Texas Instruments TPS62693YFDR
- Part No.:
- TPS62693YFDR
- Manufacturer:
- Texas Instruments
- Package:
- 6-XFBGA, DSBGA
- Datasheet:
-
TPS62693YFDR.pdf
- Description:
- IC REG BUCK 2.85V 800MA 6DSBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
TPS62693YFDR from Texas Instruments is a 3-MHz synchronous step-down DC-DC converter optimized for single-cell Li-ion battery-powered portable electronics. It delivers 2.85 V at up to 800 mA, achieves 95% peak efficiency, maintains ±2% DC output voltage accuracy, and operates with 21 µA quiescent current in power-save mode - enabling extended battery life in smartphones and memory cards.
For engineers reviewing the TPS62693YFDR datasheet, TPS62693YFDR pinout, TPS62693YFDR application, or TPS62693YFDR equivalent, key selection criteria include its spread-spectrum PWM dithering for EMI reduction, 6-pin NanoFree™ CSP package, automatic PFM/PWM mode transition, and support for ultra-compact <12 mm² total solution size with only three external components.
Technical Context
The TPS62693YFDR employs a frequency-locked ring oscillator architecture that eliminates traditional compensation loops, delivering instantaneous load/line transient response without requiring external stability components. Its non-linear control scheme enables stable operation across wide ranges of inductor (0.5–1.8 µH) and output capacitance (1–10 µF), while maintaining regulated 3 MHz switching frequency under most conditions.
It integrates active power-down sequencing with internal discharge resistor (120 Ω), supports both auto PFM/PWM mode switching (via MODE = LOW) and forced PWM with spread-spectrum dithering (MODE = HIGH), and features integrated soft-start (350 µs), undervoltage lockout (2.1 V), and thermal shutdown (140 °C) with 10 °C hysteresis.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Output Voltage | Fixed 2.85 V with ±2% total DC accuracy over line/load/temperature - ensures stable core voltage for RF ICs and baseband processors. |
| Max Output Current | 800 mA peak - sufficient to power multi-core application processors or high-speed memory interfaces in compact handheld devices. |
| Switching Frequency | Regulated 3 MHz (±10% spread-spectrum dithering in PWM mode) - enables use of sub-1-mm-height 0402 MLCCs and 2012 chip inductors. |
| Quiescent Current | 21 µA typical in PFM mode - extends battery runtime during standby/sleep states in always-on sensor or connectivity subsystems. |
| Input Voltage Range | 2.3 V to 4.8 V - fully compatible with single-cell Li-ion (3.0–4.2 V nominal) and supports full discharge down to 2.5 V. |
| Package | 6-pin NanoFree™ CSP (YFD), 1.2 mm × 0.8 mm, 0.4 mm pitch - smallest footprint in TI's 800-mA buck family for space-constrained mobile PCBs. |
| PSRR | ≥40 dB from 1 kHz to 10 kHz - suppresses noise from noisy system rails (e.g., USB or PMIC outputs) feeding sensitive analog/RF blocks. |
Pinout & Package
TPS62693YFDR uses a 6-pin NanoFree™ (CSP) package with 0.4 mm pitch and 1.2 mm × 0.8 mm body size. The die-side-up construction places all terminals on the bottom surface in a 2×3 array.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| FB (C1) | Feedback input | Connects directly to VOUT to close regulation loop; internal 450 kΩ divider sets 2.85 V output - no external resistors required. |
| VIN (A2) | Power input | Accepts 2.3–4.8 V supply; requires local 2.2 µF ceramic bypass capacitor (0402) placed adjacent to pin for low-impedance path. |
| SW (B1) | Switch node | Drain connection of internal P/N-MOSFET pair; routes to inductor; must be routed with minimal loop area to reduce EMI. |
| MODE (A1) | Mode control input | Pull LOW for auto PFM/PWM; pull HIGH for forced spread-spectrum PWM - enables dynamic noise-performance trade-off. |
| EN (B2) | Enable input | Active-high logic; 1 V threshold; internal 1.5 µA pull-down - allows direct MCU GPIO control or RC delay for sequencing. |
| GND (C2) | Ground reference | Primary thermal and electrical return; must be connected to solid PCB ground plane beneath CSP for thermal dissipation (θJA = 132.5 °C/W). |
Key Features
| Feature | Design Value |
|---|---|
| Spread-spectrum PWM dithering | ±10% frequency modulation reduces peak EMI by >10 dB - simplifies compliance with FCC Part 15 Class B in cellular handsets. |
| Ultra-low quiescent current | 21 µA in PFM mode - enables >72-hour standby on 100 mAh coin cell when powering low-power IoT sensors. |
| Integrated soft-start | 350 µs controlled ramp - prevents inrush current and output overshoot during power-up of sensitive RF front-ends. |
| Active power-down sequencing | Internal 120 Ω discharge path - ensures rapid VOUT collapse (<1 ms) and prevents back-powering of upstream circuitry. |
| High duty-cycle operation | Supports 100% duty cycle near VIN ≈ VOUT - maintains regulation down to 2.9 V input while delivering 2.85 V output. |
Applications
| Smartphone Application Processor Core Rail | Bluetooth Low Energy (BLE) SoC Power |
|---|---|
Use Scenario: Powers ARM Cortex-A series application processor cores requiring tightly regulated 2.85 V at dynamic loads from 10 mA (idle) to 800 mA (burst). IC Role / Device Role / Timing Role: Primary buck regulator supplying CPU/GPU cores; replaces less efficient LDOs to extend battery life during intensive tasks. Use Value: 95% efficiency at 3 MHz minimizes heat generation in thermally constrained chassis; spread-spectrum mode suppresses switching noise coupling into adjacent RF receivers. | Use Scenario: Supplies 2.85 V to BLE transceivers (e.g., CC2640R2F) during advertising, connection, and data transfer phases with burst currents up to 200 mA. IC Role / Device Role / Timing Role: System-level power rail generator; operates in PFM mode during sleep (21 µA IQ) and transitions seamlessly to PWM during TX/RX bursts. Use Value: Sub-12 mm² solution size fits within tight layout constraints of wearable PCBs; 350 µs soft-start prevents reset glitches during BLE stack initialization. |
| Memory Card Interface (SD/UHS-I) | Mobile Camera ISP Core Supply |
Use Scenario: Provides clean 2.85 V to SD card controllers and UHS-I PHYs during high-speed read/write operations with fast load transients. IC Role / Device Role / Timing Role: Dedicated point-of-load regulator; handles 5–400 mA load steps with <50 µs recovery time per Figure 13. Use Value: ≥40 dB PSRR at 1–10 kHz rejects noise from shared system rails; low ripple (<25 mVPP in PFM) prevents data corruption in high-speed serial links. | Use Scenario: Powers image signal processor (ISP) cores in smartphone camera modules during preview (50 mA) and capture (600 mA) modes. IC Role / Device Role / Timing Role: High-transient-response buck converter; maintains VOUT within ±15 mV during 100–600 mA load steps. Use Value: Best-in-class line/load transient response eliminates frame drop or color shift artifacts; 6-pin CSP enables placement directly under camera flex connector. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar step-down converter applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPS62692YFDR | Fixed 2.2 V output; identical package, pinout, and feature set except output voltage and marking code (TW vs UD). | Suitable for lower-voltage I/O domains (e.g., SDIO, eMMC), not for 2.85 V processor cores. | Select when system requires 2.2 V rail with same size, efficiency, and EMI profile. |
| TPS62694YFDR | Fixed 2.95 V output; same CSP-6 package, MODE/EN/FB/SW/VIN/GND pin mapping; spread-spectrum enabled. | Targets 3.0 V logic families (e.g., certain LPDDR2 interfaces); slightly higher dropout margin than TPS62693YFDR. | Choose for systems needing 2.95 V with identical board layout and thermal performance. |
Compared with TPS62692YFDR and TPS62694YFDR, the TPS62693YFDR provides optimal voltage alignment for 2.85 V LDO-replacement applications in baseband processors and RF transceivers, balancing headroom and efficiency without requiring PCB redesign.
Availability
TPS62693YFDR is available at Aetrix Electronics and suitable for smartphone power management, BLE peripheral design, and mobile camera module development requiring stable component supply, consistent parametric performance, and long-term production continuity.
Supply support for TPS62693YFDR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and power management technologies, with decades of expertise in high-efficiency DC-DC conversion for portable electronics.
The TPS6269x product line was designed specifically for ultra-thin, battery-powered mobile devices requiring sub-1-mm component height, minimal external parts count, and best-in-class light-load efficiency - targeting smartphones, wearables, and wireless sensor nodes.
FAQ
What is the recommended inductor value for TPS62693YFDR in a typical smartphone application?
The TPS62693YFDR datasheet specifies an inductance range of 0.5 µH to 1.8 µH. For optimal balance of size, efficiency, and transient response in smartphone designs, TI recommends the TOKO MDT2012CR1R0 (1.0 µH, 2012 case, 0.8 mm height). This value ensures stable operation across 2.3–4.8 V input and 0–800 mA load while maintaining the 3 MHz switching frequency and supporting the <12 mm² total solution size requirement of the TPS62693YFDR.
Does TPS62693YFDR require external feedback resistors to set the output voltage?
No, the TPS62693YFDR does not require external feedback resistors. It is a fixed-output converter with an internally trimmed 2.85 V regulation point. The FB pin connects directly to the output capacitor node to complete the feedback loop, and the internal voltage divider (450 kΩ) is factory-calibrated to deliver ±2% DC accuracy across temperature and load. This eliminates resistor placement, routing, and tolerance errors - critical for space-constrained mobile PCB layouts.
How does the MODE pin affect EMI performance in TPS62693YFDR?
When the MODE pin is pulled HIGH, the TPS62693YFDR forces fixed-frequency PWM operation with ±10% spread-spectrum dithering, reducing peak conducted and radiated EMI by >10 dB compared to standard PWM. When MODE is LOW, the device automatically switches between PFM (light load) and PWM (heavy load), minimizing average quiescent current but producing narrowband harmonics. Thus, MODE = HIGH is preferred for noise-sensitive RF sections like cellular transceivers, while MODE = LOW maximizes battery life in background tasks.
What thermal derating applies to TPS62693YFDR at 800 mA continuous load?
At 800 mA continuous output current with VIN = 3.6 V and TA = 85 °C, the TPS62693YFDR junction temperature rises approximately 106 °C above ambient (calculated using θJA = 132.5 °C/W and PD ≈ 0.8 W), reaching ~191 °C - exceeding the 150 °C absolute maximum. Therefore, derating is required: at 85 °C ambient, max continuous load is ~550 mA. For full 800 mA operation, ambient must be ≤60 °C or PCB copper area/thermal vias must be increased to reduce effective θJA below 90 °C/W per TI's thermal guidelines.
Can TPS62693YFDR replace an LDO in a noise-sensitive analog rail?
Yes, the TPS62693YFDR is explicitly positioned as an LDO replacement in TI's documentation. With ≥40 dB PSRR from 1–10 kHz, <25 mVPP output ripple in PFM mode, and spread-spectrum PWM capability, it delivers superior power conversion efficiency versus LDOs while meeting noise requirements of analog/RF rails. Its 350 µs soft-start and seamless PFM/PWM transition prevent supply glitches during state changes - making it suitable for powering ADC references, PLL VCOs, or RF synthesizers previously served by inefficient LDOs.
TPS62693YFDR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 6-XFBGA, DSBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Function:
- Step-Down
- Output Configuration:
- Positive
- Topology:
- Buck
- Output Type:
- Fixed
- Number of Outputs:
- 1
- Voltage - Input (Min):
- 2.3V
- Voltage - Input (Max):
- 4.8V
- Voltage - Output (Min/Fixed):
- 2.85V
- Voltage - Output (Max):
- -
- Current - Output:
- 800mA
- Frequency - Switching:
- 3MHz
- Synchronous Rectifier:
- Yes
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 6-DSBGA
TPS62693YFDR FAQ
1.How can I place an order for TPS62693YFDR through Aetrix?
Please submit a Request for Quotation (RFQ) for TPS62693YFDR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TPS62693YFDR reliable?
The price and inventory of TPS62693YFDR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TPS62693YFDR is usually 5 days.
3.What payment methods are accepted for TPS62693YFDR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TPS62693YFDR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TPS62693YFDR?
TPS62693YFDR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TPS62693YFDR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TPS62693YFDR?
For technical support, including TPS62693YFDR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TPS62693YFDR requirements.
6.How does Aetrix verify that TPS62693YFDR is sourced from the original manufacturer or authorized distributors?
All TPS62693YFDR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TPS62693YFDR meets industry standards.
7.What is the process for return or replacement of TPS62693YFDR?
All TPS62693YFDR units undergo pre-shipment inspection (PSI). If there is an issue with TPS62693YFDR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TPS62693YFDR part is unused and in its original packaging.
Return procedure for TPS62693YFDR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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