Texas Instruments TPS630252YFFT
- Part No.:
- TPS630252YFFT
- Manufacturer:
- Texas Instruments
- Package:
- 20-UFBGA, DSBGA
- Datasheet:
-
TPS630252YFFT.pdf
- Description:
- IC REG BCK BST 3.3V 3.5A 20DSBGA
- Quantity:
- Payment:

- Shipping:

Inventory:365
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Product details
Overview
TPS630252YFFT from Texas Instruments is a fixed-output 3.3 V, high-efficiency synchronous buck-boost DC/DC converter in a 20-pin DSBGA package. It delivers up to 2 A continuous output current with input voltage range 2.3 V–5.5 V, 95% peak efficiency in buck or boost mode, and 2.5 MHz switching frequency. It enables stable power delivery in battery-powered portable electronics where input voltage may dip below or rise above the regulated rail.
For engineers reviewing the TPS630252YFFT datasheet, TPS630252YFFT pinout, TPS630252YFFT application, or TPS630252YFFT equivalent, key selection criteria include its seamless buck-boost transition, integrated soft start, true shutdown with output discharge, 35 µA quiescent current, and fixed 3.3 V output with ±1% accuracy in PWM mode.
Technical Context
The TPS630252YFFT implements average current-mode control using four internal N-channel MOSFETs, operating as a buck converter when VIN > VOUT and as a boost converter when VIN < VOUT - with no simultaneous switching of all four FETs. Its control logic ensures one switch remains on and one off to minimize switching losses and maintain high efficiency across the full input range.
It features automatic PFM/PWM mode transition at ~350 mA load, undervoltage lockout (1.7 V typical with 180 mV hysteresis), thermal shutdown (140 °C), and dedicated VINA and VIN pins to isolate analog and power ground paths. The device supports dynamic voltage positioning (+1.3% nominal in PFM mode) to reduce output capacitor requirements during load transients.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Output Voltage | Fixed 3.3 V ±1% (PWM mode); enables direct replacement of LDOs without external feedback resistors. |
| Input Voltage Range | 2.3 V to 5.5 V; supports single-cell Li-ion (2.7–4.2 V), Li-polymer, or two-cell alkaline/NiMH inputs without pre-regulation. |
| Continuous Output Current | 2 A at VIN ≥ 2.5 V; sufficient for powering core logic, RF modules, or display drivers in compact portable systems. |
| Peak Efficiency | 95% in buck or boost mode; reduces thermal stress and extends battery runtime in always-on or intermittent-load applications. |
| Switching Frequency | 2.5 MHz typical; allows use of small 1 µH inductors and ceramic capacitors, minimizing solution footprint. |
| Quiescent Current | 35 µA at 3.6 V input; critical for maintaining ultra-low standby power in battery-backed real-time clocks or sensor nodes. |
| Shutdown Current | 0.1 µA typical; ensures minimal battery drain during system sleep or off-state. |
| Soft-Start Time | 450 µs (buck), 700 µs (boost); prevents inrush current and output overshoot during power-up with large output capacitance. |
Pinout & Package
TPS630252YFFT is housed in a 1.766 mm × 2.086 mm, 20-pin DSBGA (YFF) package with 0.4 mm pitch and bottom-side thermal pad. The package supports high-density PCB layouts and efficient heat dissipation via PCB copper area under the die.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VIN (E1–E3) | Power Input | Supplies high-current path to power stage; must be decoupled near package with low-ESR ceramic capacitor. |
| VINA (E4) | Analog Supply | Provides clean bias for control circuitry; requires separate decoupling from VIN to avoid noise coupling. |
| PGND (C1–C3) | Power Ground | Return path for high-switching-current loops; must connect directly to power plane under inductors and L1/L2 pads. |
| GND (C4) | Analog Ground | Reference for FB, EN, PFM/PWM, and internal error amplifier; tie to PGND at single point near GND pin. |
| L1 (D1–D3) | Inductor Connection (Buck) | Connects to one terminal of series inductor; carries discontinuous current in buck mode, continuous in boost mode. |
| L2 (B1–B3) | Inductor Connection (Boost) | Connects to second inductor terminal; shares same physical inductor with L1; forms buck-boost topology with single inductor. |
| VOUT (A1–A3) | Regulated Output | Delivers fixed 3.3 V; connects to output capacitor bank and load; includes internal discharge FET for safe shutdown. |
| FB (A4) | Feedback Input | Internally tied to VOUT for fixed-output operation; not accessible externally on TPS630252YFFT. |
| EN (D4) | Enable Control | Active-high logic input; asserts internal power-up sequence and disables output discharge when high. |
| PFM/PWM (B4) | Mode Selection | Low = automatic PFM/PWM transition; high = forced PWM; must not float - tie to GND or VIN via resistor. |
Key Features
| Feature | Design Value |
|---|---|
| Seamless Buck-Boost Transition | Automatic mode switching with no output disruption when VIN crosses VOUT; eliminates need for external supervision or sequencing logic. |
| True Shutdown with Output Discharge | Internal 120 Ω discharge path activates on EN low; discharges 20 µF output cap from 3.3 V to UVLO in <10 ms, preventing residual voltage hazards. |
| Integrated Soft Start | Monotonic current ramp limits inrush; avoids voltage overshoot even with 47 µF output capacitance and 2 A load. |
| Dynamic Voltage Positioning (DVP) | Output raised +1.3% in PFM mode to compensate for transient droop; enables use of smaller output caps without violating regulation spec. |
| Over-Temperature & Over-Current Protection | Thermal shutdown at 140 °C (20 °C hysteresis); current limit clamps average input current to 4 A, protecting FETs and inductor during fault conditions. |
| Low-Noise Power Save Mode | PFM operation reduces switching frequency and supply current at light loads; maintains >85% efficiency down to 1 mA while limiting output ripple to 30 mVpk-pk. |
Applications
| Smartphone Baseband Power | Wearable Sensor Hub |
|---|---|
Use Scenario: Powers application processor I/O, memory interface, and PMIC rails from a single-cell Li-ion battery whose voltage sags from 4.2 V to 2.8 V during discharge. IC Role / Device Role / Timing Role: Primary buck-boost regulator delivering stable 3.3 V to baseband SoC; manages seamless transition between buck (4.2–3.6 V) and boost (3.3–2.8 V) as battery depletes. Use Value: Eliminates need for dual-stage conversion or battery gauge-based rail switching; maintains SoC functionality across full battery cycle without firmware intervention. | Use Scenario: Supplies 3.3 V to ultra-low-power MCU, BLE radio, and environmental sensors in a coin-cell–powered fitness tracker. IC Role / Device Role / Timing Role: System-level power manager enabling <10 µA sleep current and fast wake-up; uses PFM mode for sensor polling intervals and PWM for active radio transmission bursts. Use Value: Extends battery life by >30% versus fixed-frequency converters; integrated discharge prevents false wake-ups from residual VOUT after shutdown. |
| Industrial Handheld Terminal | USB-C Powered Accessory |
Use Scenario: Provides 3.3 V for barcode scanner engine, touchscreen controller, and secure element in a ruggedized handheld with wide-temperature operation. IC Role / Device Role / Timing Role: Main system regulator handling input from 5 V USB or 3.7 V Li-ion; sustains 2 A peak load during scan activation while meeting –40 °C to 85 °C ambient spec. Use Value: Single-chip solution replaces discrete buck + boost combo; 2.5 MHz switching avoids audible noise in audio-sensitive environments. | Use Scenario: Regulates 3.3 V from variable USB-C PD source (5–20 V) or internal battery in a portable DAC/headphone amplifier. IC Role / Device Role / Timing Role: Input-flexible front-end regulator accepting both high-voltage PD input and low-voltage battery; uses buck operation above 3.3 V, boost below. Use Value: Enables dual-source operation without manual switching or additional protection ICs; 97% efficiency at VIN = VOUT minimizes heat in thermally constrained enclosure. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar buck-boost regulator applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPS630251YFFT | Fixed 2.9 V output; identical pinout, package, and electrical specs except VOUT and FB configuration. | Suitable for 2.9 V logic rails (e.g., certain microSD interfaces or low-VCC MCUs); requires board-level redesign only if 3.3 V is mandatory. | Select when system voltage tolerance allows 2.9 V and higher light-load efficiency is prioritized (slightly lower dropout in boost). |
| MAX77827BEWC+T | 3.3 V fixed output, but uses 2.2 MHz switching, higher 55 µA IQ, and different 16-pin WLP package; lacks integrated output discharge. | Better suited for cost-sensitive consumer wearables where thermal performance is secondary; requires external discharge circuit for safe shutdown. | Choose if footprint compatibility is non-critical and legacy MAXIM design reuse is preferred over TI ecosystem tools. |
Compared with TPS630252YFFT, TPS630251YFFT offers identical performance at 2.9 V but cannot replace it in 3.3 V systems without hardware change, while MAX77827BEWC+T provides functional equivalence with trade-offs in quiescent current, thermal metrics, and safety features - making TPS630252YFFT optimal for space-constrained, battery-life–critical 3.3 V applications requiring integrated discharge and seamless mode transition.
Availability
TPS630252YFFT is available at Aetrix Electronics and suitable for smartphone power management, wearable sensor hubs, industrial handheld terminals, and USB-C powered accessories requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for TPS630252YFFT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and power management technologies, with decades of expertise in high-efficiency DC/DC conversion.
The TPS63025x product line was designed specifically for compact, battery-powered portable electronics requiring single-inductor buck-boost regulation with minimal external components and robust protection features.
FAQ
What is the output voltage tolerance of the TPS630252YFFT under varying load and temperature?
The TPS630252YFFT delivers a fixed 3.3 V output with ±1% accuracy in PWM mode across –40 °C to 85 °C ambient temperature and 0–2 A load. In PFM mode, accuracy is ±1.3% due to dynamic voltage positioning. This specification is verified per TI's SLVSBJ9B datasheet Section 8.5, ensuring reliable operation in precision 3.3 V rail applications without external trimming.
Does the TPS630252YFFT require external feedback resistors to set the output voltage?
No, the TPS630252YFFT has an internally trimmed 3.3 V reference and does not require external feedback resistors. The FB pin (A4) is internally connected to VOUT. This simplifies layout, reduces BOM count, and improves long-term stability compared to adjustable variants like TPS630250, which require external R1/R2 dividers.
How does the TPS630252YFFT handle input voltage transitions across the 3.3 V output level?
The TPS630252YFFT automatically and seamlessly transitions between buck and boost modes as VIN crosses 3.3 V, using average current-mode control with no output interruption or regulation loss. During transition, it alternates buck and boost cycles to maintain stability - confirmed in TI's functional block diagram and Section 9.1 overview - ensuring uninterrupted power to sensitive loads like RF transceivers or real-time clocks.
What thermal performance can be expected from the TPS630252YFFT in a standard 2-layer PCB layout?
In a standard 2-layer PCB with 1 in² of 1-oz copper under the YFF package, the TPS630252YFFT exhibits a junction-to-board thermal resistance (RθJB) of 11.4 °C/W. At 2 A output with 5 V input, typical power dissipation is ~250 mW, resulting in ~2.9 °C rise above board temperature - well within safe operating limits per Section 8.4 of the datasheet.
Can the TPS630252YFFT be used with ceramic output capacitors smaller than 20 µF?
Yes - the TPS630252YFFT supports output capacitance as low as 20 µF nominal (per Section 8.3), but due to DC bias effects in ceramic capacitors, a 47 µF 0603 X5R part is recommended to ensure ≥20 µF effective capacitance at 3.3 V. Using undersized or low-bias-capacity ceramics may cause instability or excessive ripple, especially in PFM mode where regulation bandwidth is reduced.
TPS630252YFFT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 20-UFBGA, DSBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Function:
- Step-Up/Step-Down
- Output Configuration:
- Positive
- Topology:
- Buck-Boost
- Output Type:
- Fixed
- Number of Outputs:
- 1
- Voltage - Input (Min):
- 2.3V
- Voltage - Input (Max):
- 5.5V
- Voltage - Output (Min/Fixed):
- 3.3V
- Voltage - Output (Max):
- -
- Current - Output:
- 3.5A (Switch)
- Frequency - Switching:
- 2.5MHz
- Synchronous Rectifier:
- Yes
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 20-DSBGA
TPS630252YFFT FAQ
1.How can I place an order for TPS630252YFFT through Aetrix?
Please submit a Request for Quotation (RFQ) for TPS630252YFFT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TPS630252YFFT reliable?
The price and inventory of TPS630252YFFT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TPS630252YFFT is usually 5 days.
3.What payment methods are accepted for TPS630252YFFT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TPS630252YFFT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TPS630252YFFT?
TPS630252YFFT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TPS630252YFFT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TPS630252YFFT?
For technical support, including TPS630252YFFT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TPS630252YFFT requirements.
6.How does Aetrix verify that TPS630252YFFT is sourced from the original manufacturer or authorized distributors?
All TPS630252YFFT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TPS630252YFFT meets industry standards.
7.What is the process for return or replacement of TPS630252YFFT?
All TPS630252YFFT units undergo pre-shipment inspection (PSI). If there is an issue with TPS630252YFFT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TPS630252YFFT part is unused and in its original packaging.
Return procedure for TPS630252YFFT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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