STMicroelectronics TS3011IYCT

Overview

TS3011IYCT from STMicroelectronics is a rail-to-rail input, high-speed single comparator with 8 ns propagation delay (typ.), 470 μA supply current at 5 V, and operation from 2.2 V to 5 V across –40 °C to 125 °C. It features push-pull output, built-in 2 mV hysteresis, and automotive qualification (AEC-Q100), deployed in on-board chargers and portable communication systems.

For engineers reviewing the TS3011IYCT datasheet, TS3011IYCT pinout, TS3011IYCT application, or TS3011IYCT equivalent, key selection factors include propagation delay vs. overdrive voltage, rail-to-rail input common-mode range (VCC– –0.2 V to VCC+ +0.2 V), push-pull drive capability (64 mA short-circuit sink/source at 5 V), and DFN8 2×2 wettable flanks package for automated optical inspection.

Technical Context

The TS3011IYCT implements a high-gain, low-offset comparator core with internal hysteresis (2 mV) to prevent oscillation near threshold. Its rail-to-rail inputs support full-supply-range sensing, and push-pull output eliminates need for external pull-up resistors-enabling direct interface with CMOS logic or microcontroller GPIOs.

Designed for automotive-grade signal conditioning, it maintains stable propagation delay (8–16 ns) across supply voltages (2.2–5 V), temperatures (–40 to 125 °C), and overdrive levels (5–50 mV), with input offset drift ≤30 µV/°C and CMRR ≥57 dB at 5 V.

Key Specifications

Pinout & Package

TS3011IYCT is supplied in DFN8 2×2 mm wettable flanks package (exposed pad optional to GND), optimized for solder joint inspection and thermal performance (R_THJC = 26 °C/W). Pin functions are validated per DS8604 Rev 9 Figure 2.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed comparator applications.

Compared with TLV3501DBVR and MAX961ESA+, TS3011IYCT uniquely balances automotive qualification, ultra-low ICC, rail-to-rail input, and DFN8 wettable flanks - making it optimal for space-constrained, safety-critical EV subsystems where supply headroom and board-level reliability are non-negotiable.

Availability

TS3011IYCT is available at Aetrix Electronics and suitable for on-board chargers, portable communication systems, automotive instrument clusters, and industrial signal conditioning requiring stable component supply across automotive and industrial lifecycles.

Supply support for TS3011IYCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, specializing in automotive, industrial, and power management ICs with vertical manufacturing and AEC-Q100-aligned quality systems.

The TS3011 belongs to ST's high-speed analog comparator product line, engineered specifically for automotive electrification and portable instrumentation where speed, micropower, and rugged packaging converge.

FAQ

What is the maximum recommended PCB trace length between VDD and the 100 nF bypass capacitor?

STMicroelectronics recommends placing the 100 nF ceramic capacitor within 2 mm of the VDD pin, with the 10 nF and 1 nF capacitors placed progressively closer - the 1 nF must be ≤0.5 mm from VDD. Longer traces increase inductance, degrading high-frequency decoupling and causing propagation delay variation above 100 MHz.

Does the TS3011IYCT require external hysteresis for stable operation with slow-moving input signals?

No - the TS3011IYCT integrates 2 mV of internal hysteresis, sufficient to suppress noise-induced oscillation for input slew rates down to 10 mV/μs. External hysteresis is unnecessary unless system-level noise exceeds 2 mV peak-to-peak or input overdrive falls below 5 mV.

Can the exposed pad (EPAD) of the DFN8 package be left unconnected?

Yes - the EPAD is not electrically connected internally and may be left floating. However, soldering it to a thermal pad on the PCB reduces junction-to-ambient thermal resistance by ~45% (from 57 to 31 °C/W), improving reliability in continuous 125 °C ambient environments like OBC enclosures.

How does propagation delay vary with supply voltage at 125 °C?

At 125 °C and 50 mV overdrive, TPLH increases from 8 ns at 5 V to 11 ns at 2.2 V (DS8604 Fig. 15). This 37.5% increase is due to reduced internal gain-bandwidth; designers must validate timing margins across the full 2.2–5 V range when operating near temperature extremes.