Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Texas Instruments TPS631012YBGR

Part No.:
TPS631012YBGR
Manufacturer:
Texas Instruments
Category:
Voltage Regulators - DC DC Switching Regulators
Package:
8-XFBGA, DSBGA
Datasheet:
AetrixTPS631012YBGR.pdf
Description:
IC REG BUCK BST ADJ 1.5A 8DSBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,168

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

TPS631012YBGR from Texas Instruments is a 1.6V–5.5V input, I²C-programmable buck-boost DC/DC converter in wafer chip-scale package (WCSP), delivering up to 1.5A output at 3.3V with VIN ≥ 2.7V, 2MHz fixed-frequency switching, and seamless mode transition between buck, boost, and 3-cycle buck-boost operation. It serves as a system pre-regulator in space-constrained portable electronics.

For engineers reviewing the TPS631012YBGR datasheet, TPS631012YBGR pinout, TPS631012YBGR application, or TPS631012YBGR equivalent, key selection criteria include its 8μA quiescent current in power-save mode, I²C address 0x2A, default CONVERTER_EN = 0, 1.803mm × 0.905mm WCSP footprint, and support for dynamic voltage scaling with 25mV output steps.

Technical Context

This constant-frequency peak-current-mode buck-boost converter uses a four-switch architecture with independent LX1 (buck stage) and LX2 (boost stage) switching nodes, enabling forward and reverse current operation and start-up into pre-biased outputs. Its 2MHz switching frequency and seamless mode transitions minimize output voltage ripple during VIN ≈ VOUT conditions.

The device integrates I²C interface (Standard/Fast/Fast-Plus modes), programmable soft-start ramp time (6.42–8.68ms), fast DVS slew rate (7.2 V/ms), and configurable PFM/FPWM operation. Protection includes overcurrent, short-circuit hiccup (9ms on / 22ms off), thermal shutdown (160°C), and input/output overvoltage protection.

Key Specifications

ParameterValue and Actual Design Meaning
Input Voltage Range1.6V to 5.5V - supports single-cell Li-ion, Li-poly, or multi-cell alkaline/NiMH sources without external LDO pre-regulation.
Output Voltage Range1.0V to 5.5V adjustable in 25mV steps - enables precise rail tuning for SoCs, sensors, and RF modules via I²C register VOUT.
Max Output Current1.5A @ VIN ≥ 2.7V, VOUT = 3.3V - sufficient for TWS earbud main rails, fingerprint sensors, and optical module biasing.
Quiescent Current8μA into VOUT - maintains ultra-low standby power in always-on sensor nodes and wearables.
Switching Frequency1.8–2.2MHz (typ. 2MHz) - allows use of tiny 1µH inductors and compact ceramic capacitors for minimal PCB area.
I²C Address0x2A (7-bit) - enables direct integration with microcontrollers supporting Standard (100kHz), Fast (400kHz), or Fast-Plus (1MHz) modes.
Default EN StateCONVERTER_EN = 0 - requires explicit I²C write or external EN pin assertion to enable output, preventing unintended power-up.

Pinout & Package

TPS631012YBGR uses an 8-pin wafer chip-scale package (WCSP) with 0.4mm pitch and nominal body size 1.803mm × 0.905mm. The package is bottom-soldered with solder bumps; no exposed thermal pad.

Pin/TerminalCircuit RoleDesign Meaning
VINPower InputMain supply input (1.6–5.5V); connects to input capacitor and battery or source rail.
ENDigital InputActive-high enable; must be pulled high (>1.2V) to activate device; defaults to disabled (CONVERTER_EN=0).
LX1Power Switch NodeBuck-stage inductor connection point; carries high di/dt switching current during buck operation.
SDAI²C Data LineOpen-drain bidirectional data line; requires external pull-up resistor to I²C bus voltage (1.8V–5.5V).
LX2Power Switch NodeBoost-stage inductor connection point; carries high di/dt switching current during boost operation.
GNDPower GroundPrimary return path for power stages and internal circuitry; must be low-impedance and thermally coupled to PCB ground plane.
VOUTPower OutputRegulated output rail; supports active discharge when EN is low or CONVERTER_EN=0.
SCLI²C Clock LineOpen-drain clock input; requires external pull-up resistor; synchronizes all I²C read/write transfers.

Key Features

FeatureDesign Value
Seamless Buck-Boost Mode TransitionEliminates output voltage glitches during VIN ≈ VOUT by defining fixed duty-cycle thresholds and avoiding mode toggling within hysteresis bands.
Programmable Dynamic Voltage Scaling (DVS)EN_FAST_DVS bit enables 7.2 V/ms output slew rate - critical for rapid SoC core voltage scaling during performance state transitions.
Configurable Soft-Start Ramp TimeTD_RAMP bits in CONTROL2 set ramp duration from 6.42ms to 8.68ms - prevents inrush current damage to input capacitors and downstream loads.
Reverse Current Operation SupportEnables controlled current flow from VOUT to VIN in FPWM mode - essential for power multiplexing and battery backup architectures.
Integrated Short-Circuit Hiccup ProtectionEN_SCP=1 activates 9ms on / 22ms off cycling - limits average power dissipation during sustained overload while preserving thermal integrity.

Applications

Wireless Earbuds (TWS)Smart Lock Fingerprint Sensors

Use Scenario: Power management for dual-core Bluetooth audio SoC and MEMS microphone in compact earbud housing.

IC Role / Device Role / Timing Role: Primary system pre-regulator converting 3.0–4.2V battery to stable 3.3V/1.8V rails with <10ms startup and <100mV load transient deviation.

Use Value: 1.5A capability and 8μA quiescent current extend battery life >20% vs. legacy buck-only solutions while fitting sub-10mm² PCB area.

Use Scenario: Biometric authentication module requiring fast wake-up, low-noise bias, and secure power sequencing.

IC Role / Device Role / Timing Role: Voltage stabilizer generating 2.8V analog rail for fingerprint sensor IC with programmable DVS for adaptive sensing resolution.

Use Value: I²C-controlled output adjustment and 2MHz switching suppress noise coupling into sensitive analog front-end, improving SNR by ≥6dB.

IP Network Camera ModulesOptical Transceiver Bias Rails

Use Scenario: Compact PoE-powered camera node with image sensor, ISP, and Wi-Fi MCU operating across wide ambient temperature range.

IC Role / Device Role / Timing Role: Point-of-load regulator converting 5V PoE-derived rail to 1.2V core and 3.3V I/O supplies with thermal foldback above 125°C.

Use Value: Seamless buck-boost operation maintains regulation during PoE voltage sag (down to 3.8V), preventing video frame drops during network congestion.

Use Scenario: SFP+/QSFP+ pluggable transceivers needing precise, low-noise bias for laser drivers and TIAs in datacom equipment.

IC Role / Device Role / Timing Role: Secondary voltage stabilizer generating 3.3V from variable 3.1–5.5V host board supply with <1% output tolerance and <20mV ripple.

Use Value: 2MHz fixed-frequency operation avoids interference with 10G/25G serial data lanes; WCSP package minimizes parasitic inductance for clean high-speed signaling.

Equivalent & Alternatives

The following parts are listed as comparable options for similar buck-boost converter applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
TPS631013YBGRSame silicon, identical specs, but default CONVERTER_EN = 1 (output enabled at power-up)Preferred where immediate rail availability is required without I²C initialization (e.g., simple MCU systems)Select TPS631013YBGR if default-on behavior simplifies firmware boot sequence; otherwise retain TPS631012YBGR for controlled power sequencing.
MAX77827BEWL+T2.5–5.5V input, 0.6–3.7V output, 2A max, I²C, 2.2MHz, WLP-20 package (2.13×1.53mm)Higher input min, narrower VOUT range, larger footprint; lacks reverse current operation and pre-biased start-upChoose MAX77827BEWL+T only if wider input range is unnecessary and board layout accommodates larger package; TPS631012YBGR offers superior flexibility in ultra-compact designs.

Compared with TPS631013YBGR, TPS631012YBGR provides safer default-off behavior for systems requiring strict power sequencing; compared with MAX77827BEWL+T, it delivers smaller size, broader input/output range, and advanced features like reverse current handling-critical for next-gen portable and optical modules.

Availability

TPS631012YBGR is available at Aetrix Electronics and suitable for wireless earbuds, fingerprint sensor modules, and optical transceiver biasing requiring stable component supply, long-term lifecycle support, and traceable sourcing.

Supply support for TPS631012YBGR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and power management technologies, with decades of expertise in high-efficiency DC/DC conversion.

The TPS6310xx family was designed specifically for ultra-compact, battery-powered applications demanding high efficiency across wide input ranges-including true wireless stereo, biometric sensors, and optical communication modules.

FAQ

What is the default I²C address of the TPS631012YBGR?

The TPS631012YBGR has a fixed 7-bit I²C target address of 0x2A. This address is hard-coded and cannot be changed via pins or registers. It is shared with the TPS631013YBGR but differs from TPS6310121 (0x28), TPS6310122 (0x29), and TPS6310123 (0x2B). All variants support Standard, Fast, and Fast-Plus I²C modes.

Does the TPS631012YBGR support start-up into a pre-biased output?

Yes, the TPS631012YBGR supports start-up into a pre-biased output. Its peak-current-mode control architecture and dedicated soft-start logic allow safe ramping of VOUT even when the output capacitor is initially charged. This eliminates output voltage overshoot and prevents reverse current injection into upstream sources during cold-boot scenarios.

What is the maximum output current capability of the TPS631012YBGR at 3.3V output?

The TPS631012YBGR delivers up to 1.5A continuous output current at VOUT = 3.3V when VIN ≥ 2.7V. At VIN ≥ 3V, it supports 2A. These values assume proper thermal management (e.g., 2oz copper, thermal vias) and recommended external components (1µH inductor, ≥10.4µF CO). Peak switch current is rated at 3A typical.

How does the TPS631012YBGR handle reverse current flow?

The TPS631012YBGR supports controlled reverse current flow (VOUT → VIN) in forced PWM (FPWM) mode, independent of VIN/VOUT ratio. This enables use in power-multiplexed systems and battery-backup configurations. Reverse current is limited by the internal sink current limit and disabled in PFM mode to preserve efficiency.

Is the TPS631012YBGR pin-compatible with other devices in the TPS6310xx family?

Yes, all TPS6310xx variants-including TPS631012YBGR, TPS631013YBGR, and TPS631012X (X=1,2,3)-share identical 8-pin YBG WCSP packaging, pinout, and mechanical footprint. They differ only in default CONVERTER_EN state and I²C address, making them drop-in replacements for layout purposes.

TPS631012YBGR Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
-
Package/Case:
8-XFBGA, DSBGA
Packaging:
Tape & Reel (TR)
Product Status:
Active
Function:
Step-Up/Step-Down
Output Configuration:
Positive
Topology:
Buck-Boost
Output Type:
Adjustable
Number of Outputs:
1
Voltage - Input (Min):
1.6V
Voltage - Input (Max):
5.5V
Voltage - Output (Min/Fixed):
1V
Voltage - Output (Max):
5.5V
Current - Output:
1.5A
Frequency - Switching:
2MHz
Synchronous Rectifier:
No
Operating Temperature:
-40°C ~ 125°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-DSBGA (1.6x1.1)

TPS631012YBGR FAQ

1.How can I place an order for TPS631012YBGR through Aetrix?

Please submit a Request for Quotation (RFQ) for TPS631012YBGR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TPS631012YBGR reliable?

The price and inventory of TPS631012YBGR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TPS631012YBGR is usually 5 days.

3.What payment methods are accepted for TPS631012YBGR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TPS631012YBGR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TPS631012YBGR?

TPS631012YBGR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TPS631012YBGR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TPS631012YBGR?

For technical support, including TPS631012YBGR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TPS631012YBGR requirements.

6.How does Aetrix verify that TPS631012YBGR is sourced from the original manufacturer or authorized distributors?

All TPS631012YBGR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TPS631012YBGR meets industry standards.

7.What is the process for return or replacement of TPS631012YBGR?

All TPS631012YBGR units undergo pre-shipment inspection (PSI). If there is an issue with TPS631012YBGR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TPS631012YBGR part is unused and in its original packaging.

Return procedure for TPS631012YBGR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

TPS631012YBGR Tags

  • TPS631012YBGR
  • TPS631012YBGR PDF
  • TPS631012YBGR Datasheet
  • TPS631012YBGR Specifications
  • TPS631012YBGR Images
  • Texas Instruments
  • Texas Instruments TPS631012YBGR
  • Buy TPS631012YBGR
  • TPS631012YBGR Price
  • TPS631012YBGR Distributor
  • TPS631012YBGR Supplier
  • TPS631012YBGR Wholesale
Related Products
TPS562201DDCR
TPS562201DDCR

Texas Instruments

MC34063ABD-TR
MC34063ABD-TR

STMicroelectronics

TPS561201DDCR
TPS561201DDCR

Texas Instruments

MC33063ADR
MC33063ADR

Texas Instruments

MC34063ADR
MC34063ADR

Texas Instruments

TPS560200DBVR
TPS560200DBVR

Texas Instruments

AP3012KTR-G1
AP3012KTR-G1

Diodes Incorporated

TLV61048DBVR
TLV61048DBVR

Texas Instruments

AZ34063UMTR-G1
AZ34063UMTR-G1

Diodes Incorporated

TPS562200DDCR
TPS562200DDCR

Texas Instruments

AP62300TWU-7
AP62300TWU-7

Diodes Incorporated

MC34063EBD-TR
MC34063EBD-TR

STMicroelectronics

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER