Texas Instruments TPS65010RGZRG4
- Part No.:
- TPS65010RGZRG4
- Manufacturer:
- Texas Instruments
- Category:
- Battery Chargers
- Package:
- 48-VFQFN Exposed Pad
- Datasheet:
-
TPS65010RGZRG4.pdf
- Description:
- IC BATT CHG LI-ION 1CELL 48VQFN
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
TPS65010RGZRG4 from Texas Instruments is a highly integrated power and battery management IC for single-cell Li-Ion/Li-Polymer systems, featuring a linear charger (1-A AC/500-mA USB), dual step-down converters (1-A VMAIN @ 95%, 400-mA VCORE @ 90%), two 200-mA LDOs, I²C interface, thermal shutdown, and programmable power sequencing - deployed in PDAs, smartphones, and digital still cameras.
For engineers reviewing the TPS65010RGZRG4 datasheet, TPS65010RGZRG4 pinout, TPS65010RGZRG4 application, or TPS65010RGZRG4 equivalent, this page delivers verified functional roles, validated pin functions, confirmed operating ranges (e.g., VMAIN: 2.5–3.3 V, VCORE: 0.85–1.6 V), real-world sequencing behavior (PS_SEQ-controlled startup), and accurate alternative part comparisons grounded in TI's official documentation and electrical specifications.
Technical Context
The TPS65010RGZRG4 implements autonomous dual-input (AC/USB) charging with external resistor-programmable current (ISET), precision voltage regulation (±3% LDO accuracy, 1% VREF), and adaptive light-load mode in both 1.25-MHz synchronous buck converters to sustain efficiency across 10 mA–1 A loads. Its I²C interface (100/400 kHz) enables dynamic voltage scaling (DEFCORE/DEFMAIN), LDO enable control, and fault reporting via INT/PWRFAIL.
Power sequencing is managed through PS_SEQ and LOW_PWR inputs, enabling deep-sleep core voltage reduction (to 1.5 V or 1.6 V) and coordinated power-up/down of VMAIN, VCORE, and LDOs. Thermal protection (160°C shutdown), UVLO (2.5 V threshold), and battery cover detection (BATT_COVER) provide system-level safety without external circuitry.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Charger Type | Linear charger supporting 1-A AC adapter input (4.5–5.5 V) and 500-mA USB input (4.35–5.25 V), with precharge, constant-current, and constant-voltage stages. |
| VMAIN Converter | 1-A, 95% efficient step-down converter with fixed 3.0 V or 3.3 V output, 1.25-MHz switching frequency, and ±3% load regulation (0–1000 mA). |
| VCORE Converter | 400-mA, 90% efficient step-down converter with programmable 0.85–1.6 V output (in 0.1-V steps), ±3% accuracy, and 0.002%/mA load regulation. |
| LDO Outputs | Two 200-mA LDOs (VLDO1/VLDO2); VLDO1 adjustable via external divider (0.9–VIN), VLDO2 fixed at 1.8–3.0 V; dropout ≤300 mV @ 200 mA. |
| I²C Interface | Fully compliant I²C bus (100/400 kHz), supporting register read/write for voltage configuration, status monitoring, and fault flag clearing. |
| Quiescent Current | 70 µA typical total supply current in active mode; 15–25 µA in shutdown (BATT_COVER = GND), enabling long battery standby. |
| Thermal Protection | Integrated thermal shutdown at 160°C (TSD), with 20°C hysteresis; PWRFAIL asserts low 1.68–3.2 ms before supply disable on overtemperature. |
Pinout & Package
TPS65010RGZRG4 is housed in a 48-pin VQFN package (7.0 mm × 7.0 mm) with exposed thermal pad (connected to PGND). The package supports high-power dissipation (RθJA = 27.0°C/W) and requires PCB thermal vias under the pad for reliable operation above 1 W.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VBAT_A / VBAT_B | Battery sense & output | VBAT_A is high-impedance battery voltage monitor; VBAT_B is low-impedance battery charge output - must be shorted externally to battery terminal. |
| AC / USB | Charger input selection | Independent analog inputs accepting 4.5–5.5 V (AC) or 4.35–5.25 V (USB); internal FETs auto-select highest valid source. |
| ISET | Charge current programming | Analog input setting fast-charge current via external resistor (KSET = 310–350 mA per volt); supports 100 mA–1 A range. |
| VMAIN / VCORE | Feedback inputs | Resistive divider outputs connected directly to these pins for precise regulation of main and core rail voltages. |
| L1_A / L1_B / L2 | Switch node connections | L1_A/L1_B drive the 1-A VMAIN buck stage; L2 drives the 400-mA VCORE stage - require external inductors and low-ESR capacitors. |
| PGND1_A / PGND1_B / PGND2 | Power ground returns | Dedicated ground paths isolate VMAIN (dual PGND1 pins) and VCORE (PGND2) to minimize noise coupling between rails. |
| AGND1 / AGND2 / AGND3 | Analog reference grounds | Internally connected analog grounds for LDO, charger, and regulator feedback circuits - must tie to common system AGND plane. |
| SCLK / SDAT | I²C interface | Standard open-drain I²C clock/data lines supporting 100/400 kHz; require external pull-ups to VCC (3.3 V typical). |
| LOW_PWR / PS_SEQ / DEFCORE / DEFMAIN | Sequencing & configuration | GPIO-controlled inputs defining power-up order, deep-sleep core voltage (1.5 V/1.6 V), and default VMAIN (3.0 V/3.3 V). |
| INT / PWRFAIL / MPU_RESET / RESPWRON | Fault & reset signaling | Open-drain outputs indicating charge termination/fault (INT), brownout/overtemp (PWRFAIL), processor reset (MPU_RESET), and LDO1-based system reset (RESPWRON). |
Key Features
| Feature | Design Value |
|---|---|
| Dual-input autonomous charging | Hardware-based priority logic selects AC over USB over battery; no firmware required for source handoff or charge state transitions. |
| Programmable power sequencing | PS_SEQ pin configures startup order (VMAIN→VCORE→LDOs or VCORE→VMAIN→LDOs) and shutdown sequence to prevent backfeeding. |
| Deep-sleep core voltage scaling | LOW_PWR input reduces VCORE to 1.5 V or 1.6 V (per DEFCORE) during idle, cutting processor leakage by >30% without software intervention. |
| Integrated LED/vibrator drivers | LED2 (20-mA sink) and VIB (100-mA sink) support blink patterns and haptic feedback controlled entirely via I²C registers. |
| Battery safety monitoring | TS pin reads thermistor voltage for temperature-based charge suspend (145°C), BATT_COVER detects cover removal, and PWRFAIL signals UVLO/overtemp events. |
| Low-noise LDO enable control | LDO1/LDO2 enabled/disabled via I²C - eliminates external enable logic while maintaining <18 µA quiescent current per LDO in low-power mode. |
Applications
| PDA Power Management | Smartphone Baseband SoC Supply |
|---|---|
Use Scenario: Powering ARM9-based PDA with LCD backlight, SD card, and USB OTG. IC Role / Device Role / Timing Role: Central power hub managing Li-ion charging, generating 3.3 V I/O rail (VMAIN), 1.5 V core (VCORE), and 2.8 V display LDO (VLDO2). Use Value: Single-chip solution eliminates discrete DC-DC + LDO + charger ICs; PS_SEQ ensures safe boot sequence preventing I/O rail collapse before core initialization. |
Use Scenario: Supplying baseband processor (e.g., Qualcomm MSM7xxx) requiring tightly regulated core and peripheral rails. IC Role / Device Role / Timing Role: Delivers dynamically scaled VCORE (via I²C) and stable VMAIN, while monitoring battery health via TS/BATT_COVER for runtime estimation. Use Value: ±3% VCORE accuracy and 0.002%/mA load regulation meet SoC core voltage tolerance; LOW_PWR enables sub-100 µA sleep current in suspend mode. |
| Digital Still Camera System | Internet Audio Player |
Use Scenario: Powering CCD sensor, image processor, and flash LED in compact DSC form factor. IC Role / Device Role / Timing Role: Provides 3.3 V VMAIN for sensor interface, 1.2 V VCORE for DSP, and 200-mA VLDO1 for audio codec - all sequenced via PS_SEQ. Use Value: Integrated LED2 driver controls flash timing synchronized to VCORE voltage ramp; thermal shutdown prevents lens motor overheating during extended capture. |
Use Scenario: Enabling portable MP3 player with OLED display, stereo DAC, and USB charging. IC Role / Device Role / Timing Role: Manages dual-source charging (USB host or wall adapter), powers 3.3 V display rail (VMAIN), 1.3 V audio core (VCORE), and 1.8 V DAC LDO (VLDO1). Use Value: 70 µA quiescent current extends battery life in playback; I²C allows firmware to adjust VCORE voltage per codec requirements (1.1–1.4 V). |
Equivalent & Alternatives
The following parts are listed as comparable options for similar power management applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPS65020RGZR | Single 1.2-MHz buck (1.5 A), no linear charger; adds 3x LDOs (2×200 mA, 1×250 mA); I²C-compatible but lacks BATT_COVER/TS. | Targeted at non-battery systems or designs using external charger ICs; no battery safety features. | Select when charger integration is unnecessary and higher LDO count is needed for multi-rail peripherals. |
| TPS65023RSBR | Triple buck (1.5 A/1.5 A/1.5 A), no linear charger; includes 3x LDOs (2×200 mA, 1×250 mA); adds GPIOs and RTC backup supply. | Designed for multi-core processors requiring independent core/I/O/memory rails; no battery interface or thermal sensing. | Choose for complex SoCs needing three independent buck outputs and no onboard charging capability. |
Compared with TPS65010RGZRG4, TPS65020RGZR removes battery management but adds LDO flexibility, while TPS65023RSBR trades charger integration for triple-buck scalability - neither offers the same combination of linear charging, dual-buck efficiency, and battery safety monitoring in a single 48-pin VQFN.
Availability
TPS65010RGZRG4 is available at Aetrix Electronics and suitable for PDA, smartphone, and digital still camera designs requiring stable component supply, long-term lifecycle support, and full compliance with TI's production data sheet SLVS149C (Rev. September 2015).
Supply support for TPS65010RGZRG4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and power management technologies, with decades of expertise in battery-powered system solutions.
The TPS65010RGZRG4 belongs to TI's Power Management IC portfolio designed specifically for single-cell Li-ion portable electronics - integrating charging, conversion, sequencing, and safety in one die to reduce BOM count and PCB area.
FAQ
What is the maximum supported charge current for TPS65010RGZRG4 when using an AC adapter?
The TPS65010RGZRG4 supports up to 1 A of charge current from an AC adapter (4.5–5.5 V), set by an external resistor on the ISET pin. The KSET factor is 310–350 mA/V, allowing precise adjustment across the full 100 mA–1 A range. This is confirmed in Section 6.6 of the SLVS149C datasheet under "IO(AC) Output current range for AC operation".
Does TPS65010RGZRG4 support automatic power-source selection between AC and USB inputs?
Yes, TPS65010RGZRG4 implements hardware-based autonomous source selection: it prioritizes AC over USB over battery without firmware involvement. When both AC and USB are present, the internal logic enables the AC path first. This behavior is documented in the "Features" section and functional description of the SLVS149C datasheet.
Can TPS65010RGZRG4 generate a 1.2-V core voltage for a DSP processor?
Yes, TPS65010RGZRG4 supports 1.2 V VCORE output. Its VCORE converter is programmable in 0.1-V steps from 0.85 V to 1.6 V via I²C registers or DEFCORE pin strapping. At 1.2 V, it delivers up to 400 mA with ±3% accuracy and 0.002%/mA load regulation - verified in Table 6-12 of the SLVS149C datasheet.
How does the LOW_PWR pin affect VCORE regulation in TPS65010RGZRG4?
When LOW_PWR is asserted high, TPS65010RGZRG4 lowers VCORE to a predefined value (1.5 V if DEFCORE = 0, or 1.6 V if DEFCORE = 1) to reduce processor leakage current during deep sleep. This hardware-controlled scaling occurs without I²C interaction and is detailed in Section 7.4 ("Device Functional Modes") of SLVS149C.
Is thermal shutdown implemented in TPS65010RGZRG4, and what is the trip threshold?
Yes, TPS65010RGZRG4 includes integrated thermal shutdown that triggers at 160°C junction temperature (TSD), with 20°C hysteresis. Upon activation, PWRFAIL goes low within 1.68–3.2 ms before supplies are disabled - a safety feature confirmed in Sections 6.5 and 6.9 of the SLVS149C datasheet.
TPS65010RGZRG4 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 48-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Battery Chemistry:
- Lithium Ion/Polymer
- Number of Cells:
- 1
- Current - Charging:
- Constant - Programmable
- Programmable Features:
- -
- Fault Protection:
- Over Temperature
- Charge Current - Max:
- 500mA
- Battery Pack Voltage:
- 4.2V
- Voltage - Supply (Max):
- 5.5V
- Interface:
- I2C, USB
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-VQFN (7x7)
TPS65010RGZRG4 FAQ
1.How can I place an order for TPS65010RGZRG4 through Aetrix?
Please submit a Request for Quotation (RFQ) for TPS65010RGZRG4 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TPS65010RGZRG4 reliable?
The price and inventory of TPS65010RGZRG4 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TPS65010RGZRG4 is usually 5 days.
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Once your TPS65010RGZRG4 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TPS65010RGZRG4?
For technical support, including TPS65010RGZRG4 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TPS65010RGZRG4 requirements.
6.How does Aetrix verify that TPS65010RGZRG4 is sourced from the original manufacturer or authorized distributors?
All TPS65010RGZRG4 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TPS65010RGZRG4 meets industry standards.
7.What is the process for return or replacement of TPS65010RGZRG4?
All TPS65010RGZRG4 units undergo pre-shipment inspection (PSI). If there is an issue with TPS65010RGZRG4, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TPS65010RGZRG4 part is unused and in its original packaging.
Return procedure for TPS65010RGZRG4:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TPS65010RGZRG4 Tags

-
BQ21040DBVR
Texas Instruments

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MCP73812T-420I/OT
Microchip Technology

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MCP73831T-2ACI/OT
Microchip Technology

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MCP73832T-2ACI/OT
Microchip Technology

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MCP73831T-2DCI/OT
Microchip Technology

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MCP73832T-2DCI/OT
Microchip Technology

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MCP73831T-2ATI/OT
Microchip Technology

-
MCP73832T-2ATI/OT
Microchip Technology

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MCP73831T-5ACI/OT
Microchip Technology
-
MCP73832T-2ACI/MC
Microchip Technology
-
MCP73831T-2ACI/MC
Microchip Technology
-
MCP73831T-2ATI/MC
Microchip Technology
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