Texas Instruments TPS62301YZDR

Overview

TPS62301YZDR from Texas Instruments is a 500-mA, 3-MHz synchronous step-down DC-DC converter in Chip Scale Package (CSP-8), delivering fixed 1.5 V output from 2.7–6 V input with up to 93% efficiency, 86 µA quiescent current, and 35 ns minimum on-time - optimized for battery-powered mobile phones and smart-phones.

For engineers reviewing the TPS62301YZDR datasheet, TPS62301YZDR pinout, TPS62301YZDR application, or TPS62301YZDR equivalent, key selection criteria include its 1.5 V fixed output, CSP-8 thermal performance (250°C/W θJA), power-save mode operation at light loads, and MODE/SYNC pin for on-the-fly PWM/PSM control or external clock synchronization.

Technical Context

The TPS62301YZDR employs voltage-mode control with input voltage feed-forward for fast transient response, integrating dual MOSFET current limits (P-MOS: 670–890 mA; N-MOS: ±460–±740 mA) and automatic PFM/PWM mode transition based on load current. Its 3-MHz fixed-frequency oscillator supports synchronization via the MODE/SYNC pin's falling edge.

It features a 0.4 V internal reference, 1.5 V regulated output (±2% over –40°C to 85°C), and integrated soft-start. The device enters shutdown (<1 µA) when EN is low and includes undervoltage lockout (2.4 V threshold) and thermal shutdown (150°C, 20°C hysteresis).

Key Specifications

Pinout & Package

TPS62301YZDR is packaged in an 8-pin Chip Scale Package (CSP-8), bottom-terminal configuration with 0.5 mm pitch and 1.6 × 1.6 mm footprint. Thermal performance relies on soldered die-pad connection to PCB ground plane.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous step-down converter applications.

Compared with TPS62301YZDR, TPS62303YZDR shifts output to 1.8 V for I/O compatibility while maintaining identical size and efficiency, whereas TPS62321DRCR trades CSP-8 miniaturization for superior thermal management in QFN-10 - enabling higher sustained current in thermally constrained environments.

Availability

TPS62301YZDR is available at Aetrix Electronics and suitable for mobile phone baseband power, smartphone application processor core supplies, and Bluetooth/WLAN coexistence modules requiring stable component supply with consistent CSP-8 form factor and tape-and-reel delivery.

Supply support for TPS62301YZDR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of expertise in power management ICs for portable electronics.

The TPS623xx family was designed specifically for high-frequency, space-constrained battery-powered devices - delivering 3-MHz operation, chip-scale packaging, and adaptive PFM/PWM control to maximize runtime and minimize board area.

FAQ

What is the output voltage tolerance of the TPS62301YZDR across temperature and load?

The TPS62301YZDR delivers a fixed 1.5 V output with ±2% DC accuracy over –40°C to 85°C ambient temperature and 0–500 mA load range. This specification excludes external component tolerances since no external resistors are used - the regulation is fully internal and factory-trimmed, ensuring consistent core voltage for sensitive digital ICs without calibration.

Can the TPS62301YZDR be synchronized to an external clock, and what are the timing requirements?

Yes, the TPS62301YZDR supports external clock synchronization via the MODE/SYNC pin. It accepts a 3-MHz clock signal (2.65–3.35 MHz range) with 20–80% duty cycle; the internal switch is synchronized to the falling edge of that clock. This enables deterministic phase alignment in multi-converter systems, reducing beat frequencies and simplifying EMI filter design for the TPS62301YZDR in RF-dense layouts.

What is the recommended PCB layout practice for thermal management of the TPS62301YZDR in CSP-8?

For optimal thermal performance, the TPS62301YZDR CSP-8 package requires direct soldering of its bottom thermal pad to a minimum 25 mm² copper pour connected to inner-layer ground planes via ≥4 thermal vias (0.3 mm diameter). Avoid thermal relief on the pad; use solid copper to achieve effective heat spreading, especially critical above 200 mA continuous load where junction temperature rise exceeds 50°C.

Is the ADJ or FB pin used on the TPS62301YZDR, and what happens if they are connected externally?

No - the TPS62301YZDR is a fixed-output variant; both ADJ and FB pins are internally connected and must remain unconnected on the PCB. Per TI datasheet SLVS528E, external connection to either pin will disrupt regulation, cause output voltage drift, or prevent startup. The 1.5 V output is set by internal resistor dividers; no external components are required or permitted for feedback.

How does the TPS62301YZDR transition between PWM and power-save modes, and can it be forced into one mode permanently?

The TPS62301YZDR automatically transitions from PWM to power-save (PFM) mode below ~10–20 mA load, depending on input/output conditions. The MODE/SYNC pin provides full control: grounding it enables auto-transition, pulling it high forces continuous PWM (for low-noise operation), and applying a 3-MHz clock synchronizes switching. This flexibility allows dynamic optimization of efficiency vs. noise for each TPS62301YZDR use case.