Texas Instruments TPS65086470RSKR

Overview

TPS65086470RSKR from Texas Instruments is a configurable multirail power-management IC (PMIC) designed specifically for Xilinx Artix-7 FPGAs. It integrates three D-CAP2™ step-down controllers (VIN 5.6–21 V), three DCS-Control synchronous buck converters (VIN 3–5.5 V, up to 3 A each), three adjustable LDOs (LDOA1: 1.35–3.3 V/200 mA; LDOA2/A3: 0.7–1.5 V/600 mA each), a VTT LDO, five load switches, and a fixed 5-V LDO - all programmable via I²C with factory OTP configuration.

For engineers reviewing the TPS65086470RSKR datasheet, TPS65086470RSKR pinout, TPS65086470RSKR application, or TPS65086470RSKR equivalent, this device delivers precise rail sequencing, dynamic voltage scaling in 10-mV/25-mV steps, thermal monitoring, and flexible enable/sleep control via six GPI/GPO pins - critical for FPGA power integrity in space-constrained industrial and embedded systems.

Technical Context

The TPS65086470RSKR implements dual topology regulation: D-CAP2™ for high-transient-response core rails (BUCK1/2/6) and DCS-Control for memory/system rails (BUCK3/4/5), both supporting I²C-based DVS across defined VID ranges. Its OTP-programmed default configuration targets Artix-7 FPGAs with BUCK1=1.0 V (10-mV step), BUCK2=1.8 V, BUCK3=1.2 V, BUCK4=2.5 V, BUCK5=3.3 V, and BUCK6=1.35/1.5 V (25-mV step).

It features integrated thermal shutdown (130–160 °C), UVLO protection on VSYS (5.24–5.56 V for LDO5, 3.45–3.75 V for LDO3P3), and six configurable GPI pins (CTL1–CTL6) that support rail enable or sleep-mode entry - enabling deterministic power sequencing without external logic.

Key Specifications

Pinout & Package

The TPS65086470RSKR is housed in an 8 mm × 8 mm, 64-pin RSK VQFN package with exposed thermal pad (PGND), requiring connection to PCB ground plane via multiple vias for thermal and electrical performance.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar multirail PMIC applications.

Compared with TPS6508640RSKR and TPS6508641RSKR, the TPS65086470RSKR uniquely provides factory-programmed 1.0 V core rail (10-mV step), 1.8 V I/O, and 1.2 V DDR - matching Artix-7's nominal supply requirements without I²C initialization or OTP modification.

Availability

TPS65086470RSKR is available at Aetrix Electronics and suitable for programmable logic controllers, machine vision cameras, video surveillance systems, test and measurement equipment, and embedded PCs requiring stable component supply, long-term lifecycle support, and guaranteed traceable sourcing.

Supply support for TPS65086470RSKR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and power management technologies - with over 50 years of innovation in high-reliability power solutions.

The TPS650864 family is engineered for Xilinx FPGA and MPSoC platforms, delivering integrated, OTP-configurable, multi-rail power with advanced sequencing, thermal safety, and I²C programmability - targeting space- and power-constrained industrial and embedded applications.

FAQ

What is the primary FPGA target for TPS65086470RSKR?

The TPS65086470RSKR is factory OTP-programmed for Xilinx Artix-7 FPGAs, with default rail voltages including BUCK1=1.0 V (10-mV step), BUCK2=1.8 V, BUCK3=1.2 V, BUCK4=2.5 V, BUCK5=3.3 V, and BUCK6=1.35/1.5 V (25-mV step). This configuration matches Artix-7 core, I/O, memory, and termination requirements out-of-box - eliminating need for I²C initialization or OTP reprogramming in most deployments.

How does TPS65086470RSKR manage thermal safety?

The TPS65086470RSKR integrates die temperature monitoring with two thresholds: THOT (110–120 °C) triggers warning alerts via IRQB, while TCRIT (130–160 °C) initiates automatic thermal shutdown. Hysteresis (10 °C for THOT, 10 °C for TCRIT) prevents oscillation during recovery. These functions are hardware-enforced and operate independently of I²C or host control - ensuring fail-safe protection for both the PMIC and connected Artix-7 FPGA.

Can TPS65086470RSKR support DDR3 or DDR4 memory termination?

Yes, the TPS65086470RSKR includes a dedicated VTT LDO with VTTFB remote sensing, regulated relative to FBVOUT6 (BUCK6 feedback). When BUCK6 is configured to 1.35 V or 1.5 V - typical for DDR3L or DDR4 VDDQ - the VTT LDO delivers half that voltage (0.675 V or 0.75 V) with tight tracking, meeting JEDEC DDR3/DDR4 VTT specifications. The VTTFB pin must be connected to the DDR VTT capacitor bank for accurate regulation.

What are the key differences between the D-CAP2™ and DCS-Control regulators in TPS65086470RSKR?

The TPS65086470RSKR uses D-CAP2™ topology for BUCK1/2/6 (5.6–21 V input) to deliver ultrafast transient response for FPGA core rails, while DCS-Control governs BUCK3/4/5 (3–5.5 V input) for memory and system rails with superior light-load efficiency. D-CAP2™ relies on output capacitor ESR for loop stability and achieves <10 µs recovery; DCS-Control uses internal compensation for stable operation with low-ESR ceramic capacitors - optimizing each rail for its specific load profile.

Does TPS65086470RSKR require external components for basic operation?

Yes, TPS65086470RSKR requires external components for full functionality: bootstrap capacitors (100 nF) on BOOT1/BOOT2/BOOT6; bulk input capacitors (10 µF) on PVIN3/PVIN4/PVIN5; output bypass capacitors (4.7 µF) on LDOA1/LDOA2/LDOA3/LDO3P3/LDO5P0; and 2×22 µF on VTT. For controller rails (BUCK1/2/6), external high-side/low-side FETs and inductors are mandatory; converter rails (BUCK3/4/5) integrate power stages but still require external inductors and output capacitors.