Texas Instruments TRF1115IRGPT

Overview

TRF1115IRGPT from Texas Instruments is a 2.5-GHz high-dynamic-range RF down-converter IC for MMDS/WCS/802.16x receivers, integrating LNA, differential mixer, LO buffer, VGA, and on-chip balun. It delivers 18 dB typical gain, 3 dB noise figure, –5 dBm input P1dB, 0 dBm IIP3, and operates across 2300–2700 MHz RF input with 400–480 MHz IF output in a 4 mm × 4 mm QFN package.

For engineers reviewing the TRF1115IRGPT datasheet, TRF1115IRGPT pinout, TRF1115IRGPT application, or TRF1115IRGPT equivalent, key selection criteria include its differential RF/LO/IF interface, 10 dB analog gain control range, integrated image-reject signal path, thermal performance with exposed thermal pad, and compatibility with TI's TRF1112 second-stage converter in broadband wireless infrastructure designs.

Technical Context

The TRF1115IRGPT implements a direct-conversion front-end architecture optimized for fixed wireless access systems, featuring a differential LNA followed by an image-reject-capable mixer stage with internal balun conversion from single-ended RF to differential IF. Its LO buffer accepts 3 dBm differential drive and provides >25 dBc RF-to-LO isolation.

Gain control is implemented via analog voltage (0–1.5 V) applied to RFAGC pin, enabling continuous 10 dB attenuation of the IF amplifier while maintaining stable noise figure and linearity trade-offs across operating conditions. The device requires external matching networks for RF, LO, and IF ports and assumes 1.5 dB in-band loss in the external image-reject filter.

Key Specifications

Pinout & Package

TRF1115IRGPT uses a 4 mm × 4 mm, 20-pin leadless QFN (RGP) package with exposed thermal pad. Pin 1 is marked by a dot; the back-side metal base must be soldered to a grounded copper area with ≥9 thermal vias (0.38 mm diameter) for thermal and RF stability.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar RF down-converter applications.

Compared with MAX2692ETE+ and ADL5360ACPZ-R7, TRF1115IRGPT uniquely integrates LNA, LO buffer, balun, and image-reject interface in one 4 mm QFN, delivering best-in-class 3 dB noise figure and system-level simplicity for MMDS/WCS infrastructure.

Availability

TRF1115IRGPT is available at Aetrix Electronics and suitable for MMDS base stations, WCS terminals, 802.16d subscriber units, point-to-multipoint radio links, and broadband wireless infrastructure requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.

Supply support for TRF1115IRGPT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with over 50 years of innovation in RF and mixed-signal IC design.

The TRF1115IRGPT belongs to TI's TRF chipset family designed specifically for broadband wireless access receivers, targeting MMDS, WCS, and early WiMAX infrastructure with integrated front-end functionality and system-level optimization.

FAQ

What is the recommended LO drive level for TRF1115IRGPT?

The TRF1115IRGPT requires a differential LO input power of 3 dBm referenced to 100 Ω, as specified in the electrical characteristics table. Applying less than 0 dBm or more than 6 dBm degrades LO-to-RF leakage, conversion gain flatness, and noise figure. The integrated LO buffer eliminates need for external amplification when driven from a 3 dBm source such as TI's TRF3705 synthesizer. TRF1115IRGPT performance is validated only within this LO power range.

Does TRF1115IRGPT support single-ended RF input?

No, TRF1115IRGPT requires differential RF input at pins RXI (pin 20) and MXRI (pin 18), both ac-coupled and matched to 50 Ω differential impedance. The on-chip balun converts single-ended RF to differential internally but does not accept single-ended drive at the package pins. External balun or transformer is mandatory for single-ended antenna or filter interfaces. TRF1115IRGPT datasheet specifies all RF parameters assuming differential excitation.

What is the function of pin RES (pin 4) on TRF1115IRGPT?

Pin RES (pin 4) is reserved and must remain unconnected - it serves no functional purpose in normal operation. TI documentation explicitly states "Do not connect or ground this pin." Internally, it may be tied to a test or calibration node; connecting it risks disrupting bias conditions in the LNA or mixer sections. TRF1115IRGPT reliability and specification compliance depend on leaving pin RES floating per the SLWS174B datasheet.

How is thermal management implemented for TRF1115IRGPT?

TRF1115IRGPT uses an exposed thermal pad on the underside of its 4 mm × 4 mm QFN package, which must be soldered to a solid ground plane with ≥9 thermal vias (0.38 mm diameter) per TI's recommended PCB layout. This achieves θJC = 9.1 °C/W, enabling safe operation at 180 mA total supply current. Inadequate thermal relief causes junction temperature to exceed 85°C ambient limit, degrading noise figure and gain stability. TRF1115IRGPT thermal performance is validated only with this layout.

Can TRF1115IRGPT operate without an external image-reject filter?

Yes, TRF1115IRGPT functions without an external image-reject filter, but image rejection drops to ~35 dB - insufficient for FCC-compliant MMDS/WCS deployments. The device includes a dedicated signal path (pins LNAO, MXRI) to route RF through an off-chip BPF; specifications assume 1.5 dB in-band loss in that filter. Omitting the filter compromises adjacent-channel interference immunity. TRF1115IRGPT's architecture is optimized for use with external filtering to achieve >50 dB image rejection.