Texas Instruments TPS76801QDR

Overview

TPS76801QDR from Texas Instruments is an adjustable low-dropout (LDO) voltage regulator delivering up to 1 A output current with 230 mV typical dropout at full load, 2% output accuracy over temperature and load, 85 µA typical quiescent current, and open-drain power-good (PG) monitoring. It operates from 2.7 V to 10 V input and supports 1.2 V to 5.5 V programmable output-ideal for battery-powered portable instrumentation requiring stable, low-noise bias rails.

For engineers reviewing the TPS76801QDR datasheet, TPS76801QDR pinout, TPS76801QDR application, or TPS76801QDR equivalent, key selection criteria include its PMOS pass architecture enabling ultra-low quiescent current independent of load, fast transient response with only 10 µF output capacitance, thermal shutdown protection, enable-controlled shutdown (<1 µA standby), and SOIC-8 package compatibility with space-constrained PCB layouts.

Technical Context

The TPS76801QDR uses a PMOS pass transistor-unlike conventional PNP-based LDOs-yielding dropout voltage directly proportional to load current and quiescent current invariant across 0–1 A output range. Its internal 1.1834 V reference feeds a high-impedance feedback amplifier, supporting precise external resistor-divider programming of output voltage.

Power-good (PG) logic monitors regulated output with 92–98% VO trip threshold and 0.5% hysteresis; PG asserts low when output falls below threshold and requires an external pull-up. The device features internal current limiting (~1.7 A) and thermal shutdown at ~150°C, with automatic recovery at ~130°C.

Key Specifications

Pinout & Package

TPS76801QDR is housed in an 8-pin SOIC (D) package with exposed pad not electrically connected. Thermal resistance is 172°C/W (junction-to-ambient, no airflow), requiring ≥1 in² copper pour for 1 A continuous operation at +70°C ambient.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar adjustable LDO regulator applications.

Compared with TPS7A4700RGWR and MCP1826T-ADJE/OT, the TPS76801QDR uniquely balances ultra-low IQ, integrated PG, fast transient response with minimal capacitance, and SOIC-8 footprint-making it optimal for space- and energy-constrained embedded systems requiring robust power supervision.

Availability

TPS76801QDR is available at Aetrix Electronics and suitable for portable medical sensors, industrial PLC I/O modules, and automotive body control units requiring stable component supply with guaranteed long-term manufacturability and RoHS-compliant packaging.

Supply support for TPS76801QDR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies with over 90 years of innovation in power management ICs.

The TPS768xxQ family was designed specifically for battery-powered and thermally constrained applications demanding ultra-low quiescent current, fast transient response, and integrated power supervision-all in industry-standard SOIC and TSSOP packages.

FAQ

What output voltage range does the TPS76801QDR support, and how is it set?

The TPS76801QDR supports an adjustable output voltage range of 1.2 V to 5.5 V, set using an external resistor divider connected to the FB pin. The internal reference voltage is 1.1834 V; selecting R2 = 30.1 kΩ yields ~50 µA divider current, and R1 is calculated as R1 = R2 × ((VO / 1.1834) − 1). This configuration enables precise rail matching for mixed-voltage SoCs without custom fixed-output variants. The TPS76801QDR's FB pin is high-impedance, minimizing loading error on the divider network.

Does the TPS76801QDR require a minimum load current to maintain regulation stability?

No, the TPS76801QDR does not require a minimum load current-it remains stable even at zero load. This eliminates the need for wasteful bleed resistors in low-power sleep modes, preserving battery energy in always-on applications like remote sensors or security systems. Stability is ensured across the full 0–1 A load range with a 10 µF output capacitor meeting 60 mΩ–1.5 Ω ESR requirements, as verified in TI's typical region-of-stability plots for SOIC-8 packaging.

How does the power-good (PG) output of the TPS76801QDR function, and what external components are needed?

TPS76801QDR's PG output is an open-drain, active-high signal that asserts when the regulated output reaches ≥92% of its nominal value and deasserts when VO drops to ≤98% of nominal-providing hysteresis to prevent chatter. An external pull-up resistor (typically 10 kΩ to VO) is mandatory; PG can drive microcontroller reset inputs or FPGA configuration status pins directly. PG does not indicate 2% output tolerance compliance but rather tracks gross output collapse-making it ideal for brown-out detection and safe power-down sequencing in the TPS76801QDR-based design.

What thermal considerations apply when operating the TPS76801QDR at 1 A continuous output current?

At 1 A output with a 3.3 V output and 5 V input, the TPS76801QDR dissipates ~1.7 W. In its SOIC-8 (D) package (θJA = 172°C/W, no airflow), this raises junction temperature by ~292°C above ambient-exceeding safe limits. Therefore, ≥1 in² copper pour on inner layers, thermal vias under the exposed pad (though unconnected), and airflow >250 CFM are essential. For sustained 1 A operation, derating to 0.6 A at +70°C ambient or using the PWP package (θJA = 32.6°C/W) is recommended. The TPS76801QDR's thermal shutdown activates at ~150°C with hysteresis for safe recovery.

Can the TPS76801QDR be used with ceramic output capacitors, and what ESR constraints apply?

Yes, the TPS76801QDR is fully compatible with ceramic output capacitors, provided the equivalent series resistance (ESR) is between 60 mΩ and 1.5 Ω. Unlike older LDOs requiring tantalum or aluminum electrolytics for stability, the TPS76801QDR's PMOS architecture allows stable operation with low-ESR ceramics-reducing board area and improving reliability. TI's stability regions confirm 10 µF X7R ceramics (typical ESR ~10 mΩ) are acceptable when paired with appropriate PCB layout (short traces, solid ground plane), as validated in Figure 22–25 of the datasheet for the TPS76801QDR.