Texas Instruments TPS65086100RSKR

Overview

TPS65086100RSKR from Texas Instruments is a programmable multirail power-management IC (PMIC) for multicore processors, FPGAs, and embedded systems. It integrates three D-CAP2™ synchronous step-down controllers (5.6V–21V input, up to 30A scalable via external FETs), three DCS-Control synchronous converters (3V–5.5V input, 3A each), three adjustable LDOs, a DDR VTT LDO, and three slew-rate-controlled load switches - all in a single 64-pin VQFN package.

For engineers reviewing the TPS65086100RSKR datasheet, TPS65086100RSKR pinout, TPS65086100RSKR application, or TPS65086100RSKR equivalent, this device supports I²C-based dynamic voltage scaling (DVS) across six SMPS rails, OTP-programmable sequencing, thermal monitoring, and flexible GPIO configuration for system-level power control in industrial vision, test equipment, and embedded PCs.

Technical Context

The TPS65086100RSKR implements dual topology regulation: D-CAP2™ for high-transient-response core rails (BUCK1/2/6) with 10 mV or 25 mV DVS steps, and DCS-Control for memory/system rails (BUCK3/4/5) with 25 mV DVS resolution. Each controller supports remote sensing, programmable current limiting via ILIM pins, and auto-discharge control.

Its digital subsystem includes two banks of one-time programmable (OTP) memory for voltage/sequence defaults, six configurable GPIs (CTL1–CTL6) for rail enable/sleep control, four GPOs for power-good signaling, and an open-drain IRQB interrupt output - all managed via I²C at up to 1 MHz (Fast Mode Plus).

Key Specifications

Pinout & Package

VQFN-64 (RSKR) package with 8.0 mm × 8.0 mm body size and exposed thermal pad connected to PGND. Thermal pad requires multiple vias to internal ground plane for optimal thermal performance (R_θJB = 4.4°C/W).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar multirail PMIC applications.

Compared with TPS65086100RSKR, TPS650864100RSKR offers higher integration for 5V generation but reduced LDO flexibility, while MAX77812AEWL+T trades OTP autonomy and DDR support for footprint reduction and mobile-optimized efficiency.

Availability

TPS65086100RSKR is available at Aetrix Electronics and suitable for programmable logic controllers, machine vision cameras, video surveillance systems, test and measurement instruments, and embedded PCs requiring stable component supply, long-term lifecycle support, and consistent OTP programming services.

Supply support for TPS65086100RSKR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and power management technologies, with decades of expertise in high-reliability industrial and automotive power solutions.

The TPS650861 product line delivers highly configurable, OTP-programmable PMICs for multicore processors and FPGAs - designed to simplify power architecture in complex embedded systems while ensuring robust thermal, sequencing, and voltage regulation performance.

FAQ

What is the primary function of the TPS65086100RSKR in a system?

The TPS65086100RSKR serves as a fully integrated, programmable power-management IC that supplies and sequences multiple voltage rails for multicore processors, FPGAs, and embedded systems. It combines three D-CAP2™ controllers, three DCS-Control converters, three adjustable LDOs, a DDR VTT LDO, and three load switches - all coordinated via I²C and factory-programmable OTP memory. Its role is to replace 10+ discrete regulators while enabling deterministic, low-risk power-up in industrial and vision applications.

Does the TPS65086100RSKR support dynamic voltage scaling (DVS)?

Yes, the TPS65086100RSKR supports I²C-based dynamic voltage scaling across all six SMPS rails. BUCK1/2/6 controllers offer 10 mV steps from 0.41V to 1.67V or 25 mV steps from 1V to 3.575V; BUCK3/4/5 converters support 25 mV steps from 0.425V to 3.575V. This enables real-time core voltage adjustment for performance/power optimization in SoCs and FPGAs - a key capability confirmed in TI's SWCS142A datasheet Section 1 and Table 5.7.

How is power sequencing configured on the TPS65086100RSKR?

Power sequencing on the TPS65086100RSKR is configured using two banks of one-time programmable (OTP) memory. These banks store default output voltages and precise power-up/down timing relationships between rails - eliminating runtime I²C initialization. Sequencing is defined during manufacturing or by authorized distributors using dedicated programming hardware and 7V signals on CTL4/IRQB pins, as specified in Section 6.7 and Figure 6-1 of the datasheet.

What thermal protection features does the TPS65086100RSKR include?

The TPS65086100RSKR includes dual thermal thresholds: a hot warning flag triggers at 110°C–120°C (THOT), and critical thermal shutdown activates at 130°C–160°C (TCRIT), both with 10°C hysteresis. These thresholds are monitored continuously by an on-die thermal sensor and reported via IRQB interrupt or I²C registers. The device's VQFN-64 package achieves R_θJB = 4.4°C/W, supporting reliable operation up to +85°C ambient in properly cooled industrial PCBs.

Can the TPS65086100RSKR be used for DDR memory termination?

Yes, the TPS65086100RSKR includes a dedicated VTT LDO with remote sensing (VTTFB pin) specifically designed for DDR memory termination. It regulates VTT to half the FBVOUT6 reference voltage (typically 0.675V for DDR3 or 0.6V for DDR4), maintaining ±1% accuracy across load and temperature. The VTT output (pin 47) supports up to 3A sink/source and requires two 22µF ceramic capacitors, as detailed in Section 5.9 and Figure 4-1 of the datasheet.