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Texas Instruments TPS65086100RSKT
- Part No.:
- TPS65086100RSKT
- Manufacturer:
- Texas Instruments
- Category:
- Special Purpose Regulators
- Package:
- 64-VFQFN Exposed Pad
- Datasheet:
-
TPS65086100RSKT.pdf
- Description:
- IC REG CTRLR FPGA 13OUT 64VQFN
- Quantity:
- Payment:
- Shipping:
Inventory:891
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Product details
Overview
TPS65086100RSKT from Texas Instruments is a programmable multirail power-management IC (PMIC) for multicore processors, FPGAs, and embedded systems. It integrates three D-CAP2™ synchronous step-down controllers (5.6V–21V input, up to 30A scalable via external FETs), three DCS-Control 3A converters (3V–5.5V input), three adjustable LDOs (0.7V–3.3V, up to 600mA), a DDR VTT LDO, and three slew-controlled load switches. It delivers precise rail sequencing and voltage regulation in industrial vision and test equipment.
For engineers reviewing the TPS65086100RSKT datasheet, TPS65086100RSKT pinout, TPS65086100RSKT application, or TPS65086100RSKT equivalent, key selection criteria include OTP-programmable sequencing, I²C DVS control across six buck rails, thermal shutdown at 145°C, 64-pin VQFN package with exposed thermal pad, and support for high-transient applications like FPGA core and memory power domains.
Technical Context
The TPS65086100RSKT implements dual topology regulation: D-CAP2™ for high-bandwidth, low-ESR output capacitor compatibility on its three high-voltage controllers (BUCK1/2/6), and DCS-Control for fast transient response on its three 3A low-voltage converters (BUCK3/4/5). Each buck rail supports independent I²C DVS with 10mV or 25mV steps and programmable current limiting via external resistors on ILIM pins.
Its OTP memory enables one-time configuration of default voltages, power-up/down sequences, and GPIO assignments (CTL1–CTL6 as enable/sleep inputs; GPO1–GPO4 as power-good indicators or user-controlled outputs). The device uses a shared VSYS input (5.6V–21V) for internal LDOs and supplies gate drivers via dedicated DRV5V pins, while V5ANA biases BUCK3/4/5 regulation independently.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VIN Range | 5.6V–21V for controllers; 3V–5.5V for converters - enables single-rail system input powering both high- and low-voltage domains. |
| Buck Output Voltage | 0.41V–1.67V (10mV steps) or 1V–3.575V (25mV steps) - supports modern processor core and I/O voltage scaling requirements. |
| Max Output Current | Up to 30A scalable via external FETs on controllers; 3A fixed per converter - accommodates high-power SoCs and FPGA fabric rails. |
| I²C Interface Speed | Standard (100kHz), Fast (400kHz), Fast Plus (1MHz) - allows real-time dynamic voltage scaling without bus contention in multi-PMIC systems. |
| Thermal Shutdown | 145°C critical threshold with 10°C hysteresis - protects silicon integrity during sustained overload or poor PCB thermal design. |
| Shutdown Current | 65µA typical - ensures ultra-low quiescent consumption in standby mode for battery-backed or energy-sensitive systems. |
| Package | VQFN-64 (8mm × 8mm) with exposed thermal pad - provides low thermal resistance (RθJB = 4.4°C/W) for high-power density layouts. |
Pinout & Package
VQFN-64 (RSK) package with 8.00mm × 8.00mm body size and exposed thermal pad connected to PCB ground plane via multiple vias for optimal thermal and electrical performance.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| FBVOUT1–FBVOUT6 | Remote feedback sense input | Enables Kelvin sensing for accurate regulation; connect to positive terminal of respective output capacitor. |
| ILIM1, ILIM2, ILIM6 | Current limit set input | Resistor-to-ground sets valley current limit for BUCK1/2/6; supports scalable external FET selection. |
| DRVH1–DRVH6, DRVL1–DRVL6 | High-/low-side gate driver output | Direct drive for external N-channel MOSFETs; sink/source capability specified per driver stage. |
| CTL1–CTL6 | Active-high enable/sleep control input | Configurable to assert or deassert groups of rails; CTL3/CTL6 support sleep-state entry with alternate voltage levels. |
| GPO1–GPO4 | Programmable general-purpose output | Can reflect PGOOD status of any rail or be controlled by I²C register - enables flexible system-level power sequencing signaling. |
| IRQB | Open-drain interrupt output | Signals thermal fault, UVLO, or OTP programming completion; requires 7V supply during OTP burn. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-regulator topology | D-CAP2™ for high-current controllers + DCS-Control for 3A converters - achieves <10µs transient response with small ceramic output capacitors. |
| OTP-programmable sequencing | Two banks of one-time programmable memory - enables factory-set power-up order, delay timing, and rail dependencies without firmware overhead. |
| I²C DVS resolution | 10mV steps (0.41V–1.67V) and 25mV steps (1V–3.575V) across six buck rails - meets tight voltage tolerance requirements of advanced SoCs and DDR interfaces. |
| VTT LDO with remote sensing | VTT output regulated using VTTFB feedback - maintains precise DDR termination voltage under varying load and board trace impedance. |
| Slew-controlled load switches | RDS(ON) < 96mΩ @ 1.8V input; voltage drop < 1.5% nominal - prevents inrush current damage and enables hot-swap capability for peripheral modules. |
Applications
| Machine Vision Camera | Video Surveillance System |
|---|---|
Use Scenario: High-resolution CMOS image sensor with programmable gain, ADC, and FPGA-based preprocessing. IC Role / Device Role / Timing Role: PMIC supplies core (0.85V), I/O (1.8V), DDR3 (1.5V), and analog (3.3V) rails with synchronized startup and dynamic voltage scaling during exposure mode changes. Use Value: D-CAP2™ and DCS-Control topologies deliver sub-10µs transient recovery, preventing image corruption during rapid sensor clock or gain adjustments. |
Use Scenario: Multi-channel IP camera with H.265 encoding, PoE+ power input, and thermal management circuitry. IC Role / Device Role / Timing Role: Manages power sequencing between PoE interface (VSYS), SoC core, video encoder, and IR illuminator drivers - all coordinated via OTP-defined timing. Use Value: Six independent I²C DVS rails allow real-time adjustment of encoder voltage (1.1V) and memory interface (1.35V) to balance thermal load and video quality. |
| Test and Measurement Equipment | Embedded PC Platform |
Use Scenario: Portable oscilloscope with mixed-signal FPGA, high-speed ADC/DAC, and touch display controller. IC Role / Device Role / Timing Role: Provides isolated, low-noise 1.2V (FPGA core), 2.5V (ADC reference), 3.3V (interface), and 5V (display backlight) rails with independent PGOOD monitoring. Use Value: Three LDOs (LDOA1/A2/A3) and dedicated LDO5P0/LDO3P3 ensure clean analog supplies; VTT LDO supports DDR4 termination for high-speed memory buffers. |
Use Scenario: Fanless industrial PC with quad-core ARM SoC, eMMC storage, and dual Gigabit Ethernet PHYs. IC Role / Device Role / Timing Role: Sequences boot from 5V standby (LDO5P0), enables SoC core (0.95V), GPU (1.05V), DDR4 (1.2V), and PHY supplies (2.5V/3.3V) in strict dependency order. Use Value: CTL1–CTL6 enable pins allow hardware-triggered power state transitions (e.g., S0→S3); GPOs signal rail readiness to baseboard management controller. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar multirail PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPS650864100RSKT | Same pinout and OTP architecture; differs only in factory-programmed default voltages and sequence - no hardware or firmware change required. | Pre-configured for Xilinx Zynq UltraScale+ MPSoC; lacks flexibility for custom SoC sequencing logic. | Select when targeting Zynq UltraScale+ platforms and factory OTP programming is acceptable. |
| TPS65912200ZQWR | 48-pin VQFN; integrates fewer rails (2 controllers + 4 converters + 2 LDOs); no VTT LDO; supports only 100kHz/400kHz I²C. | Targeted at lower-complexity ARM Cortex-A processors; insufficient for DDR4 termination or >30A FPGA designs. | Select for cost-sensitive Cortex-A7/A53 designs where rail count and DDR support are secondary to footprint reduction. |
Compared with TPS65086100RSKT, the TPS650864100RSKT offers identical functionality with preloaded configuration, while the TPS65912200ZQWR reduces integration depth and DDR support - making the TPS65086100RSKT uniquely suited for high-end FPGA and multicore SoC power delivery requiring full rail count, VTT, and OTP flexibility.
Availability
TPS65086100RSKT is available at Aetrix Electronics and suitable for machine vision cameras, video surveillance systems, and test and measurement equipment requiring stable component supply, long-term lifecycle support, and consistent OTP programming services.
Supply support for TPS65086100RSKT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and power management technologies, with over 50 years of innovation in high-reliability power solutions.
The TPS650861 product line was designed specifically for high-performance computing subsystems in industrial automation and edge AI - delivering programmable, multi-rail power with integrated sequencing, thermal protection, and I²C configurability.
FAQ
What is the primary function of the TPS65086100RSKT in a multicore processor system?
The TPS65086100RSKT serves as the central power-management IC, providing precisely sequenced, programmable voltages to processor cores, I/O banks, DDR memory, and auxiliary peripherals. Its OTP memory stores default rail configurations and startup timing, enabling reliable boot without host processor intervention. The TPS65086100RSKT integrates six buck regulators, three LDOs, a VTT LDO, and load switches - eliminating discrete power components and reducing layout complexity in space-constrained designs.
How does the TPS65086100RSKT support dynamic voltage scaling (DVS) for FPGA applications?
The TPS65086100RSKT supports DVS via its I²C interface, allowing real-time adjustment of six buck rail outputs in 10mV or 25mV steps across defined voltage ranges (e.g., 0.41V–1.67V or 1V–3.575V). This enables FPGA fabric and memory voltage optimization during different operational modes (e.g., high-performance vs. low-power states). The TPS65086100RSKT's D-CAP2™ and DCS-Control topologies maintain stability and fast transient response during DVS transitions, preventing logic errors or memory corruption.
Can the TPS65086100RSKT be used without programming its OTP memory?
Yes, the TPS65086100RSKT operates with factory-default settings, but those defaults are minimal and not application-specific. Full functionality - including rail sequencing, voltage assignment, GPIO mapping, and sleep-mode behavior - requires OTP programming. Unprogrammed units will power up with basic regulation but lack coordinated sequencing or optimized DVS tables. The TPS65086100RSKT must be programmed before deployment in production systems requiring deterministic power behavior.
What thermal management features does the TPS65086100RSKT include?
The TPS65086100RSKT includes die temperature monitoring with two thresholds: THOT (115°C typical) for warning alerts and TCRIT (145°C typical) for automatic thermal shutdown. Both thresholds have 10°C hysteresis to prevent oscillation. The device also features an exposed thermal pad (connected to PCB ground) and low junction-to-board thermal resistance (RθJB = 4.4°C/W), enabling efficient heat dissipation in high-current applications. These features ensure safe operation of the TPS65086100RSKT under sustained load in enclosed industrial enclosures.
Is the TPS65086100RSKT pin-compatible with other devices in the TPS65086x family?
Yes, all TPS65086x variants - including TPS65086100RSKT, TPS650864100RSKT, and TPS65086000RSKT - share identical 64-pin VQFN (RSK) packaging, pinout, and mechanical footprint. Differences exist only in factory-programmed OTP content (default voltages, sequencing, and GPIO assignments), not in electrical connectivity or thermal pad layout. This allows direct substitution during prototyping or rework, provided firmware and system-level sequencing logic accommodate the new OTP configuration.
TPS65086100RSKT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- D-CAP2™
- Package/Case:
- 64-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- Controller, Multicore, CPU, FPGA, SOC’s
- Voltage - Input:
- 5.6V ~ 21V
- Number of Outputs:
- 13
- Voltage - Output:
- Multiple
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-VQFN (8x8)
TPS65086100RSKT FAQ
1.How can I place an order for TPS65086100RSKT through Aetrix?
Please submit a Request for Quotation (RFQ) for TPS65086100RSKT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TPS65086100RSKT reliable?
The price and inventory of TPS65086100RSKT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TPS65086100RSKT is usually 5 days.
3.What payment methods are accepted for TPS65086100RSKT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TPS65086100RSKT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TPS65086100RSKT?
TPS65086100RSKT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TPS65086100RSKT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TPS65086100RSKT?
For technical support, including TPS65086100RSKT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TPS65086100RSKT requirements.
6.How does Aetrix verify that TPS65086100RSKT is sourced from the original manufacturer or authorized distributors?
All TPS65086100RSKT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TPS65086100RSKT meets industry standards.
7.What is the process for return or replacement of TPS65086100RSKT?
All TPS65086100RSKT units undergo pre-shipment inspection (PSI). If there is an issue with TPS65086100RSKT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TPS65086100RSKT part is unused and in its original packaging.
Return procedure for TPS65086100RSKT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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