Texas Instruments TPS630241YFFT
- Part No.:
- TPS630241YFFT
- Manufacturer:
- Texas Instruments
- Package:
- 20-UFBGA, DSBGA
- Datasheet:
-
TPS630241YFFT.pdf
- Description:
- IC REG BUCK BOOST 2.9V 20DSBGA
- Quantity:
- Payment:

- Shipping:

Inventory:250
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Product details
Overview
TPS630241YFFT from Texas Instruments is a fixed-output 2.9 V, high-efficiency synchronous buck-boost DC/DC converter in a 20-pin WCSP (1.766 mm × 2.086 mm) package. It operates across 2.3 V–5.5 V input, delivers up to 1.5 A continuous output current in boost mode, achieves up to 95% efficiency in buck or boost, and features 2.5 MHz switching frequency with 35 µA quiescent current - ideal for space-constrained battery-powered mobile devices.
For engineers reviewing the TPS630241YFFT datasheet, TPS630241YFFT pinout, TPS630241YFFT application, or TPS630241YFFT equivalent, key selection considerations include its fixed 2.9 V output, seamless buck-boost transition, integrated soft-start, true shutdown with output discharge, and thermal/overcurrent protection - all critical for portable power rail design.
Technical Context
The TPS630241YFFT implements a fixed-frequency average current-mode control architecture using four internal N-channel MOSFETs. It automatically selects buck or boost topology based on VIN vs. VOUT, maintaining regulation without discontinuity - one switch remains on and one off at all times to minimize switching losses.
Its dual-supply interface separates power (VIN, PGND) and control (VINA, GND) domains to suppress ground bounce. The PFM/PWM pin enables user-selectable light-load operation: forced PWM (2.5 MHz) or automatic Power Save Mode with dynamic voltage positioning (1.3% over-regulation) and ≤30 mVpk-pk ripple at 20 µF output capacitance.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Output Voltage | Fixed 2.9 V ±1% (PWM mode), ±1.3% (PFM mode) - eliminates external feedback resistors and ensures stable rail for low-voltage logic or RF front-ends. |
| Input Voltage Range | 2.3 V to 5.5 V - supports single-cell Li-ion (2.7–4.2 V), LiFePO₄ (2.0–3.6 V), or USB-powered systems without input pre-regulation. |
| Max Output Current | 1.5 A continuous (boost mode, VIN ≥ 2.5 V) - sufficient for PMIC core rails, display bias, or modem subsystems in smartphones. |
| Efficiency | Up to 95% in buck/boost, 97% at VIN = VOUT - minimizes thermal rise in sealed enclosures and extends battery runtime under dynamic load. |
| Quiescent Current | 35 µA (typical, no switching) - enables >100-day shelf life in always-on IoT sensors powered by coin cells. |
| Switching Frequency | 2.5 MHz (typical, PWM mode) - allows use of compact 0.6–1.0 µH inductors and reduces EMI filtering footprint. |
| Thermal Shutdown | 140 °C (typical) - protects against sustained overload or poor PCB thermal design while permitting safe 125 °C junction operation. |
| Shutdown Current | 0.1–2 µA - ensures negligible battery drain during deep sleep or system off states. |
Pinout & Package
TPS630241YFFT uses a 20-pin Wafer Chip Scale Package (WCSP) with 0.4 mm pitch, nominal body size 1.766 mm × 2.086 mm. Thermal performance is characterized by RθJA = 53.8 °C/W and RθJB = 10.1 °C/W, requiring careful PCB copper pour under the exposed die pad for optimal heat dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VIN (E1–E3) | Power input (power stage) | Primary high-current input path for power switches; must be decoupled near package with low-ESR ceramic capacitor. |
| VINA (E4) | Power input (control stage) | Separate supply for analog/digital control circuitry; improves noise immunity and prevents ground shift during high di/dt switching. |
| VOUT (A1–A3) | Regulated output | Main power rail output; connects directly to load and output capacitors; requires low-ESR bulk + high-frequency ceramic caps. |
| FB (A4) | Feedback reference | Internally tied to VOUT for fixed-output variants; not accessible externally - simplifies layout and eliminates resistor divider errors. |
| L1 (D1–D3) | Inductor connection (buck path) | High-side buck switch node; connects to one terminal of series inductor; carries peak currents up to 3 A. |
| L2 (B1–B3) | Inductor connection (boost path) | Low-side boost switch node; connects to second inductor terminal; shares same inductor as L1 in single-inductor topology. |
| PGND (C1–C3) | Power ground | Return path for high-current power switches; must be routed separately from analog ground and joined at single point near GND pin. |
| GND (C4) | Analog ground | Reference for error amplifier, oscillators, and logic; isolated from PGND to prevent noise coupling into regulation loop. |
| EN (D4) | Enable control | Active-high digital enable; internal pull-down ensures default-off state; drives device into true shutdown with output disconnect. |
| PFM/PWM (B4) | Mode select | Logic-level input: low = automatic PFM/PWM transition, high = forced PWM - enables deterministic EMI profile or ultra-low-noise operation. |
Key Features
| Feature | Design Value |
|---|---|
| Seamless buck-boost transition | Zero-output-voltage-discontinuity operation across VIN = VOUT boundary - maintains uninterrupted power to sensitive loads like RF transceivers during battery discharge. |
| Integrated soft-start | 450 µs (buck) / 700 µs (boost) monotonic output ramp - prevents inrush current damage to input capacitors and avoids brownout in shared supply rails. |
| Output capacitor discharge | 120 Ω internal discharge path activated during shutdown - discharges 20 µF output cap to UVLO threshold in <10 ms, eliminating residual voltage hazards in hot-swap applications. |
| Over-temperature protection | 140 °C thermal shutdown with hysteresis - safeguards silicon integrity during transient overload or inadequate heatsinking without requiring external thermal sensors. |
| True shutdown function | Complete isolation of load from input source - removes leakage paths and guarantees zero static current draw, essential for long-term storage compliance. |
| Wide capacitance selection | Compatible with 16 µF minimum output capacitance using standard X5R/X7R ceramics - accommodates cost-sensitive designs without requiring specialized low-DC-bias caps. |
Applications
| Smartphone Baseband Power | Wearable Sensor Hub Rail |
|---|---|
|
Use Scenario: Powers application processor I/O and memory interfaces in dual-mode smartphones where battery voltage drops from 4.2 V to 2.8 V during discharge. IC Role / Device Role / Timing Role: Primary buck-boost regulator delivering stable 2.9 V rail independent of battery state; manages seamless mode transitions during call/data bursts. Use Value: Eliminates need for separate buck and boost converters, reducing BOM count by 2 ICs and saving >15 mm² PCB area in tight handset layouts. |
Use Scenario: Supplies 2.9 V to ultra-low-power MCU, BLE radio, and environmental sensors in fitness trackers operating from single CR2032 coin cell. IC Role / Device Role / Timing Role: System power manager enabling 35 µA quiescent operation and <2 µA shutdown - extends battery life beyond 12 months between replacements. Use Value: Maintains regulated output down to 2.3 V input, allowing full utilization of coin cell energy (2.0–3.0 V range) without premature system reset. |
| Tablet Display Bias Supply | Industrial Handheld PMIC Core |
|
Use Scenario: Generates 2.9 V bias for OLED display driver ICs in 7-inch tablets, supporting variable brightness and fast frame-rate updates. IC Role / Device Role / Timing Role: High-transient-response power stage handling 0–1.5 A load steps within 10 µs; uses 2.5 MHz PWM mode to suppress audible noise. Use Value: Delivers <30 mVpk-pk ripple in PWM mode, preventing visible flicker or color banding on high-resolution displays. |
Use Scenario: Provides main 2.9 V core rail for ARM-based industrial controller in battery-backed data loggers deployed in remote locations. IC Role / Device Role / Timing Role: Robust power conditioner with overcurrent and thermal protection - sustains operation under 85 °C ambient and repeated short-circuit events. Use Value: Enables reliable field deployment without derating; 125 °C max junction temperature rating supports unventilated enclosures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar buck-boost regulator applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPS630242YFFT | Fixed 3.3 V output (vs. 2.9 V); identical package, pinout, and electrical specs otherwise. | Suitable for 3.3 V microcontrollers, USB peripherals, or legacy logic families requiring higher rail voltage. | Select when system requires 3.3 V instead of 2.9 V; no layout or firmware changes needed. |
| MAX77827BEWL+T | 2.5 V–5.5 V input, adjustable 0.6 V–3.7 V output; 1.2 A max output; 2.2 MHz switching; 20-pin WLP package (2.13 mm × 2.13 mm). | Better suited for multi-rail PMIC integration due to programmable output and I²C interface; lower max current limits peak load capability. | Choose when output voltage flexibility or digital control is required; accept 0.3 mm larger footprint and reduced current headroom. |
Compared with TPS630242YFFT, the TPS630241YFFT provides a lower fixed output optimized for newer low-voltage SoCs, while MAX77827BEWL+T trades fixed-voltage simplicity for programmability and communication - making TPS630241YFFT the preferred choice for cost-sensitive, space-constrained 2.9 V rail generation.
Availability
TPS630241YFFT is available at Aetrix Electronics and suitable for smartphone baseband power, wearable sensor hub rails, tablet display bias supplies, and industrial handheld PMIC cores requiring stable component supply across high-volume production cycles.
Supply support for TPS630241YFFT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and power management technologies, with decades of expertise in high-efficiency DC/DC conversion for portable electronics.
The TPS63024x family was designed specifically for battery-powered mobile devices requiring seamless voltage regulation across wide input ranges - targeting smartphones, tablets, and wearables where size, efficiency, and reliability are non-negotiable.
FAQ
What is the output voltage tolerance of the TPS630241YFFT under varying load and temperature conditions?
The TPS630241YFFT delivers a fixed 2.9 V output with ±1% accuracy in PWM mode and ±1.3% in PFM mode across –40°C to 85°C ambient and 0–1.5 A load. Load regulation is 2.5 mV/A and line regulation is 7.4 mV/V, ensuring stable rail performance even during rapid battery voltage sag or load transients - critical for consistent operation of 2.9 V logic in the TPS630241YFFT's target applications.
Does the TPS630241YFFT require external feedback resistors to set its output voltage?
No, the TPS630241YFFT does not require external feedback resistors. Its 2.9 V output is internally fixed, and the FB pin (A4) is internally connected to VOUT. This eliminates resistor tolerance errors, saves PCB space, and simplifies layout - a key differentiator from adjustable variants like TPS63024 or TPS630242YFFT, where external dividers are mandatory.
How does the TPS630241YFFT handle the transition between buck and boost modes?
The TPS630241YFFT uses an average current-mode controller with real-time VIN–VOUT comparison to automatically and seamlessly switch between buck and boost topologies. No output voltage discontinuity occurs - the device maintains regulation through the crossover region by alternating buck and boost cycles, limiting consecutive same-mode cycles to three. This behavior is intrinsic to the TPS630241YFFT's architecture and requires no external configuration.
What thermal management guidance applies to the TPS630241YFFT in high-power-density layouts?
The TPS630241YFFT has RθJA = 53.8 °C/W and RθJB = 10.1 °C/W. For reliable 1.5 A operation, TI recommends a minimum 100 mm² copper pour under the package connected to PGND via ≥6 thermal vias (0.3 mm diameter). Avoid routing signal traces under the die pad, and ensure GND and PGND connect at a single point near the GND pin (C4) to prevent ground loop noise in the TPS630241YFFT's control loop.
Can the TPS630241YFFT be used with ceramic output capacitors smaller than 22 µF?
Yes - the TPS630241YFFT supports a minimum 16 µF total output capacitance using standard X5R/X7R ceramics. While typical reference designs use two 22 µF capacitors (44 µF total), designs with space constraints may use a single 22 µF + 10 µF combination or three 10 µF units, provided effective capacitance (accounting for DC bias) remains ≥16 µF at rated VOUT. This flexibility is validated in the TPS630241YFFT's recommended operating conditions table.
Is the TPS630241YFFT pin-compatible with other members of the TPS63024x family?
Yes, the TPS630241YFFT shares identical pinout, package (YFF), and footprint with TPS63024 and TPS630242YFFT. All variants use the same 20-pin WCSP layout and electrical interface - only the internal feedback network differs (fixed 2.9 V vs. adjustable vs. fixed 3.3 V). This enables drop-in replacement in existing designs when changing output voltage requirements, without PCB revision.
TPS630241YFFT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 20-UFBGA, DSBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Function:
- Step-Up/Step-Down
- Output Configuration:
- Positive
- Topology:
- Buck-Boost
- Output Type:
- Fixed
- Number of Outputs:
- 1
- Voltage - Input (Min):
- 2.3V
- Voltage - Input (Max):
- 5.5V
- Voltage - Output (Min/Fixed):
- 2.9V
- Voltage - Output (Max):
- -
- Current - Output:
- 2.12A (Switch)
- Frequency - Switching:
- 2.5MHz
- Synchronous Rectifier:
- Yes
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 20-DSBGA
TPS630241YFFT FAQ
1.How can I place an order for TPS630241YFFT through Aetrix?
Please submit a Request for Quotation (RFQ) for TPS630241YFFT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TPS630241YFFT reliable?
The price and inventory of TPS630241YFFT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TPS630241YFFT is usually 5 days.
3.What payment methods are accepted for TPS630241YFFT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TPS630241YFFT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TPS630241YFFT?
TPS630241YFFT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TPS630241YFFT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TPS630241YFFT?
For technical support, including TPS630241YFFT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TPS630241YFFT requirements.
6.How does Aetrix verify that TPS630241YFFT is sourced from the original manufacturer or authorized distributors?
All TPS630241YFFT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TPS630241YFFT meets industry standards.
7.What is the process for return or replacement of TPS630241YFFT?
All TPS630241YFFT units undergo pre-shipment inspection (PSI). If there is an issue with TPS630241YFFT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TPS630241YFFT part is unused and in its original packaging.
Return procedure for TPS630241YFFT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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