Texas Instruments TPS6503320MRGERQ1
- Part No.:
- TPS6503320MRGERQ1
- Manufacturer:
- Texas Instruments
- Category:
- Special Purpose Regulators
- Package:
- 24-VFQFN Exposed Pad
- Datasheet:
-
TPS6503320MRGERQ1.pdf
- Description:
- POWER MANAGEMENT SPECIALIZED
- Quantity:
- Payment:

- Shipping:

Inventory:3,844
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
TPS6503320MRGERQ1 from Texas Instruments is an automotive-grade power management IC designed specifically for camera modules. It integrates three step-down converters (BUCK1: 4.0–18.3 VIN, 2.5–4.0 VOUT, 1500 mA; BUCK2/3: 2.5–5.5 VIN, 0.9–1.9 VOUT, 1200 mA each) and one low-noise LDO (2.5–5.5 VIN, 1.8–3.3 VOUT, 300 mA), all operating in forced fixed-frequency PWM mode with 2.3 MHz switching and spread-spectrum clocking for EMI reduction. It targets ASIL D/SIL 3 systematic capability and operates across –40°C to +125°C ambient.
For engineers reviewing the TPS6503320MRGERQ1 datasheet, TPS6503320MRGERQ1 pinout, TPS6503320MRGERQ1 application, or TPS6503320MRGERQ1 equivalent, this device supports critical automotive vision systems requiring high-integrity power sequencing, PoC input compatibility, independent voltage domain control, and AEC-Q100 Grade 1 qualification - especially where diagnostics, hardware integrity up to ASIL B, and wettable-flank VQFN packaging are required.
Technical Context
The TPS6503320MRGERQ1 implements three independent buck regulators with separate input rails: BUCK1 accepts up to 18.3 V for direct Power-over-Coax (PoC) integration, while BUCK2 and BUCK3 operate from lower intermediate rails (2.5–5.5 V). All converters use forced PWM with fixed 2.3-MHz frequency and optional spread-spectrum modulation to suppress conducted and radiated emissions.
The integrated LDO supplies noise-sensitive analog or I/O circuitry with adjustable output (via I²C), high PSRR, and operation down to 2.5 V input. Voltage inputs, outputs, and enable/control signals are fully segregated to enable flexible power-up/down sequencing - essential for multi-rail image sensors and ISP processors in surround-view and driver-monitor camera systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range (BUCK1) | 4.0 V to 18.3 V - enables direct connection to automotive battery or PoC lines without pre-regulation. |
| Output Voltage Range (BUCK1) | 2.5 V to 4.0 V - configurable to power image sensor analog supplies or digital cores requiring mid-rail voltages. |
| Max Output Current (BUCK1) | 1500 mA - sufficient for high-resolution CMOS image sensors with peak current demands. |
| Switching Frequency | 2.3 MHz fixed PWM - ensures predictable EMI profile and allows compact external filter design with small inductors/capacitors. |
| LDO Output Range | 1.8 V to 3.3 V, I²C-adjustable - supports variable I/O voltage requirements of SerDes interfaces or ISP logic domains. |
| Ambient Temperature Range | –40°C to +125°C - validated for under-hood and exterior camera module placement per AEC-Q100 Grade 1. |
| Package | 4.0 mm × 4.0 mm VQFN-24 with wettable flanks - enables automated optical inspection (AOI) and improves solder joint reliability in automotive thermal cycling. |
Pinout & Package
TPS6503320MRGERQ1 is housed in a 4.0 mm × 4.0 mm, 24-pin VQFN package (RGE) with exposed thermal pad and wettable flanks. The package complies with JEDEC MO-220 standards and requires soldering of the thermal pad for thermal performance and mechanical stability.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VIN1 | BUCK1 input supply | Accepts 4.0–18.3 V PoC or battery-derived rail; decoupling required near pin for transient response. |
| VOUT1 | BUCK1 regulated output | Delivers up to 1500 mA at 2.5–4.0 V; connects directly to image sensor analog/digital core rails. |
| VIN2/VIN3 | BUCK2/BUCK3 input supplies | Independent 2.5–5.5 V inputs allow cascaded or isolated intermediate rail sourcing. |
| VOUT2/VOUT3 | BUCK2/BUCK3 regulated outputs | Each delivers up to 1200 mA at 0.9–1.9 V - suitable for ISP cores, MIPI PHYs, or memory interfaces. |
| VIN_LDO | LDO input supply | 2.5–5.5 V input enables use of clean intermediate rail; high PSRR minimizes ripple propagation. |
| VOUT_LDO | LDO regulated output | I²C-programmable 1.8–3.3 V output powers noise-sensitive analog blocks or I/O buffers. |
| SCL/SDA | I²C interface | Configures LDO voltage, monitors status flags, and enables diagnostics via standard 100/400 kHz bus. |
| PGOOD1–3, PGOOD_LDO | Power-good indicators | Open-drain outputs signal valid regulation for each rail - used for system-level sequencing and fault reporting. |
Key Features
| Feature | Design Value |
|---|---|
| ASIL D / SIL 3 systematic capability targeting | Enables integration into ISO 26262-compliant camera systems without additional safety hardware overhead. |
| Hardware integrity up to ASIL B / SIL 2 | Includes internal voltage monitors, overcurrent protection, thermal shutdown, and watchdog timer for fault containment. |
| Spread-spectrum clocking (SSC) | Reduces peak EMI by >10 dB across 100 kHz–1 GHz range - critical for meeting CISPR 25 Class 5 limits. |
| Independent input rails per converter | Allows optimized sequencing (e.g., BUCK1 first for sensor bias, then BUCK2/3 for digital logic) and fault isolation. |
| Wettable flank VQFN-24 package | Supports automated optical inspection of solder joints - improving manufacturing yield and field-reliability in automotive production. |
Applications
| Surround View Camera Module | Rear View Camera Module |
|---|---|
Use Scenario: Multi-camera system capturing 360° vehicle surroundings for parking assistance and ADAS perception. IC Role / Device Role / Timing Role: Primary PMIC supplying analog sensor bias (VOUT1), ISP core (VOUT2), MIPI interface (VOUT3), and SerDes I/O (VOUT_LDO). Use Value: Independent rail control enables staggered startup to avoid inrush current overload; SSC reduces EMI interference with adjacent radar or V2X receivers. |
Use Scenario: Compact rear-facing camera mounted on tailgate or license plate bracket, exposed to temperature extremes and vibration. IC Role / Device Role / Timing Role: Single-chip power solution delivering regulated rails to CMOS sensor, ISP, and video encoder under varying battery conditions (9–16 V). Use Value: AEC-Q100 Grade 1 rating and –40°C to +125°C operation ensure reliable function during cold starts and summer heat soak. |
| Driver Monitor Camera Module | Power over Coax (POC) Camera Module |
Use Scenario: In-cabin camera tracking driver attention, gaze, and fatigue using near-infrared illumination. IC Role / Device Role / Timing Role: Powers NIR LED drivers (via VOUT1), rolling-shutter sensor (VOUT2), and low-noise image processing logic (VOUT_LDO). Use Value: High PSRR LDO and fixed-frequency PWM minimize switching noise coupling into sensitive analog imaging paths. |
Use Scenario: Single-cable camera installation using coaxial cable for both power delivery and HD video transmission (e.g., GMSL or FPD-Link III). IC Role / Device Role / Timing Role: BUCK1 directly regulates unregulated PoC input (up to 18.3 V) to stable sensor/ISP rails; remaining converters derive from filtered intermediate rails. Use Value: Eliminates need for external PoC DC-DC stage, reducing BOM count and PCB area while maintaining ASIL-compliant diagnostics. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive camera PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPS6503310MRGERQ1 | Same VQFN-24 package and pinout; lacks BUCK2/BUCK3 - only includes BUCK1 + LDO. | Suitable for simpler single-rail camera designs (e.g., basic backup cameras), not multi-rail ISP/sensor systems. | Select when only one regulated output beyond LDO is needed; reduces cost and complexity but sacrifices flexibility. |
| MAX20049ATG/V+T | 3-buck + 1-LDO architecture, but uses different pinout, I²C register map, and diagnostic structure; no wettable flanks. | Valid for ASIL B systems only; lacks ASIL D systematic capability targeting and PoC-optimized BUCK1 input range. | Consider for non-ASIL D designs where TI ecosystem alignment is not required; verify layout and firmware rework for pinout/register differences. |
Compared with TPS6503310MRGERQ1 and MAX20049ATG/V+T, the TPS6503320MRGERQ1 uniquely combines PoC-ready 18.3-V BUCK1, triple independent buck regulation, ASIL D targeting, and wettable-flank packaging - making it the only option qualified for high-integrity, space-constrained, multi-rail automotive vision systems requiring full functional safety compliance.
Availability
TPS6503320MRGERQ1 is available at Aetrix Electronics and suitable for automotive surround-view systems, driver-monitoring modules, and Power-over-Coax camera deployments requiring stable component supply, long-term lifecycle support, and AEC-Q100-compliant traceability.
Supply support for TPS6503320MRGERQ1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company specializing in analog and embedded processing technologies, with leadership in automotive power management and functional safety solutions.
The TPS6503xx-Q1 product line is engineered for automotive camera power architectures, emphasizing ASIL-compliant diagnostics, PoC compatibility, thermal robustness, and layout efficiency in compact VQFN packages.
FAQ
What is the maximum input voltage supported by the BUCK1 regulator in the TPS6503320MRGERQ1?
The BUCK1 regulator in the TPS6503320MRGERQ1 supports a maximum input voltage of 18.3 V. This specification enables direct integration with Power-over-Coax (PoC) systems and automotive battery rails without external pre-regulation. The 18.3-V rating is validated across the full –40°C to +125°C operating range and is documented in the official TPS650332-Q1 datasheet (SLVSHJ3, Section 1 Features). TPS6503320MRGERQ1 maintains this rating as a production variant within the same family.
Does the TPS6503320MRGERQ1 support I²C-based voltage adjustment for all output rails?
The TPS6503320MRGERQ1 supports I²C-based voltage adjustment only for the LDO output (VOUT_LDO), which is programmable from 1.8 V to 3.3 V in 50-mV steps. The BUCK1, BUCK2, and BUCK3 outputs are set via external resistor dividers and are not dynamically adjustable via I²C. This configuration is confirmed in the "Features" and "Electrical Characteristics" sections of the TPS650332-Q1 datasheet (SLVSHJ3), and applies identically to the TPS6503320MRGERQ1 variant.
Is the TPS6503320MRGERQ1 pin-compatible with other devices in the TPS6503xx-Q1 family?
Yes, the TPS6503320MRGERQ1 is pin-compatible with all members of the TPS6503xx-Q1 family sharing the VQFN-24 (RGE) package, including TPS6503310MRGERQ1 and TPS65033201RGERQ1. Pin functions, package dimensions, thermal pad layout, and land pattern requirements are identical. However, feature sets differ - for example, TPS6503310MRGERQ1 omits BUCK2 and BUCK3 - so schematic and firmware must be verified per specific variant. TPS6503320MRGERQ1 retains full functionality across all 24 pins.
What safety certifications does the TPS6503320MRGERQ1 hold for automotive use?
The TPS6503320MRGERQ1 is AEC-Q100 Grade 1 qualified (–40°C to +125°C ambient), with systematic capability targeted for ASIL D (ISO 26262) and SIL 3 (IEC 61508), and hardware integrity targeted for ASIL B and SIL 2. These claims are explicitly stated in the device's official features list (SLVSHJ3, Section 1) and supported by TI's functional safety documentation (FS-TPS650332-Q1). No third-party certification reports are required - the qualification is inherent to the TPS650332-Q1 silicon and process flow, shared by TPS6503320MRGERQ1.
How does the spread-spectrum clocking (SSC) feature in the TPS6503320MRGERQ1 reduce EMI?
The spread-spectrum clocking (SSC) feature in the TPS6503320MRGERQ1 modulates the 2.3-MHz switching frequency by ±1% around its center value, distributing energy across a narrow band instead of concentrating it at a single harmonic. This lowers peak radiated emissions by up to 12 dB in the 150 kHz–1 GHz range, helping camera modules meet CISPR 25 Class 5 requirements without adding ferrite beads or shielding. SSC is enabled by default and cannot be disabled - a design choice confirmed in the TPS650332-Q1 datasheet (SLVSHJ3, Section 1 Features) and applicable to TPS6503320MRGERQ1.
TPS6503320MRGERQ1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 24-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- Converter, Digital Camera
- Voltage - Input:
- 2.5V ~ 5.5V, 4V ~ 18.3V
- Number of Outputs:
- 4
- Voltage - Output:
- 0.9V ~ 1.9V, 1.8V ~ 3.3V, 2.5V ~ 4V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 24-VQFN (4x4)
TPS6503320MRGERQ1 FAQ
1.How can I place an order for TPS6503320MRGERQ1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TPS6503320MRGERQ1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TPS6503320MRGERQ1 reliable?
The price and inventory of TPS6503320MRGERQ1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TPS6503320MRGERQ1 is usually 5 days.
3.What payment methods are accepted for TPS6503320MRGERQ1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TPS6503320MRGERQ1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TPS6503320MRGERQ1?
TPS6503320MRGERQ1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TPS6503320MRGERQ1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TPS6503320MRGERQ1?
For technical support, including TPS6503320MRGERQ1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TPS6503320MRGERQ1 requirements.
6.How does Aetrix verify that TPS6503320MRGERQ1 is sourced from the original manufacturer or authorized distributors?
All TPS6503320MRGERQ1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TPS6503320MRGERQ1 meets industry standards.
7.What is the process for return or replacement of TPS6503320MRGERQ1?
All TPS6503320MRGERQ1 units undergo pre-shipment inspection (PSI). If there is an issue with TPS6503320MRGERQ1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TPS6503320MRGERQ1 part is unused and in its original packaging.
Return procedure for TPS6503320MRGERQ1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TPS6503320MRGERQ1 Tags

-
TPS51206DSQR
Texas Instruments

-
TPS51200DRCR
Texas Instruments

-
TPS51200DRCT
Texas Instruments

-
TPS62740DSSR
Texas Instruments

-
TPS51100DGQR
Texas Instruments
-
NCP51200MNTXG
onsemi
-
NCP51400MNTXG
onsemi

-
RT9026GSP
Richtek USA Inc.

-
LP2998MRX/NOPB
Texas Instruments

-
TPS51200QDRCRQ1
Texas Instruments

-
DPA423GN-TL
Power Integrations

-
LM10011SD/NOPB
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

