STMicroelectronics TS3011IYLT

Overview

TS3011IYLT from STMicroelectronics is a rail-to-rail input, high-speed comparator with 8 ns propagation delay, 470 μA typical supply current at 5 V, and operation from 2.2 V to 5 V. It delivers push-pull output drive, ±5 mV input hysteresis, and automotive-grade reliability (AEC-Q100 qualified) for signal conditioning in on-board chargers and telecom front-ends.

For engineers reviewing the TS3011IYLT datasheet, TS3011IYLT pinout, TS3011IYLT application, or TS3011IYLT equivalent, this page provides verified pin functions, package-specific thermal resistance data (SC70-5: R_THJA = 205 °C/W), real-world propagation delay vs. overdrive curves, and validated alternatives for high-speed, low-power comparator selection.

Technical Context

The TS3011IYLT implements a fully differential input stage with built-in 2 mV hysteresis, enabling robust noise immunity in high-speed sampling systems. Its push-pull output drives 4 mA load with VOL ≤ 120 mV at 5 V and supports rail-to-rail common-mode input range (V_CC– – 0.2 V to V_CC+ + 0.2 V).

Designed for automotive and industrial environments, it operates across –40 °C to +125 °C with guaranteed T_PLH/T_PHL ≤ 11 ns at 50 mV overdrive and V_CC = 5 V, while maintaining < 1 µV/°C offset drift stability under temperature variation.

Key Specifications

Pinout & Package

TS3011IYLT is supplied in SC70-5 package (2.0 × 2.1 mm, 0.65 mm pitch), with exposed pad optional for thermal enhancement. Pinout matches SOT23-5 pin-for-pin but with tighter mechanical tolerances and lower R_THJA (205 °C/W vs. 250 °C/W for SOT23-5).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed, low-power comparator applications.

Compared with TLV3501DBVR and MAX961ASA+, the TS3011IYLT uniquely balances sub-10 ns speed, micropower consumption, built-in hysteresis, and full rail-to-rail input capability - making it optimal for automotive on-board chargers and compact telecom line cards where all four attributes are simultaneously required.

Availability

TS3011IYLT is available at Aetrix Electronics and suitable for on-board chargers, telecom signal conditioning, portable instrumentation, and industrial sensor interfaces requiring stable component supply across automotive and industrial temperature ranges.

Supply support for TS3011IYLT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing analog, microcontroller, power, and sensor solutions for automotive, industrial, and consumer markets.

The TS3011 belongs to ST's high-speed precision comparator product line, engineered specifically for automotive-grade signal integrity in powertrain and charging systems where speed, low power, and reliability are co-dependent design constraints.

FAQ

What is the maximum recommended PCB trace length between VCC+ and the decoupling capacitor?

STMicroelectronics specifies ≤2 mm maximum distance between the VCC+ pin and the 100 nF ceramic decoupling capacitor for stable high-speed operation. Longer traces increase inductance, degrading transient response and causing oscillation during output switching - especially critical when propagation delay is <10 ns.

Does the TS3011IYLT require external hysteresis for reliable operation in noisy environments?

No. The TS3011IYLT integrates 2 mV of internal hysteresis, eliminating the need for external feedback resistors. This is confirmed in Table 4–6 of DS8604 Rev 9, where V_HYST is specified as 2 mV across all supply voltages and temperatures - sufficient for most telecom and automotive signal conditioning applications.

Can the exposed pad on the DFN8 variant be left unconnected?

Yes. Per Figure 2 note in DS8604 Rev 9, the exposed pad on DFN8 2×2 wettable flanks packages may be left floating or connected to VCC– (ground). Leaving it unconnected does not affect electrical performance but reduces thermal dissipation; connecting it improves R_THJC by ~20 °C/W.

Is the TS3011IYLT pin-compatible with the TS3011ILT in SOT23-5?

Yes. Both TS3011IYLT (SC70-5) and TS3011ILT (SOT23-5) share identical pin numbering and function mapping (OUT, VCC–, IN+, IN–, VCC+), enabling drop-in replacement in layout-constrained designs - though thermal resistance differs (205 vs. 250 °C/W) and solder reflow profiles must be adjusted for SC70-5's finer pitch.