Texas Instruments TPS650243RHBR
- Part No.:
- TPS650243RHBR
- Manufacturer:
- Texas Instruments
- Category:
- Battery Management
- Package:
- 32-VFQFN Exposed Pad
- Datasheet:
-
TPS650243RHBR.pdf
- Description:
- IC BAT PWR MGMT LI-ION 1C 32VQFN
- Quantity:
- Payment:

- Shipping:

Inventory:1,783
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Product details
Overview
TPS650243RHBR from Texas Instruments is a highly integrated power management IC (PMIC) for single-cell Li-ion/Li-polymer systems, delivering three synchronous step-down converters (1.6 A / 1.0 A / 0.8 A), two 200 mA general-purpose LDOs, and one 30 mA always-on LDO (Vdd_alive). It supports dynamic voltage scaling on DCDC3 (1.0 V / 1.2 V), operates at 2.25 MHz switching frequency, and features PFM/PWM mode selection via MODE pin for high efficiency across load range.
For engineers reviewing the TPS650243RHBR datasheet, TPS650243RHBR pinout, TPS650243RHBR application, or TPS650243RHBR equivalent, key selection criteria include confirmed DCDC3 dual-voltage configuration (DEFDCDC3-controlled), verified 32-pin VQFN (5 mm × 5 mm) package with thermal pad, validated quiescent current (≤80 µA in PFM), and documented LDO feedback flexibility (FB_LDO1/FB_LDO2).
Technical Context
The TPS650243RHBR integrates three independent buck regulators with separate enable pins (EN_DCDC1/2/3), fixed-frequency or adaptive PFM/PWM operation (MODE pin), and external voltage selection via DEFDCDCx pins. DCDC1 delivers up to 1.6 A at 3.3 V or 2.8 V; DCDC2 supplies memory rails at 1.8 V or 2.5 V; DCDC3 provides processor core voltage at 1.0 V or 1.2 V (DEFDCDC3 = LOW/HIGH).
All converters share a common 2.25 MHz oscillator (±15% tolerance), support soft-start (750 µs ramp time), and feature internal MOSFETs with RDS(ON) ≤261 mΩ (P-ch) and ≤503 mΩ (N-ch). The PMIC includes dedicated analog/digital ground separation (AGND1/AGND2), power-fail detection (PWRFAIL_SNS → PWRFAIL), and UVLO protection (2.35 V threshold).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| DCDC1 Output Current | 1.6 A maximum - supports high-current I/O or peripheral rail in ARM-based processors |
| DCDC2 Output Current | 1.0 A maximum - powers memory subsystems (e.g., LPDDR, NAND) requiring stable 1.8 V/2.5 V |
| DCDC3 Output Voltage | 1.0 V (DEFDCDC3 = LOW) or 1.2 V (DEFDCDC3 = HIGH) - enables dynamic core voltage scaling for power optimization |
| Switching Frequency | 2.25 MHz nominal - allows compact external components (2.2 µH inductors, 10–22 µF output caps) |
| LDO1/LDO2 Current | 200 mA each - sufficient for auxiliary logic, interface buffers, or sensor biasing |
| Vdd_alive Output | 1.2 V @ 30 mA - maintains real-time clock or wake-up circuitry during system sleep |
| Quiescent Current | ≤80 µA (PFM, all DCDCs enabled, LDOs off) - extends battery life in low-power standby modes |
Pinout & Package
The TPS650243RHBR is housed in a thermally enhanced 32-pin VQFN package (5.00 mm × 5.00 mm, RHB suffix), with exposed PowerPad connected to AGND for optimal thermal performance.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDCDC3 | Feedback input for core converter | Connects directly to DCDC3 output for closed-loop regulation; sets accuracy to ±1% in PWM mode |
| DEFDCDC3 | DCDC3 voltage select input | Logic-level control: LOW = 1.0 V, HIGH = 1.2 V - enables software-configurable core voltage |
| EN_DCDC3 | Core converter enable | Active-high signal; allows independent sequencing of processor core power relative to I/O/memory rails |
| L3 | DCDC3 switch node | Connects to 2.2 µH inductor; requires low-ESR ceramic capacitor (≥10 µF) at VDCDC3 for stability |
| PGND3 | Power ground for DCDC3 | Separate ground return path minimizes noise coupling into sensitive analog sections (AGND1/AGND2) |
Key Features
| Feature | Design Value |
|---|---|
| Triple independent buck converters | Enables precise, sequenced power delivery to core, memory, and I/O domains without external controllers |
| Dynamic DCDC3 voltage scaling | Reduces processor dynamic power by >20% when operating at 1.0 V vs. 1.2 V under light-load conditions |
| 200-mA adjustable LDOs (VLDO1/VLDO2) | External resistor dividers (FB_LDO1/FB_LDO2) allow programmable outputs from 1.0 V to 3.3 V for flexible peripheral biasing |
| Low-quiescent-current PFM mode | Maintains ≥85% efficiency down to 100 µA load - critical for battery-powered GPS and PDA applications |
| Integrated power-fail comparator | PWRFAIL_SNS monitors battery voltage; asserts open-drain PWRFAIL signal before brownout to trigger safe shutdown |
Applications
| Smartphone Power Management | Digital Camera System Power |
|---|---|
Use Scenario: Single-cell Li-ion powered smartphone requiring independent, sequenced rails for application processor core, DDR memory, display interface, and camera module. IC Role / Device Role / Timing Role: Central PMIC providing regulated DCDC3 (1.0 V/1.2 V core), DCDC2 (1.8 V memory), DCDC1 (3.3 V I/O), plus VLDO1/VLDO2 for sensors and audio codecs. Use Value: Eliminates need for six discrete regulators; reduces PCB area by 40% versus discrete solution while enabling dynamic voltage/frequency scaling. | Use Scenario: Portable digital camera with CMOS image sensor, ISP, SD card interface, and OLED viewfinder - all powered from one 3.7 V Li-ion cell. IC Role / Device Role / Timing Role: Supplies 1.2 V to ISP core, 1.8 V to SDIO interface, 3.3 V to lens actuator driver, and 30 mA Vdd_alive for real-time clock during sleep. Use Value: Achieves <100 µV RMS output ripple on DCDC2 (1.8 V) - prevents image sensor noise and banding artifacts. |
| ARM-Based Industrial PDA | GPS Navigation Device |
Use Scenario: Ruggedized industrial PDA operating in extended temperature range (–40°C to +85°C) with barcode scanner, Wi-Fi, and cellular modem. IC Role / Device Role / Timing Role: Delivers 1.0 V core (DCDC3), 2.5 V memory (DCDC2), 3.3 V I/O (DCDC1), and dual 200 mA LDOs for modem RF section and touch controller. Use Value: Thermal shutdown (160°C) and UVLO (2.35 V) ensure reliable operation during battery aging or cold-temperature discharge. | Use Scenario: Battery-powered automotive GPS unit requiring fast wake-from-sleep (<50 ms), low standby current, and robust brownout response. IC Role / Device Role / Timing Role: Powers GPS baseband processor (DCDC3), RF front-end (VLDO1), and serial interface (VLDO2); uses PWRFAIL to initiate graceful NVM save before shutdown. Use Value: 80 µA quiescent current extends battery runtime to >72 hours in tracking mode; soft-start prevents inrush-induced system reset. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar power management IC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPS650241RHBR | DCDC3 outputs 0.9 V / 1.375 V; higher DCDC1/DCDC2 current (1.6 A / 1.0 A) | Better suited for ultra-low-voltage processors (e.g., Cortex-M4 @ 0.9 V) requiring tighter core voltage tolerance | Select when target SoC mandates sub-1.0 V core rail and higher memory current capability |
| TPS650244RHBR | DCDC3 outputs 1.55 V / 1.6 V; DCDC2 rated for 1.6 A; lower DCDC1 current (0.8 A) | Optimized for legacy processors needing 1.5 V+ core voltage and high-bandwidth memory interfaces (e.g., DDR2) | Choose for designs where core voltage >1.2 V is required and I/O rail current demand is moderate |
Compared with TPS650243RHBR, TPS650241RHBR enables deeper power savings at ultra-low core voltages but sacrifices DCDC3 upper-range flexibility; TPS650244RHBR trades core scalability for higher memory bandwidth support, making it less suitable for modern low-power ARM cores.
Availability
TPS650243RHBR is available at Aetrix Electronics and suitable for smartphone power management, digital camera system power, ARM-based industrial PDA, and GPS navigation device applications requiring stable component supply, long-term lifecycle support, and consistent parametric performance.
Supply support for TPS650243RHBR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and power management technologies, with leadership in high-efficiency DC-DC conversion and battery-powered system solutions.
The TPS65024x product line was designed specifically for Li-ion/Li-polymer powered portable electronics, integrating multiple power rails, dynamic voltage scaling, and intelligent power sequencing into a single compact package.
FAQ
What is the confirmed DCDC3 output voltage configuration for TPS650243RHBR?
The TPS650243RHBR supports two fixed DCDC3 output voltages: 1.0 V when DEFDCDC3 is logic LOW, and 1.2 V when DEFDCDC3 is logic HIGH. This dual-voltage capability is explicitly defined in the Voltage Options table of the SLVS774C datasheet and is not adjustable via external resistors - unlike DCDC1/DCDC2, which support resistor-divider programming.
Does TPS650243RHBR support forced PWM mode across all three DC-DC converters?
Yes, TPS650243RHBR supports forced PWM mode for all three buck converters simultaneously via the MODE pin. When MODE is pulled high, the device disables PFM operation and runs all converters in fixed-frequency PWM mode (2.25 MHz), ensuring predictable EMI behavior and consistent transient response - critical for noise-sensitive RF or audio subsystems.
What is the maximum supported output current for VLDO1 and VLDO2 in TPS650243RHBR?
The TPS650243RHBR supports up to 200 mA per LDO (VLDO1 and VLDO2) when input voltage (VINLDO) is ≥1.8 V and output voltage is set to 1.3 V. At lower input voltages (e.g., VINLDO = 1.5 V), maximum output current drops to 120 mA due to dropout constraints, as specified in Section 8.9 of the SLVS774C datasheet.
How is thermal performance managed in the TPS650243RHBR 32-pin VQFN package?
The TPS650243RHBR uses a thermally enhanced 32-pin VQFN (RHB) package with an exposed PowerPad that must be soldered to a large copper thermal pad on the PCB. With RθJA = 32.2°C/W and RθJB = 6.2°C/W, proper board-level thermal design - including ≥4 thermal vias under the PowerPad connected to inner ground planes - ensures junction temperature remains below 125°C at full load and 85°C ambient.
Can TPS650243RHBR's PWRFAIL function be used for system-level battery monitoring?
Yes, the PWRFAIL function in TPS650243RHBR provides a hardware-based early warning of battery depletion. The PWRFAIL_SNS pin monitors battery voltage against a 1.0 V threshold (±2%), and asserts the open-drain PWRFAIL signal low when voltage falls below this level. This allows host processors to execute controlled shutdown, save state to nonvolatile memory, and prevent data corruption before brownout occurs.
TPS650243RHBR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 32-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Function:
- Power Management
- Battery Chemistry:
- Lithium Ion/Polymer
- Number of Cells:
- 1
- Fault Protection:
- Over Temperature, Under Voltage
- Interface:
- -
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 32-VQFN (5x5)
TPS650243RHBR FAQ
1.How can I place an order for TPS650243RHBR through Aetrix?
Please submit a Request for Quotation (RFQ) for TPS650243RHBR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TPS650243RHBR reliable?
The price and inventory of TPS650243RHBR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TPS650243RHBR is usually 5 days.
3.What payment methods are accepted for TPS650243RHBR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TPS650243RHBR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TPS650243RHBR?
TPS650243RHBR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TPS650243RHBR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TPS650243RHBR?
For technical support, including TPS650243RHBR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TPS650243RHBR requirements.
6.How does Aetrix verify that TPS650243RHBR is sourced from the original manufacturer or authorized distributors?
All TPS650243RHBR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TPS650243RHBR meets industry standards.
7.What is the process for return or replacement of TPS650243RHBR?
All TPS650243RHBR units undergo pre-shipment inspection (PSI). If there is an issue with TPS650243RHBR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TPS650243RHBR part is unused and in its original packaging.
Return procedure for TPS650243RHBR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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