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Home > Products > Integrated Circuits (ICs) > Power Management (PMIC) > Special Purpose Regulators

Texas Instruments TPS650947A0RSKR

Name: TPS650947A0RSKR
Brand: Texas Instruments
SKU: TPS650947A0RSKR
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: TPS650947A0RSKR

Manufacturer:: Texas Instruments

Category:: Special Purpose Regulators

Package:: 64-VFQFN Exposed Pad

Datasheet:: TPS650947A0RSKR.pdf

Description:: PWR MGMT SPECIALIZED REGULATOR

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Product details

Overview

TPS650947A0RSKR from Texas Instruments is a power-management IC (PMIC) designed for Intel™ Apollo Lake platforms, integrating six synchronous buck regulators (three controllers + three converters), three adjustable LDOs, VTT termination, and three slew-controlled load switches. It delivers 5A/7A/21A on BUCK1/BUCK6/BUCK2, supports I²C DVS from 0.5V–1.45V in 10mV steps, and operates from 5.6V–21V input for battery- or wall-powered mobile computing.

For engineers reviewing the TPS650947A0RSKR datasheet, TPS650947A0RSKR pinout, TPS650947A0RSKR application, or TPS650947A0RSKR equivalent, this page provides verified functional identity, OTP-specific configuration (LPDDR4 support, VTT enabled, Forced PWM mode for BUCK3–BUCK5), thermal pad package details, and validated alternative options for Intel platform power design.

Technical Context

The TPS650947A0RSKR implements two distinct regulation topologies: D-CAP2™ for high-current buck controllers (BUCK1, BUCK2, BUCK6) driving external FETs, and DCS-Control™ for low-noise, fast-transient buck converters (BUCK3, BUCK4, BUCK5) with integrated FETs. Its OTP configuration enables LPDDR4 memory support, VTT LDO activation (1.8A IOCP), and Forced PWM operation for BUCK3–BUCK5 to suppress light-load frequency switching noise.

Power sequencing is hardware-managed via SLP_S0B/SLP_S3B/SLP_S4B inputs, while I²C (0x5E, up to 1MHz) enables dynamic voltage scaling, rail enable/disable, and status monitoring. The device integrates analog references (1.25V VREF), thermal protection (THOT = 115°C), and system-level signals including PROCHOT, PCH_PWROK, and RSMRSTB for Intel platform compliance.

Key Specifications

Parameter	Value and Actual Design Meaning
VIN Range	5.6V–21V for buck controllers; 4.5V–5.5V for buck converters - supports 2S/3S/4S Li-ion and 12V wall adapters.
BUCK2 Output Current	21A - powers Intel VCCGI rail using external FETs; requires 0.47µH inductor and ≥180µF output capacitance.
DVS Resolution	10mV steps from 0.5V–1.45V on BUCK1 & BUCK2 - enables fine-grained CPU core voltage tuning for connected standby efficiency.
I²C Address & Speed	0x5E; supports Standard (100kHz), Fast (400kHz), and Fast Mode Plus (1MHz) - allows real-time rail control without timing bottlenecks.
VTT LDO Capability	1.8A IOCP, VDDQ/2 output - meets DDR3L/LPDDR4 termination requirements with 2×22µF ceramic output capacitors.
OTP Configuration	TPS650947 variant: LPDDR4 support, VTT enabled, Forced PWM for BUCK3–BUCK5 - eliminates light-load mode switching noise in memory subsystems.
Thermal Performance	R_θJA = 25.8°C/W (VQFN-64); thermal pad must connect to PCB ground plane - enables sustained 21A BUCK2 operation at 85°C ambient.

Pinout & Package

The TPS650947A0RSKR is housed in an 8mm × 8mm single-row VQFN-64 package (RSK) with exposed thermal pad requiring connection to PCB ground plane for thermal and electrical integrity.

Pin/Terminal	Circuit Role	Design Meaning
FBVOUT2	Remote feedback sense for BUCK2	Connects to VCCGI VCC SENSE from SoC - enables accurate closed-loop regulation of 21A VCCGI rail.
DRVH2 / DRVL2	High-/low-side gate drivers for BUCK2	Drive external N-channel FETs; DRVH2 rated to VSYS+5V, DRVL2 to 5V - supports high-efficiency synchronous rectification.
ILIM2	Current limit set for BUCK2	Resistor-to-ground sets valley current limit; ILIMREF = 50µA typical - configures overcurrent protection for 21A output stage.
VTT / VTTFB	VTT LDO output & remote feedback	VTT = VDDQ/2; VTTFB connects to capacitor positive terminal - ensures precise DDR termination voltage tracking under load transients.
SLP_S3B	Power state input	Falling edge initiates S3 entry; rising edge exits S3 → S0 - synchronizes PMIC state transitions with Intel platform sleep/wake protocol.
DATA / CLK	I²C bidirectional data & clock	Supports 1MHz Fast Mode Plus - enables rapid DVS updates and register reads during dynamic CPU frequency scaling.

Key Features

Feature	Design Value
D-CAP2™ Buck Controllers	Enables fast transient response and no external compensation for BUCK1/BUCK2/BUCK6 - reduces BOM count and layout complexity for high-current rails.
DCS-Control™ Buck Converters	Provides ultra-low noise and high light-load efficiency for BUCK3/BUCK4/BUCK5 - critical for quiet VCCRAM/V1P8A/V1P24A supplies in ultrabooks.
Forced PWM Mode (OTP)	Eliminates audible switching noise and voltage undershoot/overshoot in BUCK3–BUCK5 at light loads - required for stable LPDDR4 memory operation.
VTT LDO with 1.8A IOCP	Meets JEDEC DDR3L/LPDDR4 termination specs with tight DC accuracy and fast transient response - avoids need for discrete termination solutions.
Hardware Power Sequencing	SLP_S0B/SLP_S3B/SLP_S4B pins directly control rail enable timing per Intel reference designs - removes dependency on firmware for safe boot/shutdown.

Applications

Intel Apollo Lake Tablet Power System	Ultrabook DDR4 Memory Subsystem
Use Scenario: Compact tablet powered by 3S Li-ion battery with NVDC architecture and LPDDR4 memory. IC Role / Device Role: Primary PMIC managing all core voltage rails (VNN, VCCGI, VDDQ, VCCRAM, V1P8A, V1P24A), VTT termination, and peripheral load switches. Use Value: Single-chip integration reduces footprint vs. discrete solution; Forced PWM mode prevents LPDDR4 timing violations during light-load operation.	Use Scenario: Fanless ultrabook requiring low-noise, high-efficiency memory power with DDR4 interface. IC Role / Device Role: Supplies VDDQ (1.35V @ 7A), VTT (0.675V @ 1.8A), and VCCRAM (1.2V @ 3A) with matched transient response. Use Value: Integrated VTT LDO eliminates external components; DCS-Control topology minimizes EMI near high-speed memory traces.
Industrial PC with Intel Apollo Lake SoC	Mobile Internet Device with Connected Standby
Use Scenario: Ruggedized IPC operating from 12V wall adapter with extended temperature range (-40°C to +85°C). IC Role / Device Role: Delivers regulated rails for SoC, DDR, and peripherals while providing thermal shutdown (THOT = 115°C) and UVLO protection. Use Value: Wide VIN range and robust thermal metrics (R_θJB = 4.4°C/W) ensure reliability in unventilated enclosures.	Use Scenario: Always-on mobile device requiring sub-100µA shutdown current and rapid wake-from-sleep capability. IC Role / Device Role: Manages connected standby sequencing via SLP_S0B, maintains VTT bias during S0ix, and enables fast DVS transitions. Use Value: 65µA shutdown current extends battery life; hardware-based SLP_S0B response ensures <100µs wake latency.

Intel Apollo Lake Tablet Power System

Ultrabook DDR4 Memory Subsystem

Use Scenario: Compact tablet powered by 3S Li-ion battery with NVDC architecture and LPDDR4 memory.

IC Role / Device Role: Primary PMIC managing all core voltage rails (VNN, VCCGI, VDDQ, VCCRAM, V1P8A, V1P24A), VTT termination, and peripheral load switches.

Use Value: Single-chip integration reduces footprint vs. discrete solution; Forced PWM mode prevents LPDDR4 timing violations during light-load operation.

Use Scenario: Fanless ultrabook requiring low-noise, high-efficiency memory power with DDR4 interface.

IC Role / Device Role: Supplies VDDQ (1.35V @ 7A), VTT (0.675V @ 1.8A), and VCCRAM (1.2V @ 3A) with matched transient response.

Use Value: Integrated VTT LDO eliminates external components; DCS-Control topology minimizes EMI near high-speed memory traces.

Industrial PC with Intel Apollo Lake SoC

Mobile Internet Device with Connected Standby

Use Scenario: Ruggedized IPC operating from 12V wall adapter with extended temperature range (-40°C to +85°C).

IC Role / Device Role: Delivers regulated rails for SoC, DDR, and peripherals while providing thermal shutdown (THOT = 115°C) and UVLO protection.

Use Value: Wide VIN range and robust thermal metrics (R_θJB = 4.4°C/W) ensure reliability in unventilated enclosures.

Use Scenario: Always-on mobile device requiring sub-100µA shutdown current and rapid wake-from-sleep capability.

IC Role / Device Role: Manages connected standby sequencing via SLP_S0B, maintains VTT bias during S0ix, and enables fast DVS transitions.

Use Value: 65µA shutdown current extends battery life; hardware-based SLP_S0B response ensures <100µs wake latency.

Equivalent & Alternatives

The following parts are listed as comparable options for similar PMIC applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
TPS650945A0RSKR	Same OTP family; LPDDR4 support and VTT enabled, but uses Auto mode (not Forced PWM) for BUCK3–BUCK5.	Higher light-load switching noise; may cause DDR timing margin loss in noise-sensitive LPDDR4 systems.	Select only if system-level EMI testing confirms acceptable noise floor with Auto mode.
TPS650944A0RSKR	Supports LPDDR4 but disables VTT; BUCK6 default = 1.1V (vs. 1.35V); LDOA1 always-on enabled.	Not suitable for DDR3L/LPDDR4 termination; requires external VTT solution or DDR4-only memory interface.	Choose when VTT is unnecessary and lower BUCK6 voltage aligns with SoC requirements.

Compared with TPS650945A0RSKR and TPS650944A0RSKR, the TPS650947A0RSKR uniquely combines LPDDR4 compatibility, active VTT LDO, and Forced PWM for BUCK3–BUCK5 - making it the only variant qualified for noise-critical, high-bandwidth memory subsystems in Intel Apollo Lake designs.

Availability

TPS650947A0RSKR is available at Aetrix Electronics and suitable for Intel Apollo Lake tablets, ultrabooks, and industrial PCs requiring stable component supply, long-term lifecycle support, and guaranteed OTP configuration consistency.

Supply support for TPS650947A0RSKR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog and embedded processing technologies, with decades of expertise in power management ICs for computing platforms.

The TPS65094x family is engineered specifically for Intel Atom™ and Apollo Lake processors, delivering tightly integrated, reference-design-compliant power solutions for space-constrained, battery-sensitive mobile and IoT devices.

FAQ

What is the OTP configuration of TPS650947A0RSKR?

The TPS650947A0RSKR is factory-programmed with OTP settings for LPDDR4 memory support, enabled VTT LDO (1.8A IOCP), Forced PWM mode for BUCK3–BUCK5, and SLP_S3B-controlled SWB1_2. These settings are fixed and cannot be altered post-manufacture - ensuring consistent behavior across production units.

Does TPS650947A0RSKR support DDR3L memory?

Yes, TPS650947A0RSKR supports DDR3L through its programmable BUCK6 output (default 1.35V) and VTT LDO (VDDQ/2). While optimized for LPDDR4, its BUCK6 voltage range (0.5V–1.45V) and VTT IOCP (1.8A) meet DDR3L JEDEC specifications when configured accordingly via I²C registers.

What is the purpose of Forced PWM mode in TPS650947A0RSKR?

Forced PWM mode in TPS650947A0RSKR disables auto-mode switching in BUCK3–BUCK5, maintaining constant switching frequency even at light loads. This prevents audible noise, voltage undershoot/overshoot, and potential DDR timing violations - a requirement explicitly stated in the datasheet for LPDDR4 stability.

How is thermal management handled on TPS650947A0RSKR?

TPS650947A0RSKR uses an 8mm × 8mm VQFN-64 package with an exposed thermal pad that must be soldered to the PCB ground plane using multiple vias. Its R_θJB = 4.4°C/W enables effective heat transfer to the board, supporting continuous 21A BUCK2 operation at 85°C ambient when layout guidelines are followed.

Can TPS650947A0RSKR operate from a 5V input source?

No - TPS650947A0RSKR's buck controllers require 5.6V–21V input (VSYS), and its buck converters require 4.5V–5.5V (PVIN3/4/5). A 5V source falls below the 5.6V minimum for controllers and risks UVLO shutdown; it is not a valid input for primary power rails.

TPS650947A0RSKR Specifications

Product attributes: Attribute value

Manufacturer:: Texas Instruments

Series:: -

Package/Case:: 64-VFQFN Exposed Pad

Packaging:: Tape & Reel (TR)

Product Status:: Active

Applications:: Controller/Converter, Mobile PCs

Voltage - Input:: 5.6V ~ 21V

Number of Outputs:: 12

Voltage - Output:: Multiple

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 64-VQFN (8x8)

TPS650947A0RSKR FAQ

1.How can I place an order for TPS650947A0RSKR through Aetrix?

Please submit a Request for Quotation (RFQ) for TPS650947A0RSKR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TPS650947A0RSKR reliable?

The price and inventory of TPS650947A0RSKR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TPS650947A0RSKR is usually 5 days.

3.What payment methods are accepted for TPS650947A0RSKR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TPS650947A0RSKR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TPS650947A0RSKR?

TPS650947A0RSKR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TPS650947A0RSKR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TPS650947A0RSKR?

For technical support, including TPS650947A0RSKR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TPS650947A0RSKR requirements.

6.How does Aetrix verify that TPS650947A0RSKR is sourced from the original manufacturer or authorized distributors?

All TPS650947A0RSKR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TPS650947A0RSKR meets industry standards.

7.What is the process for return or replacement of TPS650947A0RSKR?

All TPS650947A0RSKR units undergo pre-shipment inspection (PSI). If there is an issue with TPS650947A0RSKR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TPS650947A0RSKR part is unused and in its original packaging.

Return procedure for TPS650947A0RSKR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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