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Texas Instruments TPS6508641RSKT
- Part No.:
- TPS6508641RSKT
- Manufacturer:
- Texas Instruments
- Category:
- Special Purpose Regulators
- Package:
- 64-VFQFN Exposed Pad
- Datasheet:
-
TPS6508641RSKT.pdf
- Description:
- IC REG CTLR DGTL CAM 9OUT 64VQFN
- Quantity:
- Payment:
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Product details
Overview
TPS6508641RSKT from Texas Instruments is a configurable multirail power-management IC (PMIC) designed specifically for Xilinx Zynq UltraScale+ MPSoCs (ZU2–ZU5), integrating six synchronous buck controllers/converters, three adjustable LDOs, one VTT LDO, three load switches, and a 5V fixed LDO. It supports 5.6V–21V input, delivers up to 3A per DCS-Control converter, and enables I²C-based dynamic voltage scaling (DVS) in 10mV or 25mV steps across multiple rails. Used in embedded PCs and machine vision cameras requiring tightly sequenced, low-noise core and memory rail supplies.
For engineers reviewing the TPS6508641RSKT datasheet, TPS6508641RSKT pinout, TPS6508641RSKT application, or TPS6508641RSKT equivalent, this page provides verified technical context, validated pin functions, confirmed rail configurations for ZU2–ZU5 devices, real-world thermal performance data (RθJA = 25.8°C/W), and two field-validated alternative PMICs with documented functional trade-offs.
Technical Context
The TPS6508641RSKT implements three D-CAP2™ synchronous buck controllers (BUCK1/BUCK2/BUCK6) for high-current processor core rails and three DCS-Control™ synchronous buck converters (BUCK3/BUCK4/BUCK5) optimized for system memory and I/O rails - all supporting I²C DVS with 10mV or 25mV step resolution. Its OTP-programmed default configuration sets BUCK1 to external feedback mode, BUCK2 to 0.85V, BUCK3 to 1.1V/1.2V, BUCK4 to 3.3V, BUCK5 to 1.2V, and BUCK6 to 1.8V per Table 4-1.
It integrates six GPIOs (CTL1–CTL6) factory-configurable as enable or sleep-entry inputs, four programmable GPOs for power-good signaling, and an open-drain IRQB interrupt output. The 64-pin VQFN (RSK) package features an exposed thermal pad tied to PGND, enabling 125°C max junction temperature operation under sustained 3A loads with proper PCB thermal design.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VIN Range | 5.6V–21V - supports 2S/3S/4S Li-ion battery packs and wall adapters without external pre-regulation. |
| Buck Controllers (3) | D-CAP2 topology with external FETs - scalable current via ILIM pins; BUCK1 configured for external feedback in TPS6508641. |
| Buck Converters (3) | DCS-Control topology, 3V–5.5V input, up to 3A output - optimized for fast transient response on memory rails. |
| I²C Interface | Supports 100kHz/400kHz/1MHz modes - enables real-time DVS, sequencing control, and fault monitoring by host SoC or EC. |
| LDO Outputs | LDOA1 (1.35–3.3V/200mA), LDOA2/LDOA3 (0.7–1.5V/600mA each), LDO3P3 (3.3V), LDO5P0 (5V) - fully I²C-adjustable or fixed. |
| VTT LDO | DDR termination regulator with VTTFB remote sense - maintains precise VDDQ/2 tracking for DDR3/DDR4 interfaces. |
| Package | 64-pin VQFN (RSK), 8mm × 8mm with thermal pad - RθJA = 25.8°C/W enables high-power density layout in space-constrained MPSoC designs. |
Pinout & Package
TPS6508641RSKT uses an 8mm × 8mm, 64-pin VQFN package (RSK) with exposed thermal pad connected to PGND. Pin functions are OTP-configurable and application-specific; the device includes dedicated gate drivers (DRVH/DRVL), feedback (FBx), bootstrap (BOOTx), current limit (ILIMx), and power input (PVINx) pins for each buck channel, plus dedicated LDO outputs (LDOA1/A2/A3, LDO3P3, LDO5P0), load switch terminals (SWA1/SWB1/SWB2), and interface signals (CLK/DATA/CTLx/GPOx/IRQB).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| FBVOUT1, FBVOUT2, FBVOUT6 | Remote feedback sense for BUCK1/BUCK2/BUCK6 | Enables precision regulation using external resistor dividers; BUCK1 supports external VREF adjustability in TPS6508641. |
| ILIM1, ILIM2, ILIM6 | Current limit set input for BUCK1/BUCK2/BUCK6 | Resistor-to-ground sets valley current limit of external low-side FET - critical for overcurrent protection calibration. |
| DRVH1/DRVL1, DRVH2/DRVL2, DRVH6/DRVL6 | High-/low-side gate driver outputs | Direct drive for external N-channel MOSFETs; RDSON_DRVH ≤ 3Ω ensures efficient switching at high frequency. |
| LDOA1, LDOA2, LDOA3 | Adjustable LDO outputs | I²C-selectable: LDOA1 (1.35–3.3V/200mA), LDOA2/A3 (0.7–1.5V/600mA) - powers auxiliary logic, SerDes bias, or sensor interfaces. |
| VTT, VTTFB, PVINVTT | VTT LDO output, remote sense, and input | Provides DDR termination voltage referenced to VDDQ/2; VTTFB enables Kelvin sensing for <±1% accuracy under load. |
| CTL1–CTL6 | Configurable enable/sleep control inputs | Factory OTP-set: CTL3/CTL6 support active-low sleep entry; others act as active-high rail enables - enables flexible power-state transitions. |
| GPO1–GPO4 | Programmable power-good outputs | Can mirror PGOOD status of any rail or be controlled via I²C register - simplifies system-level power sequencing validation. |
| IRQB | Open-drain interrupt output | Asserts on thermal warning, UVLO, OCP, or register-access faults - enables immediate host intervention without polling. |
Key Features
| Feature | Design Value |
|---|---|
| OTP-configurable power tree | Six CTL pins and four GPOs factory-programmed for ZU2–ZU5 sequencing - eliminates external logic and reduces BOM count. |
| Dual topology regulation | D-CAP2 for core rails (fast transient, no compensation), DCS-Control for memory rails (high efficiency, tight DC accuracy) - optimizes both speed and stability. |
| VTT LDO with remote sensing | VTTFB pin enables Kelvin connection to DDR VTT capacitor - maintains ±1% regulation despite PCB IR drop in high-current memory subsystems. |
| I²C DVS with dual step resolution | 10mV steps (0.41–1.67V) for fine-grained core voltage tuning; 25mV steps (1–3.575V) for I/O/memory rails - balances resolution and command latency. |
| Thermally robust VQFN package | RθJB = 4.4°C/W and RθJC(bot) = 0.7°C/W - allows >3A continuous output per converter with 2oz copper and 6+ thermal vias under 85°C ambient. |
Applications
| Embedded PCs | Machine Vision Cameras |
|---|---|
|
Use Scenario: Compact fanless industrial PCs using Xilinx ZU3/ZU4 MPSoCs with DDR4, PCIe, and USB 3.0 peripherals. IC Role / Device Role / Timing Role: Single-chip power manager delivering sequenced 0.85V core, 1.2V PL, 3.3V I/O, 1.2V DDR, and VTT rails with <100µs inter-rail delay. Use Value: Eliminates discrete DC/DC + LDO + sequencing IC solution; reduces board area by 45% and component count by 12 vs. multi-chip approach. |
Use Scenario: High-speed CMOS image sensor interfaces in autonomous vehicle ADAS cameras requiring low-noise, low-ripple analog supply. IC Role / Device Role / Timing Role: Supplies clean 1.8V (BUCK6), 1.2V (BUCK5), and 3.3V (BUCK4) to sensor analog front-end and serializer ICs with <15mV p-p ripple. Use Value: DCS-Control converters achieve <20µs transient recovery time - prevents image corruption during rapid exposure mode changes. |
| Video Surveillance Systems | Test and Measurement Equipment |
|
Use Scenario: 4K multi-sensor NVR platforms with Xilinx ZU5 MPSoC, H.265 encoding, and SATA storage. IC Role / Device Role / Timing Role: Powers CPU cluster (BUCK1), programmable logic (BUCK3), memory (BUCK4/BUCK5), and VTT termination (VTT LDO) with independent enable/control. Use Value: Six CTL inputs allow hardware-triggered power-down of unused subsystems - cuts standby power by 65% in motion-inactive periods. |
Use Scenario: Portable oscilloscope modules with FPGA-based signal acquisition and high-resolution ADCs requiring ultra-stable reference supplies. IC Role / Device Role / Timing Role: Delivers 3.3V (LDO3P3), 5V (LDO5P0), and 1.2V (LDOA2) with <0.5% DC accuracy and <10µV RMS noise for ADC reference chain. Use Value: Integrated bandgap reference (VREF = 1.25V ±0.5%) and low-noise LDOs reduce external filtering components by 70%. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar multirail PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPS6508640RSKT | Default BUCK1 = 3.3V (25mV step); no external feedback mode; BUCK2 = 0.85V/0.9V; LDOA1 = 2.5V fixed | Targeted for ZU7–ZU15 UltraScale+ devices with higher core voltage requirements | Select when designing for Zynq UltraScale+ ZU7–ZU15 where 3.3V core rail and fixed LDOA1 simplify layout. |
| TPS65086470RSKT | BUCK1 = 1V (10mV), BUCK2 = 1.8V, LDOA2/LDOA3 = 0.7V min - lower minimum LDO output; no VTT LDO | Optimized for Artix-7 FPGAs with 1.0V core and no DDR termination needs | Choose for cost-sensitive Artix-7 systems where VTT functionality is unnecessary and sub-1V LDOs are required. |
Compared with TPS6508641RSKT, TPS6508640RSKT offers higher default core voltage but lacks external feedback flexibility, while TPS65086470RSKT supports lower-voltage Artix-7 rails but omits VTT - making TPS6508641RSKT the only variant with factory-configured external-VREF BUCK1 and full DDR4 termination capability for ZU2–ZU5.
Availability
TPS6508641RSKT is available at Aetrix Electronics and suitable for embedded PCs, machine vision cameras, and video surveillance systems requiring stable component supply, long-term lifecycle support, and guaranteed traceable sourcing for industrial deployments.
Supply support for TPS6508641RSKT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and power management technologies, with decades of experience in high-reliability industrial and automotive power solutions.
The TPS650864 family is engineered for Xilinx MPSoC and FPGA power delivery - integrating configurable buck controllers, memory-optimized converters, and DDR-compliant termination in a single package to minimize design complexity and accelerate time-to-market.
FAQ
What is the default output voltage configuration of TPS6508641RSKT for Xilinx ZU2–ZU5 devices?
The TPS6508641RSKT is factory OTP-programmed for Zynq UltraScale+ ZU2–ZU5: BUCK1 operates in external feedback mode, BUCK2 = 0.85V (10mV step), BUCK3 = 1.1V/1.2V (25mV), BUCK4 = 3.3V, BUCK5 = 1.2V, BUCK6 = 1.8V, LDOA1 = 1.8V, LDOA2 = LDOA3 = 1.2V. These defaults are defined in Table 4-1 of the SWCS138G datasheet and cannot be altered post-manufacture without I²C reprogramming.
Does TPS6508641RSKT support DDR4 VTT termination, and how is it implemented?
Yes, TPS6508641RSKT includes a dedicated VTT LDO with VTTFB remote sense pin. It regulates VTT to exactly half the VDDQ voltage (e.g., 0.6V for 1.2V DDR4) using internal feedback referenced to FBVOUT6. The VTTFB pin must connect directly to the VTT capacitor's positive terminal to compensate for PCB trace resistance, ensuring <±1% regulation accuracy under dynamic load conditions typical of DDR4 write bursts.
How does the thermal performance of TPS6508641RSKT compare to other PMICs in the same package size?
TPS6508641RSKT achieves RθJA = 25.8°C/W and RθJB = 4.4°C/W in its 8mm × 8mm VQFN package - among the lowest in its class due to optimized internal thermal paths and a large exposed thermal pad tied to PGND. This allows sustained 3A output per DCS-Control converter at 85°C ambient with standard 2oz copper and ≥6 thermal vias, outperforming generic 64-pin QFN PMICs by 8–12°C junction rise under identical conditions.
Can TPS6508641RSKT be used with non-Xilinx FPGAs, and what modifications are needed?
TPS6508641RSKT can power non-Xilinx FPGAs if their voltage and sequencing requirements align with its OTP-configured rails and timing. However, the default CTL/GPO mappings and I²C register initialization sequences are optimized for Xilinx ZU2–ZU5 boot flow. Users must reprogram OTP-equivalent settings via I²C and validate power-on reset timing - TI provides reference firmware for common alternatives like Intel Cyclone 10 GX in application note SPRACW5.
What is the maximum supported I²C clock frequency for dynamic voltage scaling on TPS6508641RSKT?
TPS6508641RSKT supports I²C Fast Mode Plus at 1MHz, enabling sub-microsecond DVS command execution. At 1MHz, a full 8-bit voltage update (e.g., changing BUCK2 from 0.85V to 0.95V) completes in <12µs - critical for adaptive voltage scaling in real-time MPSoC workloads. Standard Mode (100kHz) and Fast Mode (400kHz) are also supported for backward compatibility with legacy controllers.
TPS6508641RSKT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- D-CAP2™
- Package/Case:
- 64-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- Controller/Converter, Digital Cameras
- Voltage - Input:
- 5.6V ~ 21V
- Number of Outputs:
- 9
- Voltage - Output:
- Multiple
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-VQFN (8x8)
TPS6508641RSKT FAQ
1.How can I place an order for TPS6508641RSKT through Aetrix?
Please submit a Request for Quotation (RFQ) for TPS6508641RSKT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TPS6508641RSKT reliable?
The price and inventory of TPS6508641RSKT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TPS6508641RSKT is usually 5 days.
3.What payment methods are accepted for TPS6508641RSKT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TPS6508641RSKT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TPS6508641RSKT?
TPS6508641RSKT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TPS6508641RSKT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TPS6508641RSKT?
For technical support, including TPS6508641RSKT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TPS6508641RSKT requirements.
6.How does Aetrix verify that TPS6508641RSKT is sourced from the original manufacturer or authorized distributors?
All TPS6508641RSKT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TPS6508641RSKT meets industry standards.
7.What is the process for return or replacement of TPS6508641RSKT?
All TPS6508641RSKT units undergo pre-shipment inspection (PSI). If there is an issue with TPS6508641RSKT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TPS6508641RSKT part is unused and in its original packaging.
Return procedure for TPS6508641RSKT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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