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Texas Instruments TPS63031DSKTG4

Part No.:
TPS63031DSKTG4
Manufacturer:
Texas Instruments
Category:
Voltage Regulators - DC DC Switching Regulators
Package:
10-WFDFN Exposed Pad
Datasheet:
AetrixTPS63031DSKTG4.pdf
Description:
IC REG BUCK BST 3.3V 900MA 10SON
Quantity:
Payment:
Payment
Shipping:
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Inventory:2,858

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Product details

Overview

TPS63031DSKTG4 from Texas Instruments is a fixed-output 3.3-V, high-efficiency single-inductor buck-boost DC/DC converter with integrated 1-A switches, operating from 1.8 V to 5.5 V input and delivering up to 800 mA in step-down mode (VIN ≥ 3.6 V) and up to 500 mA in boost mode (VIN ≥ 2.4 V), used in portable battery-powered systems such as IP network cameras and blood glucose monitors.

For engineers reviewing the TPS63031DSKTG4 datasheet, TPS63031DSKTG4 pinout, TPS63031DSKTG4 application, or TPS63031DSKTG4 equivalent, key selection considerations include its 3.3-V fixed output, 2.5-mm × 2.5-mm VSON-10 package, automatic buck-boost mode transition, power-save mode operation below ~100 mA, and thermal pad-connected PGND layout requirement.

Technical Context

The TPS63031DSKTG4 implements an average current-mode control architecture with dual-loop regulation (fast current loop + voltage error amplifier), input/output voltage feed-forward for rapid transient response, and four internal N-channel MOSFETs enabling synchronous conversion across all operating modes. It uses separate GND (control reference) and PGND (power switch return) pins to prevent ground shift under high-current switching.

Operation includes undervoltage lockout (1.4–1.6 V on VINA), overtemperature protection (140°C trip with 20°C hysteresis), soft-start limiting inrush current, and automatic mode transition between buck (VIN > VOUT) and boost (VIN < VOUT) without intermediate discontinuous states-maintaining efficiency >90% near VIN ≈ VOUT via minimized RMS switch/inductor current.

Key Specifications

ParameterValue and Actual Design Meaning
Input Voltage Range1.8 V to 5.5 V - supports single-cell Li-ion (2.5–4.2 V), two/three-cell alkaline/NiMH (2.4–4.5 V), and USB-powered systems without external LDO pre-regulation.
Output VoltageFixed 3.3 V ±3% - internally trimmed; FB pin must be shorted to VOUT; eliminates external resistor divider and associated tolerance/error sources.
Max Output Current800 mA at 3.3 V (step-down, VIN = 3.6–5.5 V); 500 mA at 3.3 V (boost, VIN = 2.4–3.3 V) - defines usable load headroom for microcontroller-based peripherals and RF modules.
Switching Frequency2.4 MHz typical (2.2–2.6 MHz range) - enables use of small 1.5-μH inductors and ceramic capacitors; supports external synchronization via PS/SYNC pin.
EfficiencyUp to 96% - achieved via synchronous rectification and optimized gate drive; >85% maintained from 10 mA to full load with power-save enabled.
Quiescent Current35 μA typical (VEN = 3.6 V, VOUT = 3.3 V, IOUT = 0 mA) - extends battery runtime in always-on sensor nodes and low-duty-cycle IoT endpoints.
Thermal ResistanceRθJA = 60.7°C/W (VSON-10) - requires PCB copper pour under exposed thermal pad (connected to PGND) to sustain 800-mA loads at TA = 85°C.

Pinout & Package

TPS63031DSKTG4 is housed in a 2.5-mm × 2.5-mm, 10-pin VSON package (DSK) with an exposed thermal pad connected to PGND. The package supports tape-and-reel delivery (T suffix = 250 units/reel).

Pin/TerminalCircuit RoleDesign Meaning
VOUT (Pin 1)Power outputRegulated 3.3-V supply node; connects directly to load and output capacitor bank; must be decoupled with ≥10 µF ceramic capacitance.
L1 (Pin 4)Inductor connectionHigh-side switch source terminal; connects to one end of 1.5-μH inductor; requires low-inductance routing to minimize EMI.
L2 (Pin 2)Inductor connectionLow-side switch drain terminal; connects to second end of same inductor; forms buck-boost energy transfer path with L1.
PGND (Pin 3)Power groundReturn path for high-current switch paths and inductor; must be tied to exposed thermal pad; separate from logic GND to avoid noise coupling.
VIN (Pin 5)Power stage inputMain battery or input rail connection; supplies high-current path to internal switches; requires local 10-µF ceramic bypass.
VINA (Pin 8)Control stage inputSupplies bias for control circuitry and UVLO monitoring; must meet 1.4–1.6 V UVLO threshold; decoupled with 0.1-µF ceramic.
EN (Pin 6)Enable controlActive-high digital enable; pulls device into shutdown (IS = 0.9 μA max) when low; disconnects load from input during shutdown.
PS/SYNC (Pin 7)Mode controlLow = power-save enabled (variable frequency); high = forced fixed-frequency; external clock input for synchronization to system master clock.
GND (Pin 9)Logic groundReference for EN, PS/SYNC, FB; must connect to PGND at single point near IC to prevent ground bounce in feedback loop.
FB (Pin 10)Feedback senseInternally connected to 3.3-V divider; must be shorted to VOUT for fixed-output operation; open or misconnected causes regulation failure.

Key Features

FeatureDesign Value
Automatic buck-boost mode transitionSeamlessly shifts between step-down and boost topologies as input voltage crosses 3.3 V-no external control or mode pin required; maintains regulation across full battery discharge curve.
Load disconnect during shutdownInternal switches isolate VOUT from VIN when EN = low-prevents battery drain through load leakage paths and enables true zero-IQ system sleep states.
Synchronous 4-switch topologyFour integrated N-MOSFETs eliminate external diodes and reduce conduction losses-enables >90% efficiency at light loads and full load without thermal derating in compact layouts.
Separate GND and PGND pinsPrevents high di/dt switching noise from corrupting control-loop references-critical for stable regulation and low output ripple in noise-sensitive analog/sensor subsystems.
Programmable power-save modeReduces switching frequency at light loads (<100 mA) to maintain >85% efficiency down to 10 mA-extends runtime in intermittently active portable medical and industrial devices.

Applications

Smartphone Power ManagementPortable Media Player

Use Scenario: Regulating 3.3-V supply for application processor I/O, display interface, and audio codec from declining single-cell Li-ion battery (4.2 V → 2.5 V).

IC Role / Device Role / Timing Role: Primary buck-boost power stage providing constant 3.3-V rail independent of battery state-of-charge.

Use Value: Eliminates need for separate buck + boost converters; reduces BOM count by 2 ICs and saves >25 mm² PCB area while maintaining >92% efficiency across full discharge cycle.

Use Scenario: Powering NAND flash memory, SD card controller, and headphone amplifier in handheld audio device using two AA alkaline cells (3.0 V → 1.8 V).

IC Role / Device Role / Timing Role: Single-chip solution generating stable 3.3-V system rail from variable input, supporting burst-mode playback and standby modes.

Use Value: Enables >12-hour playback runtime via 35-μA quiescent current and power-save mode; avoids brownouts during high-current audio bursts due to fast load transient response (<50 μs).

IP Network CameraBlood Glucose Monitor

Use Scenario: Supplying 3.3-V power to image sensor, Wi-Fi SoC, and Ethernet PHY in battery- or PoE-powered surveillance camera with night-vision IR LEDs.

IC Role / Device Role / Timing Role: Central power converter delivering regulated 3.3-V rail while managing dynamic load steps from sensor readout, wireless transmission, and LED activation.

Use Value: Maintains <1% output voltage deviation during 500-mA load transients; thermal design (RθJA = 60.7°C/W) sustains continuous operation at 50°C ambient with minimal heatsinking.

Use Scenario: Providing precise 3.3-V supply to electrochemical sensor front-end, MCU, and LCD driver in handheld medical diagnostic device powered by CR2032 coin cell (3.0 V → 2.0 V).

IC Role / Device Role / Timing Role: Efficient voltage regulator enabling accurate analog measurements by minimizing supply-induced noise and drift.

Use Value: Delivers 3.3-V output with <0.5% load regulation and <0.5% line regulation-ensures sensor ADC accuracy remains within ±0.1% FS across battery life; 0.9-μA shutdown current preserves shelf life.

Equivalent & Alternatives

The following parts are listed as comparable options for similar buck-boost converter applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
TPS63021DSJRSame 3.3-V fixed output, but 2.0-MHz switching frequency and 2-A switches; higher max output current (1.2 A step-down, 800 mA boost); larger 3-mm × 2-mm SON-10 package.Preferred for higher-power loads (e.g., multi-sensor nodes, motor-assisted medical devices) requiring >800 mA sustained current or lower ripple at reduced frequency.Select TPS63021DSJR when output current demand exceeds 800 mA or when board space allows larger package for improved thermal margin.
MAX77827BEWC+T3.3-V fixed output, 2.2-MHz operation, 1.2-A switches; includes I²C programmable features (enable, power-save, fault reporting); 2.1-mm × 1.6-mm WLP-16 package.Suitable for space-constrained, firmware-configurable designs needing telemetry (e.g., battery health monitoring, fault logging) not available on TPS63031DSKTG4.Choose MAX77827BEWC+T when system-level intelligence (I²C control, status flags) justifies added complexity and cost over TPS63031DSKTG4's simplicity.

Compared with TPS63031DSKTG4, TPS63021DSJR offers higher current capability and relaxed thermal constraints but occupies more PCB area, while MAX77827BEWC+T adds digital configurability and ultra-compact packaging at the expense of analog-only simplicity and lower unit cost.

Availability

TPS63031DSKTG4 is available at Aetrix Electronics and suitable for portable medical devices, battery-powered IP cameras, and handheld consumer electronics requiring stable component supply, long-term lifecycle support, and consistent parametric performance across production batches.

Supply support for TPS63031DSKTG4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, designing and manufacturing analog, embedded processing, and silicon technologies for industrial, automotive, and personal electronics markets.

The TPS6303x product line delivers highly integrated, small-footprint buck-boost converters targeting space- and efficiency-critical portable battery-powered applications-including medical diagnostics, wearables, and smart sensors-where input voltage varies widely across battery discharge curves.

FAQ

What is the recommended input capacitor configuration for TPS63031DSKTG4?

A minimum 10-μF X7R ceramic capacitor (0603 or larger) must be placed as close as possible between VIN and PGND pins of the TPS63031DSKTG4 to suppress high-frequency switching noise and stabilize input voltage during load transients. TI also recommends adding a 0.1-μF ceramic capacitor between VINA and GND to decouple the control-stage supply and prevent UVLO false triggering. Total input capacitance should not fall below 4.7 μF.

Can TPS63031DSKTG4 operate with an input voltage below 1.8 V?

No. The TPS63031DSKTG4 has a specified minimum input voltage of 1.8 V under recommended operating conditions. Its undervoltage lockout (UVLO) threshold on VINA is 1.4–1.6 V, and start-up requires ≥1.6 V (typical). Operation below 1.8 V risks failure to regulate or erratic behavior; for sub-1.8-V inputs, consider TI's TPS63802 or alternative ultra-low-VIN buck-boost solutions.

How is the FB pin used on TPS63031DSKTG4?

On the TPS63031DSKTG4-which provides a fixed 3.3-V output-the FB pin must be directly shorted to the VOUT pin. This connects the internal trimmed resistive divider to the output, enabling accurate regulation. Leaving FB floating or connecting it to an external resistor network will cause incorrect or unstable output voltage. The FB pin input impedance is 1 MΩ when EN is high.

Does TPS63031DSKTG4 require external compensation components?

No. The TPS63031DSKTG4 uses internal compensation optimized for its average current-mode control architecture and standard 1.5-μH inductor. No external compensation network (e.g., RC filters on FB or compensation pins) is needed or supported. Stability is guaranteed with the recommended external components: 1.5-μH inductor, 10-μF input cap, 10-μF output cap, and 0.1-μF VINA bypass.

What thermal design guidance applies to TPS63031DSKTG4 in continuous 800-mA operation?

For continuous 800-mA output at 3.3 V with 3.6-V input, the TPS63031DSKTG4 dissipates ~250 mW. With RθJA = 60.7°C/W, this yields ~15°C rise above ambient. To ensure reliable operation at TA = 85°C, provide ≥100 mm² of 2-oz copper connected to the exposed thermal pad (tied to PGND) and minimize trace resistance between PGND pins and pad. Avoid covering the thermal pad with solder mask.

TPS63031DSKTG4 Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
-
Package/Case:
10-WFDFN Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Function:
Step-Up/Step-Down
Output Configuration:
Positive
Topology:
Buck-Boost
Output Type:
Fixed
Number of Outputs:
1
Voltage - Input (Min):
1.8V
Voltage - Input (Max):
5.5V
Voltage - Output (Min/Fixed):
3.3V
Voltage - Output (Max):
-
Current - Output:
900mA (Switch)
Frequency - Switching:
2.4MHz
Synchronous Rectifier:
Yes
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
10-SON (2.5x2.5)

TPS63031DSKTG4 FAQ

1.How can I place an order for TPS63031DSKTG4 through Aetrix?

Please submit a Request for Quotation (RFQ) for TPS63031DSKTG4 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TPS63031DSKTG4 reliable?

The price and inventory of TPS63031DSKTG4 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TPS63031DSKTG4 is usually 5 days.

3.What payment methods are accepted for TPS63031DSKTG4?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TPS63031DSKTG4 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TPS63031DSKTG4?

TPS63031DSKTG4 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TPS63031DSKTG4 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TPS63031DSKTG4?

For technical support, including TPS63031DSKTG4 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TPS63031DSKTG4 requirements.

6.How does Aetrix verify that TPS63031DSKTG4 is sourced from the original manufacturer or authorized distributors?

All TPS63031DSKTG4 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TPS63031DSKTG4 meets industry standards.

7.What is the process for return or replacement of TPS63031DSKTG4?

All TPS63031DSKTG4 units undergo pre-shipment inspection (PSI). If there is an issue with TPS63031DSKTG4, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TPS63031DSKTG4 part is unused and in its original packaging.

Return procedure for TPS63031DSKTG4:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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