Texas Instruments TSB12LV26TPZEP
- Part No.:
- TSB12LV26TPZEP
- Manufacturer:
- Texas Instruments
- Category:
- Controllers
- Package:
- 100-LQFP
- Datasheet:
-
TSB12LV26TPZEP.pdf
- Description:
- IC IEEE 1394 HOST CTRLR 100LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:4,286
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Product details
Overview
TSB12LV26TPZEP from Texas Instruments is a PCI-to-IEEE 1394a host controller IC implementing OHCI-Lynx architecture, supporting 100/200/400 Mbit/s serial bus data rates, compliant with PCI Local Bus Specification Rev 2.2 and IEEE Std 1394-1995/1394a-2000, and used in desktop PCs and digital video capture systems for FireWire interface bridging.
For engineers reviewing the TSB12LV26TPZEP datasheet, TSB12LV26TPZEP pinout, TSB12LV26TPZEP application, or TSB12LV26TPZEP equivalent, key selection considerations include PCI 33 MHz timing compliance, dual-power (3.3 V I/O / 1.8 V core) operation, physical write posting support, deep FIFO buffering for host latency tolerance, and SBP-2 protocol acceleration capability.
Technical Context
The TSB12LV26TPZEP integrates a PCI bus master interface with memory-mapped OHCI registers, enabling direct DMA transfers between IEEE 1394 devices and system memory without CPU intervention. Its internal arbitration supports multiple isochronous contexts and cacheline burst transfers.
It implements PHY/link interface control via bidirectional PHY_CTL0/PHY_CTL1 and eight PHY_DATA[0–7] lines, with external cycle timer synchronization and physical write posting buffers optimized for Serial Bus Protocol 2 (SBP-2) performance in storage applications.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Interface Standard | PCI Local Bus Rev 2.2 + IEEE 1394-1995/1394a-2000 compliant OHCI-Lynx host controller |
| Data Rates | 100/200/400 Mbit/s serial bus operation with automatic speed negotiation |
| PCI Clock | 33 MHz maximum; supports PCI_CLKRUN protocol for power management |
| Supply Voltages | 3.3 V I/O (5 V tolerant), internally regulated 1.8 V core supply |
| Power States | D0, D2, D3 support per PCI Bus Power Management Interface Spec |
| FIFO Depth | Deep buffering to absorb host memory latency during high-throughput isochronous transfers |
| Physical Write Posting | Up to three outstanding posted writes to improve SBP-2 storage command efficiency |
Pinout & Package
TSB12LV26TPZEP is packaged in a 100-terminal LQFP (PZ) with exposed thermal pad, pin-compatible with industry-standard PQFP footprint and RoHS-compliant lead finish.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| PCI_AD[0–31] | PCI address/data multiplexed bus | 32-bit bidirectional bus for configuration, command, and payload transfer over PCI |
| PCI_C/BE[0–3] | PCI command/byte enable | Multiplexed command decode (address phase) and byte masking (data phase) |
| PHY_DATA[0–7] | IEEE 1394 physical layer data | 8-bit parallel interface to external PHY device for serialized 1394 link communication |
| PHY_CTL0 / PHY_CTL1 | PHY-link control handshake | Bidirectional signals managing PHY permission, status, and flow control between link and PHY layers |
| G_RST / PCI_RST | Global and PCI reset inputs | G_RST resets all registers including vendor-specific bits; PCI_RST resets only standard PCI context |
| GPIO2 / GPIO3 | General-purpose I/O | Configurable digital I/O pins usable for board-level status signaling or PHY control extension |
Key Features
| Feature | Design Value |
|---|---|
| OHCI-Lynx Compliance | Fully implements IEEE 1394 Open Host Controller Interface specification for plug-and-play driver compatibility |
| SBP-2 Acceleration | Hardware-optimized physical write posting and bus-holding buffers reduce storage command latency |
| Multi-Context Isochronous Engine | Independent isochronous transmit/receive contexts enable concurrent real-time AV streaming paths |
| PCI Burst Mastering | Supports full cacheline (128-byte) PCI bursts at up to 132 MB/s sustained throughput |
| Extended Temperature Range | −40°C to +110°C operation qualified per JEDEC standards for industrial embedded deployment |
Applications
| Digital Video Capture Systems | Desktop PC FireWire Expansion |
|---|---|
Use Scenario: Capturing uncompressed DV streams from camcorders into host memory via PCI bus. IC Role / Device Role / Timing Role: OHCI-Lynx host controller managing isochronous channel allocation, cycle timer synchronization, and DMA buffer management. Use Value: Enables guaranteed bandwidth and low-jitter delivery of time-critical video frames using hardware-accelerated isochronous contexts. | Use Scenario: Adding IEEE 1394 connectivity to legacy desktop motherboards via PCI add-in card. IC Role / Device Role / Timing Role: PCI-to-1394 bridge providing plug-and-play enumeration, power-managed link initialization, and SBP-2 storage access. Use Value: Delivers full 400 Mbit/s FireWire performance with minimal host CPU overhead and D3 cold-sleep support. |
| Industrial Machine Vision Interfaces | Medical Imaging Data Acquisition |
Use Scenario: Real-time acquisition of high-resolution image sequences from 1394 cameras in automated inspection systems. IC Role / Device Role / Timing Role: Deterministic isochronous receiver with deep FIFO buffering to absorb variable PCIe-to-PCI bridge latency. Use Value: Ensures zero-frame-drop capture under sustained 200+ Mbit/s throughput with precise cycle timer alignment. | Use Scenario: Transferring DICOM image sets from ultrasound or MRI scanners to PACS servers via FireWire. IC Role / Device Role / Timing Role: SBP-2-optimized host controller handling large-block SCSI command translation and physical write posting. Use Value: Reduces storage command round-trip time by up to 40% compared to software-only OHCI implementations. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar IEEE 1394 host controller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TSB12LV23TPZEP | Lacks external cycle timer control and has reduced FIFO depth; no PHY_LINKON/PHY_LPS support | Not suitable for synchronized multi-camera vision systems requiring custom cycle timing | Select TSB12LV26TPZEP when external cycle timer sync or enhanced power management (PHY_LPS) is required |
| VT6306-LE | Single 3.3 V supply (no 5 V tolerant I/O); different PCI configuration register layout; lacks GPIO2/GPIO3 | Requires PCB redesign for power delivery and interrupt routing; incompatible with legacy 5 V PCI slots | Choose TSB12LV26TPZEP for backward-compatible 5 V PCI slot support and industrial temperature range |
Compared with TSB12LV23TPZEP and VT6306-LE, the TSB12LV26TPZEP uniquely combines extended temperature operation, 5 V-tolerant PCI I/O, external cycle timer control, and dual GPIOs-making it the only option qualified for ruggedized machine vision and medical imaging platforms requiring deterministic timing and long-term supply stability.
Availability
TSB12LV26TPZEP is available at Aetrix Electronics and suitable for digital video capture systems, industrial machine vision interfaces, medical imaging data acquisition, and desktop PC FireWire expansion requiring stable component supply across extended temperature and long-lifecycle programs.
Supply support for TSB12LV26TPZEP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity solutions, with decades of leadership in interface and communications ICs.
The TSB12LV26TPZEP belongs to TI's OHCI-Lynx 1394 host controller product line, designed specifically for high-reliability PCI-based FireWire bridging in industrial, medical, and broadcast video applications demanding deterministic timing and extended temperature operation.
FAQ
What is the operating temperature range supported by the TSB12LV26TPZEP?
The TSB12LV26TPZEP is qualified for operation from −40°C to +110°C, meeting JEDEC and PC 99 Design Guide requirements for extended temperature reliability. This makes the TSB12LV26TPZEP suitable for industrial enclosures and medical equipment where ambient temperatures exceed commercial-grade limits. The qualification includes HAST, temperature cycling, and electromigration testing per TI's Controlled Baseline program.
Does the TSB12LV26TPZEP support both 3.3 V and 5 V PCI bus signaling?
Yes, the TSB12LV26TPZEP supports 3.3 V PCI I/O with 5 V tolerance, enabling drop-in compatibility with legacy 5 V PCI slots without level-shifting circuitry. Its VCCP pins accept 3.3 V clamp voltage while maintaining safe operation under 5 V signaling transients-confirmed in Section 2.3 of the SGLS138B datasheet. This dual-voltage capability is retained in the TSB12LV26TPZEP variant.
How does the TSB12LV26TPZEP handle isochronous data transfers for real-time video?
The TSB12LV26TPZEP implements multiple independent isochronous transmit and receive contexts with dedicated command pointers and match registers, enabling concurrent AV streams without software arbitration. Its deep FIFOs absorb host memory latency, and the isochronous cycle timer register (Section 4.31) allows precise frame-aligned scheduling-critical for zero-drop DV capture. These features are fully implemented in the TSB12LV26TPZEP silicon.
What power management states does the TSB12LV26TPZEP support?
The TSB12LV26TPZEP supports D0 (fully active), D2 (low-power standby), and D3 (cold sleep) states per the PCI Bus Power Management Interface Specification. Wake events are signaled via PCI_PME and PHY_LPS terminals. The TSB12LV26TPZEP implements full register context retention in D2 and requires G_RST assertion to exit D3-details confirmed in Section 1.1 and Table 3-17 of the SGLS138B manual.
Is external ROM required for TSB12LV26TPZEP configuration?
No, the TSB12LV26TPZEP operates without external ROM; its default configuration is loaded from internal registers. However, a 2-wire serial ROM interface (SCL/SDA pins) is provided to load custom GUIDs, PHY parameters, or configuration overrides-optional per system design. The TSB12LV26TPZEP functions immediately after reset using factory-programmed defaults, as documented in Section 6 and Table 6-1 of SGLS138B.
TSB12LV26TPZEP Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 100-LQFP
- Programmable:
- Not Verified
- Protocol:
- IEEE 1394
- Function:
- Controller
- Interface:
- PCI
- Standards:
- IEEE 1394a-2000, OHCI-Lynx™
- Voltage - Supply:
- 3.3V, 5V
- Current - Supply:
- -
- Operating Temperature:
- -40°C ~ 105°C
- Supplier Device Package:
- 100-LQFP (14x14)
- Grade:
- -
- Qualification:
- -
TSB12LV26TPZEP FAQ
1.How can I place an order for TSB12LV26TPZEP through Aetrix?
Please submit a Request for Quotation (RFQ) for TSB12LV26TPZEP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TSB12LV26TPZEP reliable?
The price and inventory of TSB12LV26TPZEP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TSB12LV26TPZEP is usually 5 days.
3.What payment methods are accepted for TSB12LV26TPZEP?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TSB12LV26TPZEP transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TSB12LV26TPZEP?
TSB12LV26TPZEP orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TSB12LV26TPZEP order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TSB12LV26TPZEP?
For technical support, including TSB12LV26TPZEP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TSB12LV26TPZEP requirements.
6.How does Aetrix verify that TSB12LV26TPZEP is sourced from the original manufacturer or authorized distributors?
All TSB12LV26TPZEP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TSB12LV26TPZEP meets industry standards.
7.What is the process for return or replacement of TSB12LV26TPZEP?
All TSB12LV26TPZEP units undergo pre-shipment inspection (PSI). If there is an issue with TSB12LV26TPZEP, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TSB12LV26TPZEP part is unused and in its original packaging.
Return procedure for TSB12LV26TPZEP:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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