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Texas Instruments TPS650860A0RSKT
- Part No.:
- TPS650860A0RSKT
- Manufacturer:
- Texas Instruments
- Category:
- Special Purpose Regulators
- Package:
- 64-VFQFN Exposed Pad
- Datasheet:
-
TPS650860A0RSKT.pdf
- Description:
- IC REG CTRLR FPGA 11OUT 64VQFN
- Quantity:
- Payment:
- Shipping:
Inventory:391
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Product details
Overview
TPS650860A0RSKT from Texas Instruments is a configurable multirail power-management IC (PMU) for multicore processors and SoCs, integrating six synchronous buck controllers (BUCK1–BUCK6), three LDOs (LDOA1/A2/A3), one VTT LDO, two 5-V fixed LDOs (LDO5P0/LDO3P3), and three load switches. It supports 5.6 V–21 V input, delivers up to 3 A per DCS-Control buck rail, and enables I²C-based dynamic voltage scaling (DVS) with 10-mV or 25-mV steps across all SMPS outputs.
For engineers reviewing the TPS650860A0RSKT datasheet, TPS650860A0RSKT pinout, TPS650860A0RSKT application, or TPS650860A0RSKT equivalent, this PMIC provides factory-programmable power sequencing, thermal monitoring, six GPIOs for rail enable/sleep control, four GPOs for power-good signaling, and interrupt-driven fault reporting - critical for embedded PCs, PLCs, and DDR4/DDR5 memory-terminated systems requiring tight voltage accuracy and fast transient response.
Technical Context
The TPS650860A0RSKT implements dual topology regulation: D-CAP2™ for BUCK1/BUCK2/BUCK6 (5.6–21 V input, up to 7 A scalable via external FETs) and DCS-Control™ for BUCK3/BUCK4/BUCK5 (4.5–5.5 V input, fixed 3 A output). Each buck includes remote sensing (FBx, FBGNDx), programmable current limit (ILIMx), auto-discharge (RDIS), and slew-rate-controlled DVS (2.5–3.125 mV/µs).
It integrates three adjustable LDOs: LDOA1 (1.35–3.3 V, 200 mA), LDOA2/A3 (0.7–1.5 V, 600 mA each), plus dedicated VTT LDO (±0.5 A, VDDQ/2 tracking), LDO5P0 (5 V, 180 mA), and LDO3P3 (3.3 V, 40 mA). All rails support I²C DVS, power-good monitoring, and configurable enable/sleep entry via six CTL pins.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VIN Range | 5.6 V to 21 V for BUCK1/2/6; 4.5 V to 5.5 V for BUCK3/4/5 - supports 2S–4S Li-ion battery packs and 5-V system rails. |
| Buck Output Current | Up to 3 A continuous per BUCK3/4/5; scalable beyond 7 A for BUCK1/2/6 using external FETs - enables high-current core/memory rails. |
| DVS Resolution | 10-mV or 25-mV steps across all six buck outputs - allows precise voltage margining and low-power state transitions. |
| LDO Accuracy | ±2% for LDOA1; ±2% to ±3% for LDOA2/A3 - ensures stable biasing for analog peripherals and DDR termination. |
| I²C Speed | Supports Standard (100 kHz), Fast (400 kHz), and Fast Mode Plus (1 MHz) - enables rapid register access during boot and runtime reconfiguration. |
| Thermal Performance | RθJA = 25.8°C/W (VQFN-64); RθJB = 4.4°C/W - facilitates reliable operation at 85°C ambient with standard PCB copper pour. |
| Shutdown Current | 65 µA - minimizes battery drain in always-on system states. |
Pinout & Package
TPS650860A0RSKT is housed in an 8.0 mm × 8.0 mm, 64-pin VQFN package with exposed thermal pad (RSK suffix), optimized for thermal dissipation and compact layout. The thermal pad must be connected to PCB ground plane via multiple vias.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CTL1–CTL6 | Configurable enable/sleep control inputs | Assignable to power up/down or enter sleep mode for any selected rail group - enables flexible sequencing without external logic. |
| GPO1–GPO4 | Programmable power-good outputs | Configurable as open-drain or push-pull to signal PGOOD status of any rail - simplifies system-level power monitoring. |
| FBVOUT1–FBVOUT6, FB3–FB5, VTTFB | Remote feedback sense inputs | Connect directly to output capacitor terminals - eliminates IR drop errors and ensures ±0.5% regulation accuracy under load. |
| DRVH1–DRVH6, DRVL1–DRVL6 | High-side/low-side gate drivers | Drive external N-channel MOSFETs with RDS(ON) < 96 mΩ at 1.8 V - supports efficient discrete power stages. |
| CLK / DATA | I²C interface signals | Enable full register read/write access for DVS, sequencing, fault logging, and thermal management - no additional MCU firmware required. |
Key Features
| Feature | Design Value |
|---|---|
| Factory OTP programming | Enables permanent configuration of power-up sequence, default voltages, and rail grouping - eliminates boot-time I²C initialization overhead. |
| DCS-Control™ topology (BUCK3/4/5) | Delivers <10 µs transient response with minimal output capacitance - ideal for DDR memory VDDQ and processor I/O rails. |
| VTT LDO with VDDQ/2 tracking | Provides ±0.5 A sink/source capability with automatic tracking to half the VDDQ voltage - meets JEDEC DDR4/DDR5 termination specs. |
| Integrated 5-V LDO (LDO5P0) | Supplies gate drivers and LDOA1 with 4.9–5.1 V output at 180 mA - eliminates need for external 5-V supply in compact designs. |
| Thermal shutdown & hot-alert | Triggers hard shutdown at 130–160°C (TCRIT) and issues interrupt at 110–120°C (THOT) - protects SoC and PMIC under overload or poor airflow. |
Applications
| Residential Gateway Power System | Industrial PLC Core Supply |
|---|---|
|
Use Scenario: Powers ARM-based SoC, DDR3/4 memory, Ethernet PHYs, and USB controllers from single 12-V input. IC Role / Device Role: Centralized PMU managing eight independent rails: six bucks for CPU/GPU/I/O, VTT for DDR, and LDOs for analog bias. Use Value: Reduces BOM count by consolidating discrete regulators; factory OTP eliminates boot firmware dependency for power sequencing. |
Use Scenario: Supplies dual-core Cortex-R5 processor, FPGA fabric, CAN transceivers, and isolated I/O modules in harsh 0–70°C environments. IC Role / Device Role: Configurable multirail controller with thermal monitoring, programmable UVLO thresholds, and robust ESD protection (±1000 V HBM). Use Value: Enables deterministic power-up timing and safe brownout recovery - critical for deterministic real-time control loops. |
| Embedded PC Platform | POS Terminal Mainboard |
|
Use Scenario: Delivers core voltage (1.05 V), SoC I/O (1.8 V), DDR4 VDDQ (1.2 V), VTT (0.6 V), and 3.3-V/5-V peripherals from 19-V adapter. IC Role / Device Role: Multifunction PMIC with DCS-Control bucks for fast load transients and integrated VTT LDO meeting DDR4 JEDEC spec. Use Value: Achieves <50 mV output ripple under 2-A step load - ensures signal integrity on high-speed memory buses. |
Use Scenario: Powers ARM Cortex-A53 SoC, touchscreen controller, thermal printer driver, and secure element from 12-V DC input. IC Role / Device Role: Single-chip solution providing sequenced 1.5-V core, 3.3-V I/O, 5-V USB, and 1.2-V DDR termination with I²C runtime adjustment. Use Value: Supports dynamic DVS during low-power display modes - extends battery life in portable POS units. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar multirail PMU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPS650861RSKT | Same pinout and feature set, but factory-programmed with different default OTP settings - no hardware change required. | Targeted for automotive infotainment with extended temperature qualification (–40°C to 105°C) and AEC-Q100 Grade 2 compliance. | Select when automotive qualification or preconfigured sequencing for specific SoC boot flow is required. |
| TPS659122ZWSR | Smaller 5-mm × 5-mm WCSP package; fewer bucks (4 vs. 6); no VTT LDO; supports only 2.7–5.5 V input. | Designed for mobile/tablet SoCs (e.g., OMAP, Snapdragon) with lower power budgets and space-constrained layouts. | Select for handheld devices where board area is critical and DDR termination is handled externally. |
Compared with TPS650860A0RSKT, TPS650861RSKT offers identical electrical performance and pin compatibility with automotive-grade reliability, while TPS659122ZWSR trades rail count and VTT integration for footprint reduction - making the former a direct functional upgrade and the latter a size-optimized alternative for non-DDR4 systems.
Availability
TPS650860A0RSKT is available at Aetrix Electronics and suitable for residential gateways, industrial PLCs, embedded PCs, and POS terminals requiring stable component supply, long-term lifecycle support, and guaranteed traceable sourcing.
Supply support for TPS650860A0RSKT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and power management technologies, with decades of expertise in high-reliability PMIC design for computing and industrial markets.
The TPS650860 product line was engineered specifically for multicore processors and SoCs demanding tightly regulated, sequenced, and dynamically scalable power - targeting DDR4/DDR5 memory interfaces, real-time control systems, and energy-efficient edge computing platforms.
FAQ
What is the input voltage range supported by the TPS650860A0RSKT?
The TPS650860A0RSKT supports two distinct input domains: BUCK1/2/6 accept 5.6 V to 21 V (enabling 2S–4S Li-ion battery operation), while BUCK3/4/5 operate from 4.5 V to 5.5 V (suitable for regulated 5-V system rails). LDOs and load switches derive power from VSYS, PVINx, or V5ANA pins within their respective rated ranges - all verified in Section 4.3 of the SWCS128A datasheet.
Does the TPS650860A0RSKT include DDR memory termination capability?
Yes, the TPS650860A0RSKT integrates a dedicated VTT LDO (pin 47: VTT) with ±0.5 A sink/source capability and automatic VDDQ/2 tracking (via VTTFB pin). It meets JEDEC DDR4 and DDR5 termination specifications, supporting VTT output accuracy of ±0.5% and fast transient response - confirmed in Sections 1.1, 4.9, and Figure 1-1 of the datasheet.
How many independent power rails does the TPS650860A0RSKT provide?
The TPS650860A0RSKT provides six synchronous buck regulators (BUCK1–BUCK6), three adjustable LDOs (LDOA1/A2/A3), one VTT LDO, two fixed-output LDOs (LDO5P0 at 5 V and LDO3P3 at 3.3 V), and three load switches (SWA1/SWB1/SWB2) - totaling 13 independently controllable power domains, each with I²C-addressable configuration and monitoring.
Can the TPS650860A0RSKT be used without I²C configuration?
Yes - the TPS650860A0RSKT includes factory-programmed OTP memory that defines default voltages, sequencing order, and rail enable states. It powers up and operates autonomously without I²C initialization. I²C is optional for runtime DVS, fault logging, or dynamic reconfiguration - as detailed in Sections 1.3 and 5.6 of the datasheet.
What package type and thermal characteristics does the TPS650860A0RSKT use?
The TPS650860A0RSKT uses an 8.0 mm × 8.0 mm, 64-pin VQFN package with exposed thermal pad (RSK). Its thermal metrics include RθJA = 25.8°C/W and RθJB = 4.4°C/W, enabling reliable operation at 85°C ambient with standard 2-oz copper PCB layout - specified in Section 4.4 and Mechanical Packaging documentation.
TPS650860A0RSKT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- D-CAP2™
- Package/Case:
- 64-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- Controller, Multicore, CPU, FPGA, SOC’s
- Voltage - Input:
- 5.6V ~ 21V
- Number of Outputs:
- 11
- Voltage - Output:
- Multiple
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-VQFN (8x8)
TPS650860A0RSKT FAQ
1.How can I place an order for TPS650860A0RSKT through Aetrix?
Please submit a Request for Quotation (RFQ) for TPS650860A0RSKT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TPS650860A0RSKT reliable?
The price and inventory of TPS650860A0RSKT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TPS650860A0RSKT is usually 5 days.
3.What payment methods are accepted for TPS650860A0RSKT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TPS650860A0RSKT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TPS650860A0RSKT?
TPS650860A0RSKT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TPS650860A0RSKT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TPS650860A0RSKT?
For technical support, including TPS650860A0RSKT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TPS650860A0RSKT requirements.
6.How does Aetrix verify that TPS650860A0RSKT is sourced from the original manufacturer or authorized distributors?
All TPS650860A0RSKT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TPS650860A0RSKT meets industry standards.
7.What is the process for return or replacement of TPS650860A0RSKT?
All TPS650860A0RSKT units undergo pre-shipment inspection (PSI). If there is an issue with TPS650860A0RSKT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TPS650860A0RSKT part is unused and in its original packaging.
Return procedure for TPS650860A0RSKT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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