Texas Instruments TPS73730DRBRM3
- Part No.:
- TPS73730DRBRM3
- Manufacturer:
- Texas Instruments
- Package:
- 8-VDFN Exposed Pad
- Datasheet:
-
TPS73730DRBRM3.pdf
- Description:
- 1A ultra-low-dropout voltage re
- Quantity:
- Payment:

- Shipping:

Inventory:3,000
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Product details
Overview
TPS73730DRBRM3 from Texas Instruments is a 1A low-dropout (LDO) voltage regulator with NMOS pass transistor topology, reverse current protection, and 3.0V fixed output. It operates from 2.2V to 5.5V input, delivers 122mV typical dropout at 1A (new silicon), achieves ±1.5% overall accuracy over line/load/temperature, and stabilizes with ≥1μF ceramic output capacitor. It serves as point-of-load regulator for FPGA core supplies in portable industrial controllers.
For engineers reviewing the TPS73730DRBRM3 datasheet, TPS73730DRBRM3 pinout, TPS73730DRBRM3 application, or TPS73730DRBRM3 equivalent, key selection criteria include ultra-low dropout under full load, sub-20nA shutdown current, thermal foldback protection, and compatibility with minimal 1μF ceramic output capacitance in space-constrained battery-powered designs.
Technical Context
The TPS73730DRBRM3 uses an NMOS pass transistor in voltage-follower configuration, enabling reverse current blocking and insensitivity to output capacitor ESR. Its BiCMOS process delivers high precision while maintaining low ground pin current-880µA at 1A load (new silicon) and <20nA in shutdown.
It integrates a 4MHz internal charge pump to drive the NMOS gate above VOUT, ensuring stable regulation even with low VIN–VOUT headroom. Protection includes thermal shutdown (160°C trip) and foldback current limiting, where short-circuit current drops to ~510mA (new silicon) as VOUT falls below 0.5V.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Output Voltage | Fixed 3.0V ±1.5% over line, load, and –40°C to +125°C junction temperature |
| Dropout Voltage | 122mV typical at 1A load (new silicon); enables operation with only 3.122V input for 3.0V output |
| Input Voltage Range | 2.2V to 5.5V; minimum VIN = VOUT + VDO or 2.2V, whichever is greater |
| Ground Pin Current | 880µA at 1A output (new silicon); supports low-power system budgeting |
| Shutdown Current | 20nA typical; extends battery life in always-on portable systems |
| Output Capacitor | Stable with ≥1µF ceramic capacitor; eliminates need for large tantalum or electrolytic types |
| PSRR @ 100Hz | 58dB; suppresses ripple from upstream switching regulators in hybrid power architectures |
Pinout & Package
TPS73730DRBRM3 is housed in a 6-pin WSON package (DRV variant), 2mm × 2mm body with exposed thermal pad (GND-connected). The package supports high thermal performance (RθJB = 33.7°C/W) and compact PCB layout.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| IN | Unregulated input supply | Accepts 2.2V–5.5V; must be decoupled locally to minimize noise injection |
| OUT | Regulated output | Delivers 3.0V; requires ≥1µF ceramic capacitor directly at pin for stability |
| GND | Ground reference and thermal pad | Internal die ground and exposed pad; must be soldered to PCB ground plane for thermal and electrical integrity |
| EN | Enable control input | Active-high TTL/CMOS-compatible; drives high (>1.7V) to enable, low (<0.5V) to enter 20nA shutdown |
| NR/FB | Noise reduction / feedback | Configured as NR pin for fixed-output versions; connects to external 10nF capacitor to reduce output noise by ~3.2× |
| NC | No-connect | Pin 5 is not bonded; must remain unconnected and unpopulated on PCB |
Key Features
| Feature | Design Value |
|---|---|
| Reverse current protection | Blocks backflow from OUT to IN during input brownout or hot-swap events, preventing system-level damage |
| Ultra-low dropout | 122mV typical at 1A ensures usable output voltage even when input sags to 3.122V |
| 1μF ceramic stability | Eliminates need for larger, less reliable capacitors-reducing BOM count and board area |
| Thermal foldback current limit | Reduces short-circuit current to ~510mA as VOUT drops, protecting device during sustained overload |
| Low-noise NR pin | External 10nF capacitor on NR reduces 10Hz–100kHz output noise to ~8.5×VOUT µVRMS |
Applications
| Industrial PLC I/O Module Power | FPGA Core Supply in Portable Test Equipment |
|---|---|
Use Scenario: Regulating 3.3V or 5V rail down to clean 3.0V for analog front-end ADCs and DACs in modular I/O cards operating across –40°C to +85°C ambient. IC Role / Device Role / Timing Role: Point-of-load LDO delivering low-noise, tightly regulated 3.0V with reverse current blocking to prevent cross-rail interference during hot-swap insertion. Use Value: Enables stable 16-bit ADC performance by suppressing PSRR-sensitive ripple and eliminating backfeed during module replacement. | Use Scenario: Providing 3.0V core voltage to Xilinx Artix-7 FPGA fabric in handheld signal analyzers powered by single-cell Li-ion batteries (2.8V–4.2V). IC Role / Device Role / Timing Role: Primary post-regulator after buck converter, activated via microcontroller GPIO to manage FPGA power sequencing and extend runtime via 20nA shutdown. Use Value: Maintains FPGA functionality down to 3.122V input, maximizing usable battery capacity while meeting ±1.5% accuracy spec across temperature. |
| Battery-Powered Medical Sensor Node | Automotive Body Control Module Sub-Rail |
Use Scenario: Powering ultra-low-power BLE SoC and MEMS sensor array in wearable ECG patch requiring >72-hour runtime on CR2032 coin cell. IC Role / Device Role / Timing Role: Always-on LDO supplying 3.0V to sensor interface and radio; enabled continuously but leveraging 20nA shutdown during deep sleep cycles. Use Value: Achieves sub-1µA total system quiescent current by combining 20nA regulator shutdown with precise 3.0V accuracy-minimizing sensor offset drift. | Use Scenario: Generating isolated 3.0V rail for LIN transceiver and EEPROM in door module, surviving load-dump (ISO 7637-2 Pulse 5a) and cold-crank (4.5V min) conditions. IC Role / Device Role / Timing Role: Secondary LDO fed from main 5V domain; provides reverse-current-isolated 3.0V supply immune to downstream faults. Use Value: Prevents backfeed into main domain during LIN bus short-to-battery, enhancing system robustness without adding external diodes. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar LDO regulator applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPS73730DRVR | Same silicon revision and specs, but in 6-pin WSON (DRV) package without moisture sensitivity level (MSL) 1 rating; no integrated thermal pad connection requirement | Lower-cost alternative for non-automotive, non-harsh-environment designs where MSL1 and enhanced thermal performance are not required | Select TPS73730DRVR only if board-level thermal management is sufficient and JEDEC MSL1 compliance is unnecessary |
| TPS79930DDCR | 200mA rated, 1.5% accuracy, 0.15V dropout at 200mA; smaller 5-pin SOT-23 package; 25nA shutdown current | Suitable for low-current peripherals (e.g., sensors, RTCs) but cannot support 1A FPGA core loads | Choose TPS79930DDCR only for sub-200mA applications where footprint minimization outweighs current capability |
Compared with TPS73730DRBRM3, TPS73730DRVR offers identical electrical performance in a thermally less capable package, while TPS79930DDCR trades 5× lower output current and higher dropout for 40% smaller footprint-making neither a drop-in replacement for 1A, thermally demanding, or MSL1-compliant designs.
Availability
TPS73730DRBRM3 is available at Aetrix Electronics and suitable for industrial PLC I/O modules, portable FPGA-based test equipment, battery-powered medical sensors, and automotive body control sub-rails requiring stable component supply with MSL1 handling and thermal reliability.
Supply support for TPS73730DRBRM3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader designing analog ICs, embedded processors, and connectivity solutions for industrial, automotive, and personal electronics markets.
The TPS737 family is engineered as high-accuracy, reverse-current-protected LDOs for portable and thermally constrained applications-emphasizing ultra-low dropout, 1µF ceramic stability, and sub-20nA shutdown to maximize battery life and simplify power design.
FAQ
What is the maximum input voltage for TPS73730DRBRM3?
The absolute maximum input voltage for TPS73730DRBRM3 is 6V, but the recommended operating range is 2.2V to 5.5V. Exceeding 5.5V may cause permanent damage or degrade long-term reliability. For stable 3.0V output, minimum input is 3.122V (3.0V + 122mV dropout), making it compatible with single-cell Li-ion and 3.3V/5V intermediate rails.
Does TPS73730DRBRM3 require an external feedback resistor network?
No, TPS73730DRBRM3 does not require external feedback resistors because it is a fixed 3.0V output version. The feedback node (FB) is internally connected to generate the precise output; the NR pin is used instead for optional noise reduction with a 10nF capacitor to ground. External resistors are only needed for adjustable versions like TPS73701.
How does the enable pin (EN) function on TPS73730DRBRM3?
The EN pin on TPS73730DRBRM3 is active-high with TTL/CMOS-compatible thresholds: logic high (>1.7V) enables regulation, while logic low (<0.5V) forces shutdown with <20nA ground current. EN must never float-it can be tied to IN if unused. Driving EN low fully discharges the pass transistor gate, ensuring true reverse-current isolation during standby.
Can TPS73730DRBRM3 be used with a 1μF ceramic output capacitor?
Yes, TPS73730DRBRM3 is explicitly designed to be stable with 1μF or larger ceramic output capacitors-no ESR requirements or damping networks needed. This simplifies layout, reduces cost, and improves reliability versus older LDOs requiring 10–22μF tantalum capacitors. TI validates stability across temperature and load with 1μF X7R/X5R types.
What thermal performance can be expected from TPS73730DRBRM3 in its WSON package?
TPS73730DRBRM3 in the 2mm × 2mm WSON (DRV) package achieves RθJB = 33.7°C/W (junction-to-board) and RθJA = 67.3°C/W (junction-to-ambient) when mounted per JEDEC standards with a 2×2 thermal via array under the exposed GND pad. At 1A load and 25°C ambient, junction temperature rise is ~33.7°C-well within the 125°C max rating.
TPS73730DRBRM3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 8-VDFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Output Configuration:
- Positive
- Output Type:
- Fixed
- Number of Regulators:
- 1
- Voltage - Input (Max):
- 5.5V
- Voltage - Output (Min/Fixed):
- 3V
- Voltage - Output (Max):
- -
- Voltage Dropout (Max):
- 0.25V @ 1A
- Current - Output:
- 1A
- Current - Quiescent (Iq):
- -
- Current - Supply (Max):
- 880 µA
- PSRR:
- 58dB ~ 37dB (100Hz ~ 1kHz)
- Control Features:
- Current Limit, Enable
- Protection Features:
- Over Current, Over Temperature, Reverse Current
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-SON (3x3)
TPS73730DRBRM3 FAQ
1.How can I place an order for TPS73730DRBRM3 through Aetrix?
Please submit a Request for Quotation (RFQ) for TPS73730DRBRM3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TPS73730DRBRM3 reliable?
The price and inventory of TPS73730DRBRM3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TPS73730DRBRM3 is usually 5 days.
3.What payment methods are accepted for TPS73730DRBRM3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TPS73730DRBRM3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TPS73730DRBRM3?
TPS73730DRBRM3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TPS73730DRBRM3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TPS73730DRBRM3?
For technical support, including TPS73730DRBRM3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TPS73730DRBRM3 requirements.
6.How does Aetrix verify that TPS73730DRBRM3 is sourced from the original manufacturer or authorized distributors?
All TPS73730DRBRM3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TPS73730DRBRM3 meets industry standards.
7.What is the process for return or replacement of TPS73730DRBRM3?
All TPS73730DRBRM3 units undergo pre-shipment inspection (PSI). If there is an issue with TPS73730DRBRM3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TPS73730DRBRM3 part is unused and in its original packaging.
Return procedure for TPS73730DRBRM3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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