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Texas Instruments TPS65510RGTR
- Part No.:
- TPS65510RGTR
- Manufacturer:
- Texas Instruments
- Category:
- Battery Management
- Package:
- 16-VFQFN Exposed Pad
- Datasheet:
-
TPS65510RGTR.pdf
- Description:
- IC BATT PWR MGMT BACKUP 16QFN
- Quantity:
- Payment:
- Shipping:
Inventory:2,057
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Product details
Overview
TPS65510RGTR from Texas Instruments is a low-power battery backup IC with integrated boost converter and power-path switching for real-time clock (RTC) systems. It features four LDOs (1.2 V, 1.8 V, dual 3.3 V), dual open-drain status indicators (CS, XRESET), and automatic main-to-backup battery switchover based on VO_BT voltage threshold (3.00 V typical). Designed for portable systems requiring continuous RTC operation during main power loss.
For engineers reviewing the TPS65510RGTR datasheet, TPS65510RGTR pinout, TPS65510RGTR application, or TPS65510RGTR equivalent, key selection criteria include its 16-pin QFN package, 750 kHz PWM switching frequency, <3 µA backup-battery quiescent current, and integrated overvoltage/overcurrent/thermal protection - all critical for reliable backup power management in space-constrained portable electronics.
Technical Context
The TPS65510RGTR implements a peak-current-mode-controlled boost converter with selectable PFM/PWM modulation via PWMON pin, enabling dynamic efficiency optimization. Its power-path switch uses internal P-channel MOSFETs to route VOUT from either the 3.3-V LDO (when VO_BT ≥ 3.00 V) or directly from VBK (backup battery) when VO_BT falls below threshold.
Two independent open-drain indicators provide system-level monitoring: CS monitors both VBAT and VO_BT with 3.150 V detection threshold and 100 mV hysteresis, while XRESET monitors VOUT at 2.100 V with 100 mV hysteresis - both designed to interface directly with CPU/DSP reset inputs without external level-shifting.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Boost Output Voltage | Adjustable via FB/FBG pins; 3.6 V typical in PFM mode, set by external resistor divider per TI SLLS917 |
| Switching Frequency | 750 kHz fixed in PWM mode; enables compact external inductor (e.g., 4.7 µH) and reduces EMI filtering burden |
| VOUT Power Path Threshold | 3.00 V typical (V(SW1)); triggers seamless transition from boost/LDO to backup battery without system interruption |
| Backup-Battery Quiescent Current | <3 µA max; extends shelf life and runtime of coin-cell backup batteries (e.g., CR2032) in long-term storage |
| LDO Output Voltages | Fixed 1.2 V (VO1R2), 1.8 V (VO1R8), dual 3.3 V (VOUT/VRO); eliminates need for external feedback resistors |
| Protection Features | OCP (0.6–1.2 A), OVP (1.35 V at FB), UVLO (2.70 V at VBAT), TSD (150 °C), ensuring robust operation under fault conditions |
| Operating Temperature | –35 °C to +85 °C; qualified for industrial portable equipment including digital cameras and handheld meters |
Pinout & Package
TPS65510RGTR is housed in a 3 mm × 3 mm, 16-pin VQFN (RGT) package with exposed thermal pad (PowerPAD™), optimized for thermal dissipation and PCB area minimization in portable designs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 VO_BT | Boost output | Regulated high-side output node; feeds VRO, VOUT, and VO1R8/VO1R2 LDOs; voltage set by FB/FBG divider |
| 2 SW | Boost switch node | Connects to external inductor; carries pulsed current up to 1.3 A; requires low-ESR ceramic capacitor at PGND |
| 3 PGND | Power ground | Main return path for boost switch and LDO outputs; must be connected to solid ground plane under thermal pad |
| 4 AGND | Analog ground | Reference for FB, CS, XRESET comparators; isolated from PGND to minimize noise coupling into sensing circuits |
| 5 V_CTRL | LDO enable control | Active-high logic input disabling VO1R2 and VO1R8 when pulled low; reduces system standby current |
| 6 PWMON | Modulation select | Low = PFM (low-load efficiency); High = PWM (regulated 750 kHz); determines FBG impedance state |
| 7 CS | Status indicator | Open-drain output signaling low VBAT or VO_BT; requires 100 kΩ pull-up; asserts before XRESET during brownout |
| 8 XRESET | Reset indicator | Open-drain output signaling low VOUT; directly drives microcontroller reset pin; 25 µs detection delay |
| 9 VO1R2 | 1.2-V LDO output | Fully regulated 1.2 V supply; powered from VRO (3.3 V) or VBK depending on VO_BT level; 100 µA max load |
| 10 VO1R8 | 1.8-V LDO output | Fully regulated 1.8 V supply; same power path as VO1R2; enabled only when V_CTRL = high |
| 11 VOUT | Primary 3.3-V output | Auto-switched between VRO (LDO) and VBK (backup); provides RTC power during main battery removal |
| 12 VRO | 3.3-V LDO output | Dedicated 3.3 V regulator fed from VO_BT; supplies VOUT path and VO1R8/VO1R2 when VO_BT is valid |
| 13 VBK | Backup battery input | Accepts 1.8–5.5 V coin cell or supercap; reverse-current protected; powers VOUT when VO_BT drops below 3.00 V |
| 14 FBG | Feedback ground select | High-Z in PFM mode (enables 3-resistor divider); near-GND in PWM mode (enables 2-resistor divider) |
| 15 FB | Feedback input | Monitors VO_BT via resistor divider; reference voltage = 1.250 V (PWM) or 1.250 V (PFM); sets output regulation point |
| 16 VBAT | Main battery input | Accepts 2.65–5.5 V Li-ion or alkaline; powers boost converter and enables UVLO (2.70 V threshold) |
Key Features
| Feature | Design Value |
|---|---|
| Automatic power-path switching | Seamlessly transfers VOUT from main battery (via boost+LDO) to backup battery (VBK) at 3.00 V VO_BT threshold - no firmware or external control required |
| Ultra-low backup-battery consumption | <3 µA max ICC3/ICC4/ICC5 ensures >10-year CR2032 lifetime in RTC applications with minimal self-discharge impact |
| Dual independent status indicators | CS monitors both VBAT and VO_BT for early warning; XRESET provides precise VOUT brownout detection - each with configurable pull-up and 100 mV hysteresis |
| Integrated protection suite | OCP (SW/VOUT/VRO), OVP (FB), UVLO (VBAT), and TSD (150 °C) operate autonomously - no external components needed for basic fault coverage |
| Flexible boost modulation control | PWMON pin selects PFM (light-load efficiency) or PWM (fixed-frequency regulation); FBG pin auto-configures feedback network topology per mode |
Applications
| Digital Still Cameras | Portable Medical Monitors |
|---|---|
Use Scenario: Maintaining RTC, memory retention, and sensor calibration data during battery swaps or AC adapter disconnection. IC Role / Device Role / Timing Role: Primary backup power manager; routes VOUT to RTC and SRAM while charging backup cell via VRO–diode–resistor path. Use Value: Eliminates time/date reset and configuration loss; supports <3 µA system sleep current with guaranteed 3.3 V VOUT hold-up from VBK. | Use Scenario: Ensuring uninterrupted operation of ECG waveform buffers and patient ID storage during brief main power interruptions. IC Role / Device Role / Timing Role: Dual-role power supervisor - provides clean 3.3 V for analog front-end and 1.8 V for microcontroller I/O, while asserting XRESET on VOUT sag. Use Value: Prevents data corruption during transient brownouts; CS signal alerts host MCU of impending main power loss before XRESET triggers. |
| Industrial Handheld Meters | Smart Energy Meters |
Use Scenario: Preserving metering logs and real-time clock accuracy during field battery replacement in utility infrastructure. IC Role / Device Role / Timing Role: Backup power switch and voltage monitor; isolates backup battery from main supply using internal P-MOSFETs to prevent reverse current. Use Value: Enables hot-swap capability without system reset; <60 µA ICC1 ensures >5-year backup runtime on BR2032 lithium battery. | Use Scenario: Supporting secure time-stamping and tamper-detection logging during grid outages lasting minutes to hours. IC Role / Device Role / Timing Role: Low-quiescent-power RTC power source with dual-voltage LDOs (1.2 V/1.8 V) for secure element and communication ICs. Use Value: Meets IEC 62056-21 timekeeping accuracy requirements under backup power; XRESET guarantees cryptographic module reset on VOUT undervoltage. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar battery backup power management applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MAX1605EEE+ | Single 3.3-V LDO output; no integrated boost converter; relies on external DC/DC for higher backup voltages | Suitable only where backup source already provides ≥3.3 V; lacks VO_BT monitoring and automatic path switching | Select when system uses pre-regulated backup rail and requires simpler, lower-cost supervision-only function |
| TPS65511RGTR | Pin-compatible variant with identical pinout and package; differs only in FB reference voltage (1.225 V vs. 1.250 V) and slightly tighter VO_BT tolerance | Same functional scope and application fit; used where tighter output regulation is specified in design-in documentation | Choose when design requires the 1.225 V FB reference per TPS65511 datasheet; not drop-in for TPS65510RGTR without validation |
Compared with MAX1605EEE+, the TPS65510RGTR integrates boost conversion and dual-LDO generation, eliminating external regulators and reducing BOM count by ≥4 components. Against TPS65511RGTR, it offers broader VO_BT regulation tolerance (±2.5% vs. ±2.0%) and higher UVLO threshold (2.70 V vs. 2.65 V), enhancing robustness in marginal battery conditions.
Availability
TPS65510RGTR is available at Aetrix Electronics and suitable for digital still cameras, portable medical monitors, and industrial handheld meters requiring stable component supply across extended product lifecycles.
Supply support for TPS65510RGTR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and power management technologies, with decades of expertise in precision power solutions.
The TPS65510RGTR belongs to TI's battery backup and power-path management IC family, engineered specifically for portable systems needing autonomous RTC power continuity, ultra-low standby current, and integrated voltage supervision.
FAQ
What is the primary function of the TPS65510RGTR in a portable system?
The TPS65510RGTR serves as an autonomous battery backup power manager that automatically switches the VOUT supply between the main battery (via integrated boost + 3.3-V LDO) and a backup battery (VBK) based on VO_BT voltage level. It ensures uninterrupted RTC, memory, and critical logic operation during main power loss or battery replacement - all without firmware intervention. The TPS65510RGTR achieves this using internal P-MOSFET power-path switches and dual voltage monitors (CS and XRESET).
How does the TPS65510RGTR reduce system standby current when using a backup battery?
The TPS65510RGTR reduces backup-battery standby current to <3 µA maximum through three design features: (1) ultra-low ICC3/ICC4/ICC5 quiescent currents measured at VBK, (2) ability to disable VO1R2 and VO1R8 LDOs via V_CTRL pin, and (3) PFM mode operation that minimizes switching losses at light loads. This enables multi-year operation on standard coin cells like CR2032. The TPS65510RGTR datasheet specifies ICC3 = 0.1–1 µA typical under no-load VOUT conditions.
Can the TPS65510RGTR be used without an external inductor?
No - the TPS65510RGTR requires an external inductor connected between SW and PGND to implement its integrated boost converter. The device does not contain magnetic components. Typical inductor values range from 2.2 µH to 4.7 µH (e.g., Coilcraft MSS5131-472ML), selected based on output current and ripple requirements. Removing the inductor disables VO_BT generation, preventing VRO, VOUT, and VO1R8/VO1R2 regulation - rendering the TPS65510RGTR nonfunctional for its intended backup power role.
What are the voltage thresholds monitored by the CS and XRESET pins of the TPS65510RGTR?
The CS pin monitors two inputs: VBAT (UVLO threshold = 2.70 V typical, with –200 mV hysteresis) and VO_BT (detection threshold = 3.150 V typical, with 100 mV hysteresis). The XRESET pin monitors VOUT exclusively, asserting low when voltage falls below 2.100 V (typical), with 100 mV hysteresis. Both outputs are open-drain and require external 100 kΩ pull-up resistors. These thresholds are factory-trimmed and specified in the Electrical Characteristics table of the TPS65510RGTR datasheet.
Is the TPS65510RGTR pin-compatible with any other TI battery backup ICs?
The TPS65510RGTR shares identical pinout, package (16-pin VQFN RGT), and footprint with the TPS65511RGTR, differing only in FB reference voltage (1.250 V vs. 1.225 V) and minor electrical tolerances. However, it is not pin-compatible with unrelated TI devices such as the TPS65023 or TPS65910 - those have different pin counts, functions, and power architectures. Always verify compatibility using the official TPS65510RGTR and TPS65511RGTR datasheets before board-level substitution.
TPS65510RGTR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 16-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Function:
- Power Management
- Battery Chemistry:
- -
- Number of Cells:
- -
- Fault Protection:
- Over Current, Over Temperature, Over/Under Voltage
- Interface:
- -
- Operating Temperature:
- -35°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-VQFN (3x3)
TPS65510RGTR FAQ
1.How can I place an order for TPS65510RGTR through Aetrix?
Please submit a Request for Quotation (RFQ) for TPS65510RGTR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TPS65510RGTR reliable?
The price and inventory of TPS65510RGTR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TPS65510RGTR is usually 5 days.
3.What payment methods are accepted for TPS65510RGTR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TPS65510RGTR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TPS65510RGTR?
TPS65510RGTR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TPS65510RGTR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TPS65510RGTR?
For technical support, including TPS65510RGTR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TPS65510RGTR requirements.
6.How does Aetrix verify that TPS65510RGTR is sourced from the original manufacturer or authorized distributors?
All TPS65510RGTR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TPS65510RGTR meets industry standards.
7.What is the process for return or replacement of TPS65510RGTR?
All TPS65510RGTR units undergo pre-shipment inspection (PSI). If there is an issue with TPS65510RGTR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TPS65510RGTR part is unused and in its original packaging.
Return procedure for TPS65510RGTR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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