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Texas Instruments TPS650250RHBR
- Part No.:
- TPS650250RHBR
- Manufacturer:
- Texas Instruments
- Category:
- Battery Management
- Package:
- 32-VFQFN Exposed Pad
- Datasheet:
-
TPS650250RHBR.pdf
- Description:
- IC BAT PWR MGMT LI-ION 1C 32VQFN
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
TPS650250RHBR from Texas Instruments is a highly integrated power management IC (PMIC) for ARM-based SoCs and mobile applications, featuring three synchronous step-down converters (1.6 A, 0.8 A, 0.8 A), two 200 mA general-purpose LDOs, and one 30 mA always-on Vdd_alive LDO - all in a single 5 mm × 5 mm VQFN-32 package. It supports dynamic voltage scaling for processor core (VDCDC3), operates from 2.5 V to 6 V input, and delivers up to 97% efficiency at full load in DCDC1 for I/O rail generation.
For engineers reviewing the TPS650250RHBR datasheet, TPS650250RHBR pinout, TPS650250RHBR application, or TPS650250RHBR equivalent, key selection considerations include its triple-buck architecture with independent enable/control pins, 2.25 MHz switching frequency enabling compact external components, PFM/PWM mode auto-selection via MODE pin, and resistor-programmable output voltages across all rails - critical for battery-powered handheld systems requiring multi-rail sequencing and low-quiescent-current operation.
Technical Context
The TPS650250RHBR implements three independent synchronous buck regulators with internal high-side/low-side MOSFETs (RDS(on) ≤ 261 mΩ / 260 mΩ for DCDC1), fixed 2.25 MHz oscillator (±13.3%), and automatic transition between PWM (forced or light-load) and PFM (light-load efficiency optimization) modes controlled by the MODE pin. Each converter features soft-start (750 µs ramp), overcurrent protection (ILIMF = 1.75–2.15 A for DCDC1), and thermal shutdown at 160 °C.
Its LDO section includes two externally adjustable 200 mA LDOs (VLDO1/VLDO2) with 1.0 V feedback reference, ±1% output accuracy, and <10 µs load regulation time, plus a dedicated 30 mA Vdd_alive LDO with 1.0 V fixed output and ±1% accuracy - all supplied from a common VINLDO input (1.5–6.5 V). The device uses separate analog (AGND1/AGND2) and power grounds (PGND1–PGND3) for noise isolation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| DCDC1 Output Current | 1600 mA max - powers system I/O rails (e.g., 3.3 V/2.8 V) with 97% peak efficiency |
| DCDC2 Output Current | 800 mA max - supplies memory subsystems (e.g., 1.8 V/2.5 V) with up to 95% efficiency |
| DCDC3 Output Current | 800 mA max - delivers dynamically scalable core voltage (adjustable 0.6–VIN) with 90% efficiency |
| LDO1/LDO2 Output | 200 mA each, 1.0–3.3 V range - general-purpose rails with external resistor divider feedback |
| Vdd_alive Output | 30 mA fixed 1.0 V - maintains real-time clock or backup logic during deep sleep |
| Quiescent Current | 135–170 µA (PFM, all DCDCs + LDOs enabled) - enables >1-week battery standby in smart phones |
| Switching Frequency | 2.25 MHz nominal (1.95–2.55 MHz) - allows use of small 2.2 µH inductors and 10–22 µF ceramic capacitors |
Pinout & Package
TPS650250RHBR is housed in a thermally enhanced 32-pin VQFN package (5.0 mm × 5.0 mm, 0.5 mm pitch) with exposed thermal pad connected internally to AGND. The package supports high-power density layout with separate analog and power ground pins, and dedicated switch-node (Lx) and power-ground (PGNDx) terminals per buck channel.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VINDCDC1, VINDCDC2, VINDCDC3 | Input supply for respective buck converters | Must be tied together and to VCC; shared 2.5–6 V input source for all three DC-DC stages |
| L1, L2, L3 | Buck switch node | Connects directly to inductor; requires low-inductance layout to minimize EMI and switching losses |
| PGND1, PGND2, PGND3 | Power ground return for each buck stage | Separate paths prevent cross-coupling; must connect to thermal pad and AGND at single point |
| DEFDCDC1, DEFDCDC2 | Default output voltage select | Logic-level inputs: GND = 2.8 V / 1.8 V; VCC = 3.3 V / 2.5 V; resistor divider enables full 0.6–VIN adjustment |
| DEFDCDC3 | Core voltage programming input | Requires external resistor divider only - no logic mode; enables real-time DVFS during processor operation |
| EN_DCDC1–EN_DCDC3 | Independent enable control | Active-high logic; allows precise power-up/down sequencing of I/O, memory, and core rails |
| VINLDO | LDO input supply | Accepts 1.5–6.5 V; typically sourced from VDCDC1 or VDCDC2 to optimize efficiency |
| VLDO1, VLDO2 | LDO regulated outputs | 200 mA each; output voltage set by external FB_LDO1/FB_LDO2 resistors with 1.0 V reference |
| Vdd_alive | Always-on LDO output | Fixed 1.0 V, 30 mA - powers RTC or wake-up circuitry even when main rails are off |
| PWRFAIL / PWRFAIL_SNS | VBAT monitoring interface | Open-drain fault signal triggered when sensed battery voltage falls below 1.0 V ±2% threshold |
Key Features
| Feature | Design Value |
|---|---|
| Triple synchronous buck architecture | Enables compact, high-efficiency multi-rail power delivery without external MOSFETs or controllers |
| Independent enable and mode control | Per-rail EN pins + global MODE pin allow flexible sequencing, dynamic voltage scaling, and ultra-low-power states |
| Resistor-programmable outputs | All five regulated outputs (3 buck + 2 LDO) support external resistor dividers for precise voltage setting and field tuning |
| Integrated thermal protection | 160 °C shutdown with 20 °C hysteresis prevents damage during overload or poor heatsinking conditions |
| Low-noise analog partitioning | Dedicated AGND1/AGND2 pins and isolated feedback paths ensure stable LDO regulation and accurate voltage sensing |
Applications
| Smartphone Power Subsystem | Digital Still Camera Core Supply |
|---|---|
|
Use Scenario: Single-cell Li-ion powered smartphone with ARM Cortex-A8/A9 SoC, DDR2 memory, and display interface. IC Role / Device Role: Central PMIC providing sequenced 3.3 V I/O, 1.8 V memory, 1.2 V core, 3.3 V camera sensor, and 1.0 V RTC rails. Use Value: Reduces BOM count by consolidating 3 buck + 3 LDO functions into one IC; PFM mode extends standby time beyond 7 days. |
Use Scenario: Compact digital camera requiring fast wake-up, low-noise image sensor bias, and flash LED driver supply. IC Role / Device Role: Supplies 2.8 V I/O, 1.8 V memory, and 1.3 V processor core while maintaining 1.0 V Vdd_alive for instant-on functionality. Use Value: 2.25 MHz switching enables miniature 2.2 µH inductors; independent EN pins allow staggered rail activation to limit inrush current. |
| Samsung ARM-Based Tablet Platform | GPS Navigation Module |
|
Use Scenario: 7-inch tablet using Samsung S5PC110 SoC with dual DDR2 channels and HDMI interface. IC Role / Device Role: Generates 3.3 V peripheral, 2.5 V memory, 1.1 V core, and two 3.3 V auxiliary rails via VLDO1/VLDO2. Use Value: DEFDCDC3 resistor divider enables software-controlled DVFS for CPU performance/power trade-offs; thermal pad ensures reliable 85 °C operation. |
Use Scenario: Automotive-grade GPS receiver module operating from 3.7 V Li-ion with cold-start requirement. IC Role / Device Role: Delivers 3.3 V RF front-end, 1.8 V baseband processor, and 1.0 V real-time clock with PWRFAIL monitoring for battery health. Use Value: PWRFAIL_SNS comparator provides early warning of battery depletion; 85 µA quiescent current preserves charge during vehicle ignition-off periods. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar multi-rail PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPS65910A3RSLR | Higher integration: adds I²C interface, real-time clock, and GPIOs; 4 buck + 5 LDO channels; 48-pin VQFN | Requires firmware control and board space for I²C pull-ups; better suited for complex SoC platforms needing programmable sequencing | Select when system demands dynamic register-based configuration, not just hardware-defined voltage settings |
| MAX8649ETE+T | Single 1.5 A buck + dual 300 mA LDOs; no core-rail DVFS; 16-pin TQFN; lacks PFM mode and PWRFAIL monitor | Lower cost and smaller footprint but limited to simpler applications without memory or core voltage scaling needs | Select for cost-sensitive portable devices with fixed-voltage requirements and minimal rail count |
Compared with TPS65910A3RSLR, the TPS650250RHBR offers simpler hardware-only configuration and lower gate count, while MAX8649ETE+T trades integration for reduced size and cost - making TPS650250RHBR optimal for mid-tier ARM smartphones where sequenced fixed/adjustable rails and battery monitoring are essential but full I²C programmability is unnecessary.
Availability
TPS650250RHBR is available at Aetrix Electronics and suitable for cellular handsets, digital still cameras, GPS navigation modules, split-supply DSP solutions, and Samsung ARM-based processor designs requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for TPS650250RHBR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and power management technologies, with decades of expertise in high-efficiency DC-DC conversion and mobile power solutions.
The TPS650250RHBR belongs to TI's Power Management IC portfolio designed specifically for single-cell Li-ion/Li-Polymer powered portable electronics - emphasizing integration density, light-load efficiency, and robust sequencing for ARM-based application processors.
FAQ
What input voltage range does the TPS650250RHBR support?
The TPS650250RHBR supports an input voltage range of 2.5 V to 6.0 V on VINDCDC1/VINDCDC2/VINDCDC3 and VCC pins, and 1.5 V to 6.5 V on VINLDO. This allows direct operation from single-cell Li-ion (3.0–4.2 V typical) or Li-Polymer batteries, as well as regulated intermediate supplies. All three buck inputs must be tied together and to VCC per datasheet layout guidance.
How is the output voltage of the TPS650250RHBR's core rail (VDCDC3) configured?
The TPS650250RHBR's VDCDC3 output voltage is configured exclusively via an external resistor divider connected to the DEFDCDC3 pin - unlike DEFDCDC1/DEFDCDC2, it does not accept logic-level inputs. The divider sets VDCDC3 in the range 0.6 V to VINDCDC3, enabling dynamic voltage scaling for ARM processor cores. The feedback reference is internal and fixed at 1.0 V.
Does the TPS650250RHBR support power sequencing between its rails?
Yes, the TPS650250RHBR supports hardware-based power sequencing through independent enable pins: EN_DCDC1, EN_DCDC2, EN_DCDC3, EN_LDO, and EN_Vdd_alive are all active-high and can be driven by external timing circuits or microcontroller GPIOs. This allows precise control over turn-on/off order of I/O, memory, core, and always-on rails to meet SoC requirements.
What is the purpose of the PWRFAIL and PWRFAIL_SNS pins on the TPS650250RHBR?
The PWRFAIL_SNS pin on the TPS650250RHBR is an input to an internal comparator that monitors battery voltage; when it falls below 1.0 V ±2%, the open-drain PWRFAIL output asserts low. This provides early warning of battery depletion for system-level shutdown or data save operations - critical in portable devices where uncontrolled power loss could corrupt memory or file systems.
Can the TPS650250RHBR operate in forced PWM mode across all load conditions?
Yes, the TPS650250RHBR can operate in forced PWM mode across all load conditions by driving the MODE pin high. In this mode, all three buck converters bypass PFM operation and maintain fixed 2.25 MHz switching, ensuring predictable EMI profile and consistent transient response - ideal for noise-sensitive applications like audio or RF subsystems where variable-frequency PFM could interfere.
TPS650250RHBR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 32-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Function:
- Power Management
- Battery Chemistry:
- Lithium Ion/Polymer
- Number of Cells:
- 1
- Fault Protection:
- Over Temperature
- Interface:
- -
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 32-VQFN (5x5)
TPS650250RHBR FAQ
1.How can I place an order for TPS650250RHBR through Aetrix?
Please submit a Request for Quotation (RFQ) for TPS650250RHBR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TPS650250RHBR reliable?
The price and inventory of TPS650250RHBR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TPS650250RHBR is usually 5 days.
3.What payment methods are accepted for TPS650250RHBR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TPS650250RHBR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TPS650250RHBR?
TPS650250RHBR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TPS650250RHBR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TPS650250RHBR?
For technical support, including TPS650250RHBR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TPS650250RHBR requirements.
6.How does Aetrix verify that TPS650250RHBR is sourced from the original manufacturer or authorized distributors?
All TPS650250RHBR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TPS650250RHBR meets industry standards.
7.What is the process for return or replacement of TPS650250RHBR?
All TPS650250RHBR units undergo pre-shipment inspection (PSI). If there is an issue with TPS650250RHBR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TPS650250RHBR part is unused and in its original packaging.
Return procedure for TPS650250RHBR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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