Texas Instruments TPS65218B1RSLR

Overview

TPS65218B1RSLR from Texas Instruments is a highly integrated power management IC (PMIC) designed for ARM® Cortex™-A8/A9 SoCs and FPGAs. It integrates six DC-DC converters (three adjustable buck, one buck-boost, two battery-backup bucks), one adjustable LDO, three load switches, supervisor, and I²C interface. Key confirmed specs: DCDC1–DCDC3 deliver up to 1.8 A each at 1.1 V / 1.1 V / 1.2 V defaults; DCDC4 delivers up to 1.6 A at 3.3 V default; operates across –40°C to +105°C; packaged in 48-pin VQFN (6 mm × 6 mm).

For engineers reviewing the TPS65218B1RSLR datasheet, TPS65218B1RSLR pinout, TPS65218B1RSLR application, or TPS65218B1RSLR equivalent, this page provides verified technical context, validated pin functions, real-world application mappings, and confirmed alternative options - all aligned with TI's SLDS206E revision FEBRUARY 2021 production data.

Technical Context

The TPS65218B1RSLR implements a multi-rail, sequenced power architecture with independent control of six DC-DC regulators and one LDO via an I²C interface (address 0x24). Its supervisor monitors DCDC1–DCDC4 and LDO1 with ±4% to ±5% tolerance thresholds and provides separate PGOOD and PGOOD_BU outputs for main and backup domains.

It supports dual-input power-path management for DCDC5/DCDC6 (system supply or coin-cell), includes undervoltage lockout (UVLO), overtemperature warning/shutdown, and push-button monitoring. All DC-DCs feature active output-discharge when disabled, and DCDC1–DCDC3 support power-save mode and 100% duty cycle operation.

Key Specifications

Pinout & Package

TPS65218B1RSLR is housed in a 48-pin VQFN package (RSL suffix), measuring 6.00 mm × 6.00 mm × 1.00 mm with 0.4-mm pitch and exposed thermal pad. Pinout conforms to TI's SLDS206E Figure 5-1 and Table 5-1.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar PMIC applications.

Compared with TPS65218B1RSLR, TPS652181RSLR offers identical integration and thermal performance but requires software adaptation for default rail settings, while TPS652170RSLR reduces feature set to cut cost - sacrificing both buck-boost capability and true battery-backup support.

Availability

TPS65218B1RSLR is available at Aetrix Electronics and suitable for industrial HMI panels, ePOS terminals, and portable test equipment requiring stable component supply, extended temperature operation, and long-term lifecycle support.

Supply support for TPS65218B1RSLR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and power management technologies, with decades of automotive and industrial qualification expertise.

The TPS65218 product line was engineered specifically for power-constrained ARM Cortex-A8/A9 SoC and FPGA platforms, integrating sequencing, supervision, and multi-rail conversion into a single die to simplify high-reliability embedded system design.

FAQ

What is the operating temperature range for the TPS65218B1RSLR?

The TPS65218B1RSLR is fully characterized and guaranteed to operate across –40°C to +105°C ambient temperature. This range is validated per TI's SLDS206E datasheet revision FEBRUARY 2021 and supports deployment in industrial automation, outdoor HMI, and ruggedized portable equipment where thermal extremes are expected. The TPS65218B1RSLR includes overtemperature warning and shutdown circuitry that activates within this full range.

Does the TPS65218B1RSLR support I²C communication, and what is its address?

Yes, the TPS65218B1RSLR supports standard-mode I²C communication at up to 400 kHz. Its fixed 7-bit slave address is 0x24, as documented in Section 1 of TI's SLDS206E datasheet. The SDA and SCL pins require external pull-up resistors, and the interface enables full read/write access to configuration registers, status flags, and fault reporting - essential for dynamic rail adjustment and diagnostics in the TPS65218B1RSLR.

How does the TPS65218B1RSLR handle power failure detection and backup power switching?

The TPS65218B1RSLR uses the PFI (power-fail input) pin with an external resistor divider to monitor input voltage. When PFI falls below threshold, the open-drain nPFO output asserts low. Simultaneously, the internal power-path logic automatically switches DCDC5 and DCDC6 from IN_BU (main supply) to CC (coin-cell) - signaled by the IN_nCC pin going low. This behavior is intrinsic to the TPS65218B1RSLR and requires no firmware intervention.

Can the TPS65218B1RSLR generate all required rails for an AM335x-based system?

Yes - the TPS65218B1RSLR is explicitly designed to power TI's AM335x ARM Cortex-A8 processors. It delivers the required 1.1-V core (DCDC1), 1.1-V MPU (DCDC2), 1.2-V DDR (DCDC3), 3.3-V peripheral (DCDC4), 1.0-V RTC (DCDC5), 1.8-V I/O (DCDC6), and 1.8-V LDO1 rails. Its pinout, sequencing, and supervisor tolerances align with AM335x power requirements as validated in TI reference designs using the TPS65218B1RSLR.

What package type and dimensions does the TPS65218B1RSLR use?

The TPS65218B1RSLR uses a 48-pin VQFN package with RSL suffix: 6.00 mm × 6.00 mm body size, 1.00 mm height, and 0.4-mm lead pitch. It features an exposed thermal pad on the bottom for enhanced heat dissipation. This package matches TI's standardized 48-pin QFN footprint and is distinct from the HTQFP variant (PHP suffix); the RSL designation confirms the VQFN configuration used in the TPS65218B1RSLR.