Texas Instruments TPS6508700RSKT

Overview

TPS6508700 from Texas Instruments is a single-chip power-management IC (PMIC) designed specifically for AMD™ Family 17h Models 10h–1Fh processors in notebooks and all-in-one desktops. It integrates three D-CAP2™ step-down controllers (5.6V–21V input), three DCS-Control™ synchronous buck converters (4.5V–5.5V input, up to 3A), three I²C-programmable LDOs, five load switches, and factory-programmed power sequencing - enabling full system power control for mobile PC platforms.

For engineers reviewing the TPS6508700 datasheet, TPS6508700 pinout, TPS6508700 application, or TPS6508700 equivalent, this page delivers verified technical context, exact pin functions, real-world use cases in NVDC/non-NVDC battery architectures, and validated alternative PMICs with documented functional and application-level differences.

Technical Context

The TPS6508700 implements dual-regulator topology: three high-voltage D-CAP2™ controllers drive external FETs for processor core/memory rails (VIN = 5.6–21V, scalable current via ILIM resistors), while three low-voltage DCS-Control™ converters deliver tightly regulated outputs (0.425–3.575V, ±2% accuracy, 1.6–2.5MHz switching) from a 5V intermediate bus. Both regulator groups support I²C dynamic voltage scaling with defined slew rates (2.5–6.25 mV/µs).

Power sequencing is hardwired via OTP programming across CTL1/CTL4/CTL5 for G3′/G3/S5/S0 states; status monitoring uses open-drain IRQB and dedicated GPO1/GPO2 for PG_S0/PG_S5. The I²C interface operates at 100kHz/400kHz/1MHz with 50pF load capacitance tolerance and supports register-level rail enable/disable, voltage setting, fault reporting, and thermal threshold configuration.

Key Specifications

Pinout & Package

The TPS6508700 is housed in an 8mm × 8mm, 64-pin VQFN package (RSK) with exposed thermal pad requiring connection to system power ground for thermal dissipation and EMI control.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar PMIC applications.

Compared with TPS650860RSKT and RTQ2136B-QA, the TPS6508700RSKT uniquely delivers full AMD Family 17h rail count, factory-programmed sequencing, and I²C DVS compatibility - making it the only drop-in solution for certified Ryzen mobile reference designs.

Availability

TPS6508700RSKT is available at Aetrix Electronics and suitable for notebook, ultrabook, and all-in-one desktop designs requiring stable component supply, long-term lifecycle support, and AMD platform validation.

Supply support for TPS6508700RSKT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company specializing in analog and embedded processing technologies, with leadership in power management ICs for computing, industrial, and automotive markets.

The TPS6508700 belongs to TI's AMD-specific PMIC product line, engineered to meet the stringent voltage accuracy, sequencing, and thermal requirements of Ryzen mobile processors - targeting high-density, thermally constrained client platforms.

FAQ

What is the input voltage range supported by the TPS6508700RSKT?

The TPS6508700RSKT supports two distinct input domains: its three D-CAP2™ step-down controllers accept 5.6V–21V (enabling direct connection to 2S–4S Li-ion batteries or 12V/19V adapters), while its three DCS-Control™ synchronous buck converters operate from a 4.5V–5.5V intermediate bus - typically supplied by the integrated LDO5 or external 5V source. This dual-input architecture ensures flexibility across battery-powered and wall-powered configurations without redesign.

Does the TPS6508700RSKT include built-in power sequencing?

Yes, the TPS6508700RSKT features factory-programmed OTP-based power sequencing using CTL1, CTL4, and CTL5 pins to implement AMD-defined G3′, G3, S5, and S0 state transitions. This eliminates the need for external sequencing ICs or firmware intervention, providing deterministic, repeatable startup and shutdown behavior aligned with AMD Platform Design Guide requirements - confirmed in TI's SWCS134A datasheet section 6.6.

Can the TPS6508700RSKT be used with non-AMD processors?

The TPS6508700RSKT is architecturally capable of powering other processors, but its OTP sequencing, default VID mappings, and register initialization are optimized exclusively for AMD Family 17h Models 10h–1Fh. Using it with non-AMD SoCs would require full register-level reconfiguration via I²C and validation of all rail timing, voltage accuracy, and fault responses - TI does not characterize or guarantee performance outside AMD platform use cases.

What thermal management features does the TPS6508700RSKT provide?

The TPS6508700RSKT integrates multiple thermal protections: die temperature monitoring with programmable hot (110–120°C) and critical (130–160°C) thresholds, hysteresis-controlled thermal shutdown, and junction-to-board thermal resistance of 4.4°C/W. Its 8mm × 8mm VQFN package requires soldering the exposed thermal pad to a solid ground plane - enabling reliable operation at +85°C ambient when designed per TI's layout guidelines in section 7.4 of the datasheet.

How many I²C-compatible voltage rails does the TPS6508700RSKT support?

The TPS6508700RSKT supports I²C dynamic voltage scaling on five rails: BUCK2, BUCK6, BUCK3, BUCK4, and BUCK5. BUCK1 uses external feedback and is not I²C-programmable. Each DVS-capable rail offers selectable VID steps (10mV or 25mV), programmable slew rates (2.5–6.25 mV/µs), and independent enable/disable control - allowing fine-grained, real-time adjustment of processor core, memory, and I/O voltages during runtime.