Texas Instruments TPS63811YFFR

Overview

TPS63811YFFR from Texas Instruments is a 2.5-A I²C-programmable buck-boost DC/DC converter in a 2.3 mm × 1.4 mm DSBGA package, supporting 2.2 V–5.5 V input and 1.8 V–5.2 V output with dynamic voltage scaling via VSEL pin and register control. It delivers up to 2.5 A at 3.3 V output with ≥2.5 V input and enables true load disconnect, forward/reverse current operation, and start-up into pre-biased outputs - used in smartphone power rails and TWS earphone SoC supplies.

For engineers reviewing the TPS63811YFFR datasheet, TPS63811YFFR pinout, TPS63811YFFR application, or TPS63811YFFR equivalent, key selection considerations include I²C-configurable output voltage range (1.8–5.2 V), programmable ramp-rate DVS, forced-PWM vs. power-save mode trade-offs, thermal performance (R_θJA = 80.5°C/W), and dual-register voltage selection with VSEL pin toggling.

Technical Context

The TPS63811YFFR uses peak-current-mode control with constant off-time architecture and automatically transitions between buck, boost, and 4-cycle buck-boost modes based on precise VI/VO thresholds - eliminating ripple-inducing mode toggling. Its four-switch synchronous topology supports bidirectional current flow and defined soft-start with programmable current-limit ramp.

Control is implemented via two 7-bit I²C-accessible VOUT registers (VOUT1/VOUT2), selected by the VSEL pin, enabling dynamic voltage scaling with configurable slew rates (±1 to ±10 V/ms). The device integrates overtemperature (150°C trip), overvoltage (5.7 V reverse OVP), and UVLO (2.1 V threshold, 200 mV hysteresis) protection with true load disconnect during shutdown.

Key Specifications

Pinout & Package

TPS63811YFFR uses a 15-ball DSBGA (YFF) package measuring 2.3 mm × 1.4 mm with 0.4-mm pitch. The package supports bottom-side thermal dissipation via AGND/GND balls and is optimized for ultra-compact portable applications.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar buck-boost converter applications.

Compared with TPS63811YFFR, TPS63810YFFR removes I²C programmability but simplifies firmware integration, while MP28164GQ-Z increases current headroom at the expense of DVS precision and thermal efficiency in sub-1-A loads.

Availability

TPS63811YFFR is available at Aetrix Electronics and suitable for smartphone system pre-regulators, TWS earphone SoC supplies, and medical hearing aid power management requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for TPS63811YFFR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog and embedded processing technologies, with decades of expertise in power management IC design and manufacturing.

The TPS6381x product line was engineered specifically for ultra-compact, high-efficiency buck-boost conversion in battery-powered portable electronics - emphasizing minimal solution size, dynamic voltage scaling, and robust operation across wide input/output ranges.

FAQ

What is the default output voltage configuration of the TPS63811YFFR at power-up?

The TPS63811YFFR powers up in disabled state with output voltage unprogrammed. Unlike the TPS63810YFFR, it requires I²C initialization to set VOUT1/VOUT2 registers before enabling EN. Default output is undefined until first write to the VOUT registers - this ensures deterministic behavior in systems where voltage must be explicitly configured per application requirements. The TPS63811YFFR does not ship with factory-set voltages.

Can the TPS63811YFFR operate with only two external components?

No - the TPS63811YFFR requires four minimum external components: one input capacitor (≥5 µF), one output capacitor (≥13 µF), one 0.47-µH inductor, and one VSEL pull-up/down resistor. While the IC integrates power switches, drivers, and control logic, omitting any of these compromises stability, efficiency, or safety. The "solution size < 20 mm²" claim assumes all four components are placed optimally on a 2-layer PCB with proper thermal vias.

Does the TPS63811YFFR support reverse current flow from VOUT to VIN?

Yes - the TPS63811YFFR supports bidirectional current operation: it can both source current (VIN → VOUT) and sink current (VOUT → VIN) under defined conditions. Reverse current limiting is implemented with dedicated circuitry, offering –0.35 A to –1.3 A sink capability depending on operating mode. This enables safe operation during battery charging, regenerative braking in wearables, or system-level power arbitration - confirmed in Section 7.5 Electrical Characteristics and Figure 11–12 of the datasheet.

How does the VSEL pin interact with I²C programming on the TPS63811YFFR?

The VSEL pin selects between two independently programmable I²C registers (VOUT1 and VOUT2) - it does not override them. When VSEL = low, the VOUT1 register value sets the output; when VSEL = high, VOUT2 is active. Both registers can be updated dynamically via I²C while the device operates, and VSEL transitions trigger a controlled DVS ramp per the SLEW bits. This dual-register + pin-select architecture enables hardware-fast voltage switching without firmware intervention, unlike single-register alternatives.

What thermal derating applies to the TPS63811YFFR at 85°C ambient temperature?

At 85°C ambient, the TPS63811YFFR's maximum sustainable output current drops due to junction temperature limits. With R_θJA = 80.5°C/W, 2.5 A load generates ~200°C rise above ambient - exceeding the 125°C max TJ. Derated output is ~1.5 A with 2-layer PCB and 1-in² copper pour, or ~2.0 A with 4-layer board and thermal vias. Actual derating must be verified per layout using TI's TPS63811 thermal calculator tool and measured junction temperature under real load conditions.