Texas Instruments TPS65010RGZR

Overview

TPS65010RGZR from Texas Instruments is a highly integrated power and battery management IC for single-cell Li-Ion/Li-Polymer systems, featuring a linear charger (1-A max), dual step-down converters (1-A VMAIN @ 95%, 400-mA VCORE @ 90%), two 200-mA LDOs, I²C interface, thermal shutdown, and programmable power sequencing - deployed in PDA and smartphone baseband processor power rails.

For engineers reviewing the TPS65010RGZR datasheet, TPS65010RGZR pinout, TPS65010RGZR application, or TPS65010RGZR equivalent, this page delivers verified functional architecture, validated pin roles, confirmed operating ranges (e.g., VMAIN: 2.5–3.3 V, VCORE: 0.85–1.6 V), real-world sequencing behavior (PS_SEQ-controlled startup), and direct alternative comparisons for Li-ion portable system design.

Technical Context

The TPS65010RGZR integrates autonomous dual-input (AC/USB) linear charging with current-sense-based termination, dual synchronous 1.25-MHz step-down regulators using internal P/N-channel MOSFETs (rDS(on): 110/210 mΩ for VMAIN; 275/530 mΩ for VCORE), and serially enabled 200-mA LDOs supporting input range 1.8–6.5 V. All regulators enter low-power mode at light load to maintain efficiency across 10 µA–1 A output range.

Its I²C interface (100/400 kHz) enables dynamic voltage selection (DEFCORE/DEFMAIN pins set default VMAIN/VCORE), LOW_PWR-triggered core voltage scaling, GPIO control, and fault reporting via INT/PWRFAIL open-drain outputs. Thermal shutdown (160°C) and UVLO (2.5 V nominal, ±3%) ensure safe operation under battery fault or input collapse.

Key Specifications

Pinout & Package

TPS65010RGZR is housed in a 48-pin VQFN package (7.0 mm × 7.0 mm) with exposed thermal pad connected to PGND. The package supports high-density layout and efficient heat dissipation via bottom-side thermal pad soldering to PCB ground plane.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar power and battery management applications.

Compared with TPS65010RGZR, TPS65020RGZR adds a third LDO and improves thermal resistance but changes pin assignment, while BQ24032ARHLR provides focused charging functionality without integrated conversion - making TPS65010RGZR optimal for compact, self-contained Li-ion PMIC applications requiring dual buck + dual LDO + charger in one die.

Availability

TPS65010RGZR is available at Aetrix Electronics and suitable for PDA, smartphone baseband, digital still camera, and internet audio player designs requiring stable component supply, long-lifecycle support, and full traceability for industrial and consumer electronics production.

Supply support for TPS65010RGZR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and power management technologies, with decades of expertise in battery-powered system solutions.

The TPS65010RGZR belongs to TI's portable power management IC family, designed specifically for single-cell Li-ion systems in space-constrained, battery-life-critical applications such as handheld computing and mobile communications.

FAQ

What is the maximum supported charge current for the TPS65010RGZR?

The TPS65010RGZR supports up to 1000 mA charge current when powered from an AC adapter (4.5–5.5 V), programmable via the external ISET resistor. For USB input (4.35–5.25 V), maximum current is 500 mA (configurable to 100 mA for USB 2.0 compliance). Current accuracy is maintained within ±10% across temperature and input voltage variations per datasheet Section 6.6.

Does the TPS65010RGZR support automatic power-source selection between AC and USB inputs?

Yes, the TPS65010RGZR features autonomous power-source selection: it continuously monitors AC and USB inputs and automatically selects the higher valid voltage source for charging. No host processor intervention or firmware control is required - the decision is made internally based on input voltage thresholds and presence detection.

Can the TPS65010RGZR generate different output voltages for VCORE and VMAIN?

Yes, the TPS65010RGZR supports configurable outputs: VMAIN is factory-set to either 3.0 V or 3.3 V via DEFMAIN pin (0 = 3.0 V, 1 = 3.3 V); VCORE is selectable across eight values from 0.85 V to 1.6 V via DEFCORE and I²C register writes. Both rails use internal feedback loops with ±3% output accuracy over temperature and load.

How does the LOW_PWR pin affect the TPS65010RGZR's operation?

When the LOW_PWR pin is asserted (logic high), the TPS65010RGZR reduces the VCORE output voltage to a predefined lower level (e.g., 1.2 V) or disables it entirely, depending on register configuration. This feature enables deep-sleep modes in processors, reducing system quiescent current to ~70 µA while maintaining state retention in SRAM.

Is the TPS65010RGZR compatible with standard I²C timing specifications?

Yes, the TPS65010RGZR complies with standard I²C timing: it supports 100 kHz (standard mode) and 400 kHz (fast mode) clock frequencies, with specified setup/hold times (e.g., tsu(DATA) ≥ 100 ns, th(DATA) = 0 ns) and rise/fall time limits (≤300 ns). External pull-up resistors must be sized per bus capacitance to meet these requirements.