Texas Instruments TPS65086401RSKR

Overview

TPS65086401RSKR from Texas Instruments is a configurable multirail power-management IC (PMIC) designed specifically for Xilinx Zynq Ultrascale+ MPSoCs (ZU2–ZU5), integrating three D-CAP2™ step-down controllers (5.6V–21V input), three DCS-Control synchronous buck converters (3V–5.5V input, up to 3A each), and six LDOs including VTT termination. It delivers precise I²C-controlled voltage scaling (10mV/25mV steps) and supports DDR memory termination in machine vision and embedded PC applications.

For engineers reviewing the TPS65086401RSKR datasheet, TPS65086401RSKR pinout, TPS65086401RSKR application, or TPS65086401RSKR equivalent, this page provides verified technical context, validated pin functions, confirmed rail configurations per device variant, thermal performance data, and real-world selection guidance for FPGA/MPSoC power architecture design.

Technical Context

The TPS65086401RSKR implements six independent voltage rails with factory-programmed OTP defaults optimized for ZU2–ZU5 devices: BUCK1 at 1.8V (25mV step), BUCK2 at 0.85V (10mV), BUCK3 at 0.85V (25mV), BUCK4/BUCK5 at 3.3V (25mV), and BUCK6 at 1.5V/1.2V/1.1V (10mV). Its dual topology-D-CAP2™ for high-transient core rails and DCS-Control™ for system/memory rails-enables fast load-step response while maintaining stability with small external passives.

Control is implemented via a 1MHz-capable I²C interface supporting standard/fast/fast-plus modes, six configurable GPI pins (CTL1–CTL6) for enable/sleep sequencing, and four programmable GPOs for power-good monitoring. Thermal management relies on an 8mm × 8mm VQFN-64 package with exposed thermal pad (R_θJB = 4.4°C/W) and integrated die temperature monitoring with critical shutdown at 130–160°C.

Key Specifications

Pinout & Package

TPS65086401RSKR uses an 8mm × 8mm, 64-pin VQFN package (RSKR) with exposed thermal pad connected to PCB ground plane for optimal thermal dissipation (R_θJB = 4.4°C/W). Pin functions are fully defined in TI's SWCS138G datasheet, with dedicated terminals for six buck regulators, three LDOs, two load switches, VTT termination, I²C, control inputs (CTL1–CTL6), and general-purpose outputs (GPO1–GPO4).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar multirail PMIC applications.

Compared with TPS65086401RSKR, TPS6508640RSKR offers higher base I/O voltage (3.3V vs. 1.8V) but less flexible BUCK6 options, while TPS6508641RSKR trades factory-set simplicity for external feedback precision on BUCK1 - making TPS65086401RSKR optimal for ZU2–ZU5 designs needing out-of-box 1.8V core, 3.3V I/O, and triple-voltage BUCK6 sequencing.

Availability

TPS65086401RSKR is available at Aetrix Electronics and suitable for machine vision cameras, embedded PCs, and portable ultrasound systems requiring stable component supply, long-term lifecycle support, and guaranteed traceability for medical and industrial deployments.

Supply support for TPS65086401RSKR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and power management technologies, with decades of expertise in high-reliability power solutions for FPGA and SoC platforms.

The TPS650864 family was engineered to consolidate power delivery for Xilinx Zynq Ultrascale+ MPSoCs and FPGAs - reducing bill-of-materials count, minimizing PCB area, and simplifying firmware-controlled power sequencing in space-constrained embedded systems.

FAQ

What is the primary target application for TPS65086401RSKR?

TPS65086401RSKR is specifically configured for Xilinx Zynq Ultrascale+ ZU2–ZU5 MPSoCs, providing factory-programmed rail voltages (1.8V BUCK1, 0.85V BUCK2, 3.3V BUCK4/5, 1.5V/1.2V/1.1V BUCK6) and sequencing logic optimized for machine vision, embedded PCs, and portable ultrasound systems. Its OTP settings eliminate manual configuration for these devices.

Does TPS65086401RSKR support DDR4 VTT termination?

Yes, TPS65086401RSKR integrates a dedicated VTT LDO with remote sensing (VTTFB pin) and accepts 1.5V–5.5V input on PVINVTT. It regulates VTT to half the BUCK6 output voltage (e.g., 0.75V for 1.5V BUCK6), meeting JEDEC DDR4 VTT accuracy and transient response requirements without external components.

How does the I²C interface of TPS65086401RSKR support dynamic voltage scaling?

TPS65086401RSKR supports I²C DVS with 10mV steps (0.41V–1.67V) and 25mV steps (1V–3.575V) across all six buck regulators. The interface operates up to 1MHz (fast mode plus), enabling sub-10µs voltage updates - critical for real-time power optimization in Zynq-based AI inference or video encoding workloads.

What thermal performance can be expected from TPS65086401RSKR in a typical 4-layer PCB?

With its 8mm × 8mm VQFN-64 package and exposed thermal pad, TPS65086401RSKR achieves R_θJB = 4.4°C/W. On a standard 4-layer board with 2oz copper, thermal vias under the pad, and 2in² ground pour, it sustains full load at 85°C ambient - verified by TI's SWCS138G thermal characterization data.

Can TPS65086401RSKR replace TPS6508640RSKR in a ZU5 design?

TPS65086401RSKR is preferred for ZU5 due to its 1.8V BUCK1 default (vs. 3.3V on TPS6508640RSKR) and triple-voltage BUCK6 (1.5V/1.2V/1.1V), which align with ZU5 VCCINT and auxiliary rail requirements. Swapping requires verifying BUCK1 voltage compatibility and updating OTP-dependent sequencing logic in firmware.