Texas Instruments TPS7A1508PYCKR

Overview

TPS7A1508PYCKR from Texas Instruments is a 400-mA ultra-low-dropout linear regulator optimized for battery-powered systems requiring sub-1-V input and 0.8-V fixed output. It operates with VIN as low as 0.7 V (≥ VOUT + 100 mV), achieves 80-mV max dropout at full load, delivers ±1% output accuracy over load/line/temperature, and features active output discharge. It serves as the final-stage power rail for core logic in compact portable electronics.

For engineers reviewing the TPS7A1508PYCKR datasheet, TPS7A1508PYCKR pinout, TPS7A1508PYCKR application, or TPS7A1508PYCKR equivalent, key selection criteria include its 0.7–2.2-V input range, 0.8-V fixed output, 6-bump WCSP package (0.71 mm × 1.0 mm), BIAS-supplied internal circuitry architecture, and load transient response of ±20 mV under 1–250 mA step in 10 μs.

Technical Context

The TPS7A1508PYCKR uses a dual-rail architecture: the IN pin carries the main power path (0.7–2.2 V), while the BIAS pin (2.2–5.5 V) powers internal reference and control circuitry-enabling stable regulation even when VIN is only 100 mV above VOUT. Its feedback loop incorporates SENSE for remote voltage sensing to compensate PCB trace resistance.

It integrates foldback current limiting (ICL = 450–1100 mA, ISC = 270 mA), thermal shutdown (TSD = 165°C), global UVLO on both IN (603 mV rising) and BIAS (1.42 V rising), and an active pulldown circuit (RPULLDOWN = 36 Ω) for rapid output discharge during disable.

Key Specifications

Pinout & Package

TPS7A1508PYCKR is housed in a 6-bump, 0.35-mm pitch DSBGA (WCSP) package measuring 0.71 mm × 1.0 mm-optimized for space-constrained wearables and camera modules.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar low-input, low-output LDO applications.

Compared with TPS7A1508PYCKR, TPS7A1601DQNR trades LILO capability and active discharge for smaller WSON footprint and lower quiescent current, while NCP163AMX080TBG offers comparable VIN range but sacrifices BIAS-enabled efficiency, SENSE accuracy, and discharge control-making it less suitable for high-integrity portable medical or imaging designs.

Availability

TPS7A1508PYCKR is available at Aetrix Electronics and suitable for camera modules, wireless earbuds, and smart watches requiring stable component supply, long-term lifecycle support, and consistent wafer-lot traceability.

Supply support for TPS7A1508PYCKR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and power management technologies, with decades of LDO design expertise for portable and industrial applications.

The TPS7A15 product line was engineered specifically for ultra-low-input-voltage, ultra-low-output-voltage battery-powered systems-prioritizing efficiency at sub-1-V differentials, fast transient immunity, and miniature packaging for next-generation wearables and imaging devices.

FAQ

What is the minimum input voltage required for TPS7A1508PYCKR to regulate at 0.8 V?

The TPS7A1508PYCKR requires a minimum input voltage of 0.7 V, specified for operation with VIN ≥ VOUT + 100 mV. At 0.8-V output, this means 0.9 V is needed for full electrical specifications compliance-including dropout, accuracy, and PSRR-but the device remains functional down to 0.7 V with relaxed performance. This ultra-low VIN capability is enabled by the separate BIAS rail powering internal circuitry.

Does TPS7A1508PYCKR support remote voltage sensing, and how is it implemented?

Yes, TPS7A1508PYCKR supports remote voltage sensing via its dedicated SENSE pin. Connecting SENSE directly to the load's power input node compensates for IR drop across PCB traces between the OUT pin and load, improving regulation accuracy at the point-of-load. This feature is critical in high-current, space-constrained layouts where trace resistance can exceed 20 mΩ-ensuring the load receives true 0.8 V ±1% regardless of routing parasitics.

How does the BIAS pin function in TPS7A1508PYCKR, and what voltage range is acceptable?

The BIAS pin on TPS7A1508PYCKR supplies power to the internal reference, error amplifier, and control circuitry-decoupling them from the low-VIN main path. It accepts 2.2 V to 5.5 V, and must be ≥ VOUT + 1.4 V (i.e., ≥2.2 V for 0.8-V output). This architecture allows the IN pin to operate as low as 0.7 V while maintaining full regulation performance, significantly improving system efficiency in LILO configurations.

What is the purpose of the active discharge feature in TPS7A1508PYCKR, and how fast does it operate?

The active discharge feature in TPS7A1508PYCKR uses an internal 36-Ω pulldown resistor to rapidly collapse the output voltage when the device is disabled (EN low), during UVLO, or in thermal shutdown. Discharge speed depends on COUT and parallel load resistance; for example, with 2.2 µF COUT and no load, VOUT falls from 0.8 V to 0.1 V in <1 ms. This ensures deterministic power-down states and prevents unintended wake-up in power-gated subsystems.

Can TPS7A1508PYCKR be used without connecting the EN pin, and what is the recommended default state?

Yes, TPS7A1508PYCKR can operate without external EN control: the EN pin must be tied to either IN or BIAS to ensure enablement. Leaving EN floating is not allowed. For always-on applications-such as persistent sensor rails or always-active SoC domains-connecting EN to IN is simplest and guarantees immediate startup with the input rail. The device draws only 5.7 µA IQ(IN) in this configuration at room temperature.

What thermal considerations apply to TPS7A1508PYCKR in the YCK (WCSP) package?

The YCK package has a junction-to-board thermal resistance (RθJB) of 42.1°C/W and junction-to-ambient (RθJA) of 148.5°C/W. With 400 mA output and 100-mV dropout, power dissipation is 40 mW-resulting in ~6°C junction rise above board temperature under typical PCB layout. To maintain TJ < 125°C, ensure adequate copper area under the thermal pad (connected to GND) and avoid enclosing the device in thermally isolated sections of the board.