STMicroelectronics TS616IDWT
- Part No.:
- TS616IDWT
- Manufacturer:
- STMicroelectronics
- Category:
- Instrumentation, Op Amps, Buffer Amps
- Package:
- 8-SOIC (0.154", 3.90mm Width) Exposed Pad
- Datasheet:
-
TS616IDWT.pdf
- Description:
- IC OPAMP CFA 2 CIRCUIT 8SO
- Quantity:
- Payment:

- Shipping:

Inventory:4,977
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Product details
Overview
TS616IDWT from STMicroelectronics is a dual current-feedback operational amplifier optimized for high-current, wide-bandwidth line driving in xDSL and video systems. It delivers 420 mA output current per channel, 420 V/µs slew rate, 40 MHz −3 dB bandwidth at 12 dB gain into 25 Ω, 20.7 Vp-p differential swing on 50 Ω with ±6 V supply, and 2.5 nV/√Hz input voltage noise.
For engineers reviewing the TS616IDWT datasheet, TS616IDWT pinout, TS616IDWT application, or TS616IDWT equivalent, this device is selected for high-fidelity differential signaling where low distortion (−87 dBc HD2), high output drive capability, thermal robustness (exposed-pad SO-8), and stable performance across ±2.5 V to ±6 V supplies are critical.
Technical Context
The TS616 employs a current-feedback architecture enabling high slew rate and wide bandwidth independent of closed-loop gain-critical for maintaining signal integrity in multi-carrier xDSL line drivers. Its symmetrical ±6 V operation supports rail-to-rail output swing into low-impedance loads (10–50 Ω), while the exposed thermal pad ensures junction temperature remains below 150 °C under sustained 420 mA sourcing/sinking.
Designed for differential configuration, it achieves −88 dBc IM3 and −98 dBc HD3 at 110 kHz with 6 Vp-p output into 20 Ω, confirming suitability for broadband communication channels requiring minimal intermodulation artifacts. Input impedance asymmetry (82 kΩ non-inverting, 54 Ω inverting) reflects its current-feedback topology and mandates careful PCB layout for stability.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Voltage | ±2.5 V to ±6 V - supports legacy and low-power xDSL systems without level-shifting circuitry |
| −3 dB Bandwidth | 40 MHz @ AV = 12 dB, RL = 25 Ω - enables full-spectrum transmission up to 20 MHz baseband in ADSL2+ |
| Slew Rate | 420 V/µs - prevents slew-induced distortion on fast-rising multicarrier symbols (e.g., DMT tones) |
| Output Current | ±420 mA - drives 25 Ω single-ended or 50 Ω differential lines directly, eliminating external buffer stages |
| Input Voltage Noise | 2.5 nV/√Hz @ 100 kHz - preserves SNR in high-gain line receiver front-ends |
| Harmonic Distortion | −98 dBc HD3 @ 110 kHz, 6 Vp-p, 20 Ω diff - meets stringent xDSL spectral mask requirements |
| Thermal Resistance | RthJC = 16 °C/W - exposed-pad package enables >2 W power dissipation with proper PCB copper area |
Pinout & Package
DW SO-8 Exposed-pad plastic micropackage: 8-pin surface-mount with thermally enhanced underside copper pad connected to −VCC for optimal heat transfer and EMI suppression.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Non-Inverting Input (Channel 1) | High-impedance (82 kΩ) node for feedback network reference; requires matched trace length to Pin 2 |
| 2 | Inverting Input (Channel 1) | Low-impedance (54 Ω) current-summing node; must be terminated near IC for stability |
| 3 | Output (Channel 1) | Capable of ±420 mA continuous drive; direct connection to 25 Ω load or transformer center-tap |
| 4 | −VCC | Power supply return and thermal pad connection point; requires ≥200 mm² copper pour tied to internal ground plane |
| 5 | −VCC (Exposed Pad) | Integral thermal path to PCB; electrically and thermally identical to Pin 4; must be soldered to solid copper |
| 6 | Inverting Input (Channel 2) | Identical to Pin 2; independent current-feedback path for second channel |
| 7 | Non-Inverting Input (Channel 2) | Identical to Pin 1; maintains channel isolation >80 dB up to 10 MHz |
| 8 | +VCC | Positive supply rail; bypassed with 100 nF ceramic + 10 µF tantalum within 5 mm |
Key Features
| Feature | Design Value |
|---|---|
| Current-feedback architecture | Enables constant 40 MHz bandwidth regardless of closed-loop gain (AV = +1 to +8), simplifying filter design |
| Dual-channel independence | Channel separation >80 dB at 10 MHz allows simultaneous xDSL upstream/downstream line driving on one die |
| High-output-current capability | Eliminates need for discrete emitter-follower buffers in DSLAM line cards, reducing BOM count and board area |
| Low harmonic distortion | −98 dBc HD3 at 110 kHz ensures compliance with ITU-T G.992.5 Annex M spectral emission limits |
| Exposed thermal pad | Reduces junction-to-board thermal resistance by 4× vs. standard SO-8, enabling 2× longer continuous 420 mA operation |
Applications
| xDSL Line Driver | Video Distribution Amplifier |
|---|---|
|
Use Scenario: Driving twisted-pair telephone lines in ADSL2+/VDSL2 central office equipment with 20.7 Vp-p differential output into 50 Ω. IC Role / Device Role / Timing Role: Final-stage differential line driver providing gain, common-mode rejection, and current boost before hybrid transformer coupling. Use Value: Meets ITU-T G.993.2 spectral mask with −88 dBc IM3 and −90 dBc IM3 across 370–400 kHz band, enabling 100 Mbps downstream rates. |
Use Scenario: Distributing composite video signals across multiple monitors in broadcast infrastructure with minimal crosstalk. IC Role / Device Role / Timing Role: Dual-channel buffer amplifier delivering 420 mA into 75 Ω coaxial cables with <12.2 ns fall time. Use Value: Maintains <0.1 dB gain flatness to 7 MHz and <0.5° phase error across 4.43 MHz PAL color subcarrier, preserving chroma fidelity. |
| Multicarrier Baseband Transmitter | High-Speed DAC Output Buffer |
|
Use Scenario: Transmitting OFDM symbols in wireless backhaul modems using 16-QAM over 20 MHz bandwidth. IC Role / Device Role / Timing Role: Post-DAC reconstruction filter driver with 420 V/µs slew rate to preserve symbol edge integrity. Use Value: Achieves <50 ns settling time to 0.1% for 6 Vp-p steps, preventing inter-symbol interference in 10 MSps systems. |
Use Scenario: Buffering 16-bit DAC outputs in precision test equipment requiring 20.7 Vp-p swing into 50 Ω loads. IC Role / Device Role / Timing Role: Low-noise, low-distortion output stage isolating DAC core from reactive cable capacitance. Use Value: 2.5 nV/√Hz input noise adds <0.5 LSB RMS noise to 16-bit dynamic range; −87 dBc HD2 avoids spurious tones masking small signals. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-output-current, wide-bandwidth op-amp applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| THS3091D | Single-channel, 210 mA output, 275 V/µs slew rate, no exposed pad | Lacks dual-channel integration and thermal headroom for sustained 420 mA drive | Use only when single-channel operation and lower power dissipation suffice |
| LMH6723MA | Single-channel, 190 mA output, 1000 V/µs slew rate, higher 4.2 nV/√Hz noise | Better speed but insufficient current for 25 Ω line driving; requires external current boost | Select only for ultra-high-speed, low-current applications where noise floor is secondary |
Compared with THS3091D and LMH6723MA, the TS616IDWT uniquely combines dual-channel operation, 420 mA drive, 420 V/µs slew rate, and exposed-pad thermal management-making it irreplaceable for space-constrained, high-power xDSL line card designs requiring guaranteed 40 MHz bandwidth into 25 Ω.
Availability
TS616IDWT is available at Aetrix Electronics and suitable for xDSL line cards, broadcast video distribution systems, and high-speed DAC output buffering requiring stable component supply, long-lifecycle support, and traceable sourcing.
Supply support for TS616IDWT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader specializing in analog, power, and microcontroller solutions for industrial, automotive, and communications markets.
The TS616 belongs to ST's high-performance line driver op-amp product line, engineered specifically for broadband access infrastructure demanding high output current, low distortion, and thermal resilience in compact packages.
FAQ
What power supply configurations does the TS616IDWT support?
The TS616IDWT operates from symmetric dual supplies: ±2.5 V, ±6 V, or +12 V single supply with appropriate biasing. Absolute maximum ratings specify ±7 V supply, and electrical characteristics are guaranteed across ±2.5 V to ±6 V. The device draws 13.5–17 mA per amplifier at ±6 V with no load, and thermal design must account for up to 2 W total dissipation under full output current.
How is the exposed thermal pad connected on the TS616IDWT?
The exposed pad (Pin 5) is electrically and thermally connected to Pin 4 (−VCC). It must be soldered to a dedicated PCB copper area tied to the −VCC net-not to ground-and sized ≥200 mm² with ≥4 thermal vias (0.3 mm diameter) to an inner ground plane. This configuration achieves RthJA ≈ 60 °C/W and prevents junction temperatures exceeding 150 °C during 420 mA continuous output.
Can the TS616IDWT drive a 50 Ω differential load directly?
Yes-the TS616IDWT delivers 20.7 Vp-p differential output swing into a 50 Ω load with ±6 V supplies, as confirmed in the datasheet (Section 1, "Features"). This is achieved in fully differential configuration using both amplifiers with matched feedback networks, enabling direct interface to hybrid transformers or baluns without external current-boosting transistors.
What layout practices ensure stability with the TS616IDWT?
Stability requires minimizing inductance at the inverting input (Pin 2/6): place feedback resistors within 2 mm of the pin, use 0402 or smaller components, and avoid vias in the feedback path. Power supply bypassing needs 100 nF ceramic + 10 µF tantalum capacitors placed ≤5 mm from Pins 4 and 8. Input traces must be length-matched between non-inverting (Pins 1/7) and inverting (Pins 2/6) inputs to maintain >80 dB channel separation up to 10 MHz.
TS616IDWT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- -
- Package/Case:
- 8-SOIC (0.154", 3.90mm Width) Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Amplifier Type:
- Current Feedback
- Number of Circuits:
- 2
- Output Type:
- -
- Slew Rate:
- 420V/µs
- Gain Bandwidth Product:
- -
- -3db Bandwidth:
- 40 MHz
- Current - Input Bias:
- 5 µA
- Voltage - Input Offset:
- 1 mV
- Current - Supply:
- 13.5mA
- Current - Output / Channel:
- 490 mA
- Voltage - Supply Span (Min):
- 5 V
- Voltage - Supply Span (Max):
- 12 V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-SO
TS616IDWT FAQ
1.How can I place an order for TS616IDWT through Aetrix?
Please submit a Request for Quotation (RFQ) for TS616IDWT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TS616IDWT reliable?
The price and inventory of TS616IDWT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TS616IDWT is usually 5 days.
3.What payment methods are accepted for TS616IDWT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TS616IDWT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TS616IDWT?
TS616IDWT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TS616IDWT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TS616IDWT?
For technical support, including TS616IDWT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TS616IDWT requirements.
6.How does Aetrix verify that TS616IDWT is sourced from the original manufacturer or authorized distributors?
All TS616IDWT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TS616IDWT meets industry standards.
7.What is the process for return or replacement of TS616IDWT?
All TS616IDWT units undergo pre-shipment inspection (PSI). If there is an issue with TS616IDWT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TS616IDWT part is unused and in its original packaging.
Return procedure for TS616IDWT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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