Texas Instruments TPS84210RKGR

Overview

TPS84210RKGR from Texas Instruments is a 2-A synchronous buck DC/DC converter module integrating power MOSFETs, inductor, and passives in a 11.0 mm × 9.0 mm BQFN package. It operates from 2.95 V to 6 V input, delivers adjustable output from 0.8 V to 3.6 V with ±1% reference accuracy, supports 500 kHz–2 MHz switching frequency, and achieves up to 96% efficiency-ideal for FPGA and DSP point-of-load regulation in space-constrained industrial systems.

For engineers reviewing the TPS84210RKGR datasheet, TPS84210RKGR pinout, TPS84210RKGR application, or TPS84210RKGR equivalent, this page provides verified technical context, validated pin functions, confirmed thermal performance (12°C/W θJA), real-world efficiency curves across VIN/VOUT combinations, and two rigorously cross-checked alternative modules for PoL design flexibility.

Technical Context

The TPS84210RKGR implements a current-mode synchronous buck topology with integrated high- and low-side MOSFETs, internal compensation, and a precision 0.8-V reference. Its control loop includes programmable soft-start via SS/TR pin, output voltage tracking/sequencing capability, and external clock synchronization through RT/CLK pin.

Thermal management relies on a dedicated PowerPAD (PGND, Pin 37) with 12°C/W junction-to-ambient resistance and enhanced copper pour requirements for AGND–PGND single-point connection. Protection features include overcurrent limiting at 3.5 A, thermal shutdown at 175°C with 15°C hysteresis, and UVLO with adjustable threshold via INH/UVLO pin.

Key Specifications

Pinout & Package

TPS84210RKGR uses a 39-pin BQFN (RKG) package measuring 11.0 mm × 9.0 mm with exposed thermal pad (PowerPAD). The package supports standard QFN reflow profiles and requires specific AGND–PGND copper interconnect per TI layout guidelines.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous buck module applications.

Compared with TPS84210RKGR, TPS84250RHLR offers higher current but requires PCB redesign due to non-overlapping pinout and thermal pad geometry, while LTM4622IY#PBF provides dual outputs and spread-spectrum capability in a larger BGA package-making it suitable for advanced sequencing needs but incompatible with QFN-only assembly lines.

Availability

TPS84210RKGR is available at Aetrix Electronics and suitable for high-density FPGA power, medical imaging signal chain, PCIe slot auxiliary power, and DSP core supply applications requiring stable component supply, long-term lifecycle support, and consistent parametric performance across production batches.

Supply support for TPS84210RKGR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and power management ICs, with decades of expertise in high-reliability power conversion solutions.

The TPS84210RKGR belongs to TI's SWIFT™ integrated power module family, designed specifically for space-constrained, high-efficiency point-of-load applications in industrial, communications, and medical electronics where minimal external components and guaranteed thermal performance are critical.

FAQ

What is the maximum output current capability of the TPS84210RKGR under natural convection?

The TPS84210RKGR delivers a full 2-A continuous output current at 85°C ambient temperature with no forced airflow, validated on a standard 100 mm × 100 mm double-sided PCB with 1 oz. copper. This rating assumes proper thermal layout including the PowerPAD (Pin 37) connected to the PCB ground plane via ≥6 thermal vias and correct AGND–PGND copper interconnect per TI's recommended layout in Figure 34 of the datasheet. Derating applies above 85°C ambient.

How is the output voltage adjusted on the TPS84210RKGR?

The TPS84210RKGR output voltage is set using an external resistor (RSET) connected between VADJ (Pin 35) and AGND. The device supports 0.8 V to 3.6 V with ±1% reference accuracy; common values include 1.15 kΩ for 1.8 V and 0.459 kΩ for 3.3 V. SENSE+ (Pin 36) must be connected to VOUT either at the module or, preferably, at the load to compensate for PCB trace voltage drop and maintain regulation accuracy.

Does the TPS84210RKGR support synchronization to an external clock?

Yes, the TPS84210RKGR supports external clock synchronization via the RT/CLK pin (Pin 4). When driven with a clean CMOS-level clock signal (2.2–3.3 V high, –0.3–0.4 V low), the device locks to frequencies from 500 kHz to 2 MHz. This feature enables EMI reduction through frequency alignment across multiple converters and eliminates beat frequencies in multi-rail systems - a capability confirmed in Section 7.11 of the SLUSAN7C datasheet.

What thermal performance can be expected from the TPS84210RKGR in a typical PCB layout?

The TPS84210RKGR achieves a junction-to-ambient thermal resistance (θJA) of 12°C/W when mounted on a 100 mm × 100 mm double-sided PCB with 1 oz. copper and natural convection cooling. This value assumes adherence to TI's layout guidelines: full PowerPAD soldering with ≥6 thermal vias, dedicated AGND copper pour connected only at the PowerPAD, and proper separation of AGND and PGND planes. Measured power dissipation remains below 1.4 W at 2 A/1.8 V output.

Which protection features are built into the TPS84210RKGR?

The TPS84210RKGR integrates overcurrent protection (3.5-A current limit), thermal shutdown (175°C with 15°C hysteresis), undervoltage lockout (adjustable via INH/UVLO pin), and power-good monitoring (PWRGD pin asserts low if VOUT deviates >9% from nominal). All protections are fully autonomous and require no external components - verified in Sections 6.4 and 7.10–7.14 of the SLUSAN7C datasheet.