Texas Instruments TPS6508640RSKR

Overview

TPS6508640RSKR from Texas Instruments is a configurable multirail power-management IC (PMIC) designed specifically for Xilinx Zynq Ultrascale+ MPSoCs (ZU7–ZU15). It integrates three D-CAP2™ step-down controllers (5.6V–21V input), three DCS-Control synchronous buck converters (3V–5.5V input, up to 3A each), three adjustable LDOs, a VTT LDO, and three slew-rate-controlled load switches - all in a single 8mm × 8mm VQFN-64 package.

For engineers reviewing the TPS6508640RSKR datasheet, TPS6508640RSKR pinout, TPS6508640RSKR application, or TPS6508640RSKR equivalent, this PMIC delivers factory-programmable rail sequencing, I²C-based dynamic voltage scaling (DVS) with 10mV/25mV steps, thermal monitoring, and flexible enable/sleep control via six GPI/GPO pins - critical for embedded vision, industrial PLC, and FPGA-based systems requiring tight power integrity and compact board space.

Technical Context

The TPS6508640RSKR implements dual topology regulation: D-CAP2™ for high-transient-response core rails (BUCK1/2/6) and DCS-Control for system/memory rails (BUCK3/4/5), both supporting I²C DVS across overlapping 0.41V–1.67V (10mV) and 1V–3.575V (25mV) ranges. Its OTP-configured default outputs - including BUCK1 at 3.3V, BUCK2 at 0.85V/0.9V, and LDOA1 at 2.5V - are optimized for Zynq Ultrascale+ ZU7–ZU15 SoCs.

Power sequencing is managed through six programmable GPIs (CTL1–CTL6) enabling/disabling or entering sleep mode on selected rails, while four GPOs (GPO1–GPO4) can mirror PGOOD status or serve as external enable signals. The open-drain IRQB pin reports thermal events, overcurrent faults, and UVLO conditions per register-mapped interrupt logic.

Key Specifications

Pinout & Package

The TPS6508640RSKR is housed in an 8mm × 8mm, 64-pin VQFN package (RSKR) with an exposed thermal pad that must be connected to PCB ground plane via multiple vias for optimal thermal and electrical performance.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar multirail PMIC applications.

Compared with TPS6508640RSKR, TPS65086401RSKR offers identical topology but ZU2–ZU5-optimized defaults, while TPS6508641RSKR adds Ext FB flexibility at the cost of out-of-box DDR4 readiness - making TPS6508640RSKR the only variant with factory-tuned ZU7–ZU15 sequencing and integrated VTT.

Availability

TPS6508640RSKR is available at Aetrix Electronics and suitable for programmable logic controllers, machine vision cameras, video surveillance systems, test and measurement equipment, and embedded PCs requiring stable component supply, long-term lifecycle assurance, and automotive-grade reliability.

Supply support for TPS6508640RSKR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and power management technologies, with decades of expertise in high-reliability power solutions for industrial and communications infrastructure.

The TPS650864 family is engineered as a configurable PMIC platform for Xilinx MPSoCs and FPGAs - delivering integrated, OTP-programmable power delivery with minimal external components to accelerate development of high-performance embedded systems.

FAQ

What is the primary application target for the TPS6508640RSKR?

The TPS6508640RSKR is specifically configured for Xilinx Zynq Ultrascale+ MPSoCs in the ZU7–ZU15 series. Its factory-programmed OTP settings - including BUCK1 at 3.3V, BUCK2 at 0.85V/0.9V, and LDOA1 at 2.5V - align with the power architecture and boot sequencing requirements of these devices. This makes the TPS6508640RSKR distinct from other variants like TPS65086401RSKR (ZU2–ZU5) or TPS6508641RSKR (Ext FB mode), ensuring plug-and-play compatibility without register reconfiguration.

Does the TPS6508640RSKR include a dedicated VTT regulator for DDR memory?

Yes, the TPS6508640RSKR integrates a dedicated VTT LDO with remote sensing via VTTFB and power input via PVINVTT. It regulates DDR termination voltage referenced to FBVOUT6, supporting JEDEC-compliant DDR4/DDR5 termination accuracy. The VTT LDO is enabled by default in the TPS6508640RSKR OTP configuration, unlike TPS6508641RSKR where it may be disabled - confirming its readiness for ZU7–ZU15 DDR4 memory subsystems without additional circuitry.

How does the TPS6508640RSKR handle power sequencing for complex SoC designs?

The TPS6508640RSKR implements hardware-based sequencing using six programmable GPI pins (CTL1–CTL6), which can be factory-set to enable specific rails or trigger sleep mode entry. For example, CTL3/SLPENB1 and CTL6/SLPENB2 support active-low sleep enable for grouped rails. This eliminates reliance on external supervisors or firmware-driven I²C commands, enabling deterministic, sub-100ms power-up sequences critical for Zynq MPSoC boot reliability.

What are the I²C voltage scaling capabilities of the TPS6508640RSKR?

The TPS6508640RSKR supports two I²C DVS ranges: 0.41V–1.67V in 10mV steps and 1V–3.575V in 25mV steps. These apply to all six buck regulators (BUCK1–BUCK6) and three LDOs (LDOA1–LDOA3). The 10mV granularity enables fine-grained DVFS for ARM cores, while the 25mV range suits I/O and memory rails - all accessible via standard-mode (100kHz), fast-mode (400kHz), or fast-mode-plus (1MHz) I²C transactions.

Is thermal management integrated into the TPS6508640RSKR design?

Yes, the TPS6508640RSKR includes dual thermal thresholds: THOT (110°C–120°C) triggers interrupt alerts via IRQB, while TCRIT (130°C–160°C) initiates automatic shutdown. Its 8mm × 8mm VQFN-64 package features an exposed thermal pad with R_θJB = 4.4°C/W, enabling effective heat dissipation into the PCB ground plane. These features protect both the PMIC and the host Zynq MPSoC from thermal overstress in enclosed industrial enclosures.