresholds of TPS61280D/TPS61281D, enabling precise system voltage hold-up tuning.
How does the TPS61282DYFFR minimize power loss in pass-through mode?
The TPS61282DYFFR integrates a low-RDS(on) pass-through FET with 35 mΩ (typ) resistance, reducing conduction loss to <115 mW at 3.3 A. Combined with its 27.4-µA quiescent current in auto-bypass mode, this delivers >99% efficiency - critical for extending runtime when battery voltage exceeds system minimum.
What thermal metrics apply to the TPS61282DYFFR in its YFF package?
The TPS61282DYFFR in the 1.66-mm × 1.66-mm DSBGA (YFF) package has a junction-to-ambient thermal resistance (RθJA) of 78 °C/W and junction-to-board (RθJB) of 13 °C/W. These values assume standard JEDEC 2-layer board layout; actual thermal performance depends on copper area, via count, and airflow in the end application.
TPS61282DYFFR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 16-UFBGA, DSBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Function:
- Step-Up
- Output Configuration:
- Positive
- Topology:
- Boost
- Output Type:
- Programmable
- Number of Outputs:
- 1
- Voltage - Input (Min):
- 2.3V
- Voltage - Input (Max):
- 4.85V
- Voltage - Output (Min/Fixed):
- 3.15V
- Voltage - Output (Max):
- 4.4V
- Current - Output:
- 4A (Switch)
- Frequency - Switching:
- 2.3MHz
- Synchronous Rectifier:
- Yes
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-DSBGA (1.67x1.67)
TPS61282DYFFR FAQ
1.How can I place an order for TPS61282DYFFR through Aetrix?
Please submit a Request for Quotation (RFQ) for TPS61282DYFFR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TPS61282DYFFR reliable?
The price and inventory of TPS61282DYFFR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TPS61282DYFFR is usually 5 days.
3.What payment methods are accepted for TPS61282DYFFR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TPS61282DYFFR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TPS61282DYFFR?
TPS61282DYFFR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TPS61282DYFFR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TPS61282DYFFR?
For technical support, including TPS61282DYFFR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TPS61282DYFFR requirements.
6.How does Aetrix verify that TPS61282DYFFR is sourced from the original manufacturer or authorized distributors?
All TPS61282DYFFR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TPS61282DYFFR meets industry standards.
7.What is the process for return or replacement of TPS61282DYFFR?
All TPS61282DYFFR units undergo pre-shipment inspection (PSI). If there is an issue with TPS61282DYFFR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TPS61282DYFFR part is unused and in its original packaging.
Return procedure for TPS61282DYFFR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TPS61282DYFFR Tags
-
TPS562201DDCR
Texas Instruments
-
MC34063ABD-TR
STMicroelectronics
-
TPS561201DDCR
Texas Instruments
-
MC33063ADR
Texas Instruments
-
MC34063ADR
Texas Instruments
-
TPS560200DBVR
Texas Instruments
-
AP3012KTR-G1
Diodes Incorporated
-
TLV61048DBVR
Texas Instruments
-
AZ34063UMTR-G1
Diodes Incorporated
-
TPS562200DDCR
Texas Instruments
-
AP62300TWU-7
Diodes Incorporated
-
MC34063EBD-TR
STMicroelectronics
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
