STMicroelectronics TS616IDW

Overview

TS616IDW from STMicroelectronics is a dual current-feedback operational amplifier designed for high-current, wide-bandwidth line driving in xDSL and video systems. It delivers 420 mA output current per channel, 40 MHz −3 dB bandwidth at 12 dB gain into 25 Ω, 420 V/µs slew rate, and 2.5 nV/√Hz input voltage noise - enabling differential 20.7 V_p-p swing on 50 Ω with ±6 V supply.

For engineers reviewing the TS616IDW datasheet, TS616IDW pinout, TS616IDW application, or TS616IDW equivalent, key selection criteria include its current-feedback architecture, thermal design constraints due to exposed-pad SO-8 packaging, differential load drive capability (10–50 Ω), and distortion performance (−87 dBc HD2 at 110 kHz) in telecommunication line driver configurations.

Technical Context

The TS616 employs a current-feedback topology with separate high-impedance non-inverting inputs (82 kΩ) and low-impedance inverting inputs (54 Ω), enabling stable high-gain operation up to 40 MHz while maintaining low distortion. Its transimpedance open-loop gain reaches 13.5 MΩ at ±6 V, supporting precise gain-setting via external feedback resistors (e.g., 910 Ω).

It operates across ±2.5 V to ±6 V supplies, with rail-to-rail output swing limited by load impedance: 10 V_p-p into 25 Ω at ±6 V, and 3.4 V_p-p into 10 Ω at ±2.5 V. Input common-mode range extends from (−V_CC + 1.5 V) to (+V_CC − 1.5 V), and thermal protection is enabled via the exposed die pad tied to −V_CC.

Key Specifications

Pinout & Package

DW package is SO-8 with exposed thermal pad (pin 4), which must be soldered to a PCB copper area connected to −V_CC for thermal management and electrical stability. Pin 1 is non-inverting input of Channel 1; pin 2 is inverting input of Channel 1; pin 3 is output of Channel 1; pin 4 is exposed pad (−V_CC); pin 5 is non-inverting input of Channel 2; pin 6 is inverting input of Channel 2; pin 7 is output of Channel 2; pin 8 is +V_CC.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-output-current, wide-bandwidth operational amplifier applications.

Compared with THS3091D and LMH6738MA, the TS616IDW uniquely balances 420 mA drive, 40 MHz bandwidth, and dual-channel integration in an exposed-pad SO-8 - making it irreplaceable for space-constrained, thermally demanding xDSL line card designs requiring single-package differential drive.

Availability

TS616IDW is available at Aetrix Electronics and suitable for xDSL line cards, broadcast video distribution systems, and telecom baseband modems requiring stable component supply across extended product lifecycles.

Supply support for TS616IDW includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, specializing in analog, power, and microcontroller solutions for industrial, automotive, and communications markets.

The TS616 belongs to ST's high-speed precision op-amp product line, engineered specifically for broadband line driving in telecommunications infrastructure where output current, distortion, and thermal robustness are co-critical.

FAQ

What is the maximum safe continuous output current for TS616IDW at +85°C ambient?

At T_amb = +85°C with proper PCB copper area under the exposed pad connected to −V_CC, the TS616IDW sustains ±320 mA continuous output current per channel. This is derived from its 150°C max junction temperature, 60 °C/W junction-to-ambient thermal resistance, and 2 W max power dissipation rating - limiting usable current to avoid thermal runaway.

Can TS616IDW operate from a single +12 V supply?

No - the TS616IDW requires dual symmetric supplies (±2.5 V to ±6 V) and does not support single-supply operation. Its input common-mode range is specified from (−V_CC + 1.5 V) to (+V_CC − 1.5 V), and the exposed pad must be tied to −V_CC; using +12 V and ground would violate absolute maximum ratings and cause immediate latch-up or damage.

Why is the exposed thermal pad electrically connected to −V_CC instead of ground?

The exposed pad is internally bonded to the die substrate, which in this bipolar process is the most negative potential node. Connecting it to −V_CC ensures zero voltage difference across the substrate-to-pad junction, preventing parasitic conduction paths and maintaining PSRR integrity. Grounding it would forward-bias substrate diodes and degrade distortion performance.

How does the current-feedback architecture affect stability with capacitive loads?

Unlike voltage-feedback op-amps, the TS616IDW's current-feedback structure exhibits reduced phase shift with capacitive loads - allowing stable operation into 100 pF without isolation resistors. However, >500 pF loads require a series resistor (≥10 Ω) between output and capacitance to prevent peaking, as confirmed in Figure 28 of the datasheet.