Texas Instruments TPS780300250DRVT

Overview

TPS780300250DRVT from Texas Instruments is a 150-mA ultralow-power low-dropout (LDO) regulator with pin-selectable dual-level output voltage (3.0 V / 2.5 V), 500 nA quiescent current, and 200 mV dropout at 150 mA. It supports dynamic voltage scaling for battery-powered microcontrollers such as the MSP430 in sleep/active modes.

For engineers reviewing the TPS780300250DRVT datasheet, TPS780300250DRVT pinout, TPS780300250DRVT application, or TPS780300250DRVT equivalent, this device is selected for ultra-low-I_Q power rail design, dual-voltage rail generation, and precision output accuracy (±2%) across load, line, and temperature.

Technical Context

The TPS780300250DRVT integrates factory-programmed EPROM to store two fixed output voltages (3.0 V and 2.5 V), selected via the VSET pin: logic-high (>1.2 V) selects 2.5 V, logic-low (<0.4 V) selects 3.0 V. Its CMOS-compatible enable pin supports direct interfacing with MSP430 GPIOs.

It uses an internal bandgap reference and active pull-down logic on EN/VSET to ensure precise voltage selection and fast transition times (≤800 μs high-to-low and low-to-high). Thermal shutdown (160°C trip) and current limit (~230 mA typical) provide fault protection without external components.

Key Specifications

Pinout & Package

TPS780300250DRVT is housed in a 2-mm × 2-mm SON-6 (DRV) package with exposed thermal pad. The thermal pad must be connected to ground for optimal thermal performance (R_θJB = 35.4°C/W).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar LDO regulator applications.

Compared with TPS780300250DRVT, TPS780330220DRVT offers higher output voltages for 3.3-V-system compatibility, while TPS781330220DDCR trades 2× higher IQ for lower cost and smaller SOT-23 footprint - both require no PCB redesign but differ in voltage selection and power budget trade-offs.

Availability

TPS780300250DRVT is available at Aetrix Electronics and suitable for wireless sensor nodes, portable instrumentation, and wearable health monitors requiring stable component supply with guaranteed long-term availability.

Supply support for TPS780300250DRVT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company specializing in analog and embedded processing technologies, with leadership in low-power design and precision analog ICs.

The TPS780 family is designed for ultralow-power battery-operated systems-specifically targeting dynamic voltage scaling in MSP430-based applications where nanoscale quiescent current and dual-rail flexibility are critical.

FAQ

What output voltages does the TPS780300250DRVT support?

The TPS780300250DRVT provides two factory-programmed fixed output voltages: 3.0 V when the VSET pin is driven below 0.4 V, and 2.5 V when VSET is driven above 1.2 V. These values are trimmed during manufacturing and specified with ±2% accuracy across load, line, and temperature.

How does the TPS780300250DRVT achieve 500 nA quiescent current?

The TPS780300250DRVT achieves 500 nA quiescent current through proprietary biasing circuitry and optimized pass transistor design that minimizes internal leakage. This specification is measured under nominal conditions (TJ = 25°C, VIN = VOUT(nom) + 0.5 V, IOUT = 100 μA) and remains ≤800 nA up to 100°C junction temperature.

Can the TPS780300250DRVT be used with a 1.0-μF ceramic output capacitor?

Yes, the TPS780300250DRVT is explicitly designed to be stable with a minimum 1.0-μF ceramic output capacitor. No ESR requirements or additional compensation components are needed - this simplifies layout and reduces bill-of-materials cost compared to legacy LDOs requiring tantalum or larger ceramics.

What is the thermal pad connection requirement for the TPS780300250DRVT DRV package?

The thermal pad on the TPS780300250DRVT's 2-mm × 2-mm SON-6 (DRV) package must be electrically and thermally connected to the PCB ground plane. TI recommends soldering the pad with ≥4 thermal vias to an internal or bottom-layer ground plane to achieve the specified R_θJB = 35.4°C/W and prevent thermal shutdown under 150 mA load.

Does the TPS780300250DRVT support dynamic voltage scaling with the MSP430 microcontroller?

Yes, the TPS780300250DRVT is explicitly designed for dynamic voltage scaling with TI MSP430 devices. Its VSET and EN pins accept standard CMOS logic levels, allowing direct GPIO control from the MSP430 to toggle between 3.0 V (active mode) and 2.5 V (low-power mode) without external level shifters or timing-critical firmware delays.