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STMicroelectronics TSB582IDT

Part No.:
TSB582IDT
Manufacturer:
STMicroelectronics
Category:
Instrumentation, Op Amps, Buffer Amps
Package:
8-SOIC (0.154", 3.90mm Width) Exposed Pad
Datasheet:
AetrixTSB582IDT.pdf
Description:
200 MA OUTPUT CURRENT WITH THERM
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,640

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Product details

Overview

TSB582IDT from STMicroelectronics is a dual, unity-gain-stable, high-voltage (4–36 V), high-output-current (200 mA per channel) operational amplifier with rail-to-rail output and low-rail input capability. It integrates thermal shutdown, output current limiting, 4 kV HBM ESD tolerance, and enhanced RF noise immunity. Designed for driving inductive loads such as angle resolvers and piezo actuators in automotive-grade industrial systems.

For engineers reviewing the TSB582IDT datasheet, TSB582IDT pinout, TSB582IDT application, or TSB582IDT equivalent, key selection criteria include its 3.1 MHz gain bandwidth, 2 V/µs slew rate, ±42 V absolute maximum supply, -40 °C to +125 °C operating range, and dual-channel high-current drive capability in SO8 and DFN8 exposed-pad packages.

Technical Context

The TSB582IDT employs a BiCMOS process enabling simultaneous high voltage operation (up to 36 V), high output current (200 mA/channel), and precision DC performance (2.4 mV max offset at 25 °C). Its internal protection architecture includes thermal shutdown triggered at 168–180 °C and current limiting that sustains safe operation under overload or short-circuit conditions.

It supports bridge-tied load (BTL) configurations and parallel channel operation to double sink/source current. Input common-mode range extends from VCC− to VCC+ − 1.5 V, and it maintains stability with capacitive loads up to 100 pF - improved further with optional 10–30 Ω series output isolation resistors.

Key Specifications

Parameter Value and Actual Design Meaning
Supply Voltage 4 V to 36 V - enables direct integration into 12 V/24 V automotive and industrial power rails without external regulators.
Output Current 200 mA per channel - sufficient to directly drive angle resolvers, solenoid valves, and piezo actuators without external buffers.
Gain Bandwidth Product 3.1 MHz @ 36 V - supports closed-loop bandwidth >1 MHz in unity-gain configuration for fast servo control loops.
Slew Rate 2 V/µs - ensures <1.3 µs overload recovery and accurate reproduction of fast transient signals in motor control feedback paths.
Input Offset Voltage 2.4 mV max @ 25 °C - enables sub-0.1% accuracy in precision current sensing and analog signal conditioning over temperature.
ESD Rating 4 kV HBM - meets AEC-Q101-001 requirements for robustness in harsh automotive environments.
Operating Temperature -40 °C to +125 °C - qualified for under-hood and industrial control applications with full parameter guarantee across range.
Thermal Resistance 40 °C/W (DFN8), 45 °C/W (SO8) - enables >1.5 W continuous dissipation with standard PCB copper area, supporting high-power analog output stages.

Pinout & Package

TSB582IDT is available in two automotive-qualified packages: SO8 with exposed pad (EP) and DFN8 (3 × 3 mm) with wettable flanks and exposed pad. Both support thermal enhancement via soldered EP connection to PCB ground or VCC−.

Pin/Terminal Circuit Role Design Meaning
1 (Out1) Channel 1 output High-current source/sink node capable of 200 mA; connects directly to inductive load or BTL stage.
2 (In1−) Channel 1 inverting input Differential input node with ±42 V absolute max rating; requires external current limiting if Vid > ±1.3 V.
3 (In1+) Channel 1 non-inverting input High-impedance input (2 nA bias current) supporting wide common-mode range (VCC− to VCC+ − 1.5 V).
4 (VCC−) Negative supply rail Reference for both channels; exposed pad may be connected here to improve thermal conduction and reduce junction temperature.
5 (In2+) Channel 2 non-inverting input Independent high-Z input identical to In1+, enabling dual-sensor conditioning or differential drive configurations.
6 (In2−) Channel 2 inverting input Matches In1− specs; supports independent feedback networks for each amplifier channel.
7 (Out2) Channel 2 output Second 200 mA output; used in parallel mode (doubling current) or BTL with Out1 for higher-voltage swing.
8 (VCC+) Positive supply rail Accepts up to 42 V absolute max; powers both amplifiers and internal protection circuitry.
ep (Exposed Pad) Thermal & electrical ground Not electrically required but thermally critical - must be soldered to PCB copper for specified RthJA (40/45 °C/W).

Key Features

Feature Design Value
Rail-to-rail output + low-rail input Enables full dynamic range utilization in single-supply 12 V/24 V systems, e.g., valve driver feedback loops with 0–10 V output compliance.
Internal thermal shutdown Auto-recovery at 130–146 °C reset threshold prevents latch-up during sustained overload - eliminates need for external thermal fuses in servo drivers.
200 mA per channel with current limiting Supports direct drive of 60 Ω loads at 12 V (200 mA × 60 Ω = 12 V drop), eliminating discrete output transistors in resolver excitation circuits.
Enhanced RF noise immunity EMIRR >60 dB up to 1 GHz minimizes offset shift from GSM/ISM-band interference - critical for automotive body control modules near wireless transceivers.
Unity-gain stable with 100 pF load Eliminates need for external compensation in line driver and motor phase current sensing applications where capacitive cable loads exceed 50 pF.
Low 45 nV/√Hz input noise Preserves SNR in precision analog front-ends for portable instrumentation and industrial process controllers measuring µV-level sensor outputs.

Applications

Angle Resolver Excitation Servo Motor Current Feedback

Use Scenario: Generating precise 10 kHz sinusoidal excitation signals for brushless resolver sensors in EPS and traction inverters.

IC Role / Device Role / Timing Role: Dual-channel op amp configured in BTL mode to deliver ±12 V, 100 mA differential sine wave with <0.005% THD+N.

Use Value: Eliminates external push-pull stage while maintaining <2.4 mV offset-induced angular error across -40 °C to 125 °C.

Use Scenario: Amplifying shunt voltage in real-time motor phase current sensing for field-oriented control (FOC) in industrial drives.

IC Role / Device Role / Timing Role: High-speed, low-noise current sense amplifier with 2 V/µs slew rate and 3.1 MHz bandwidth for <1 µs current loop response.

Use Value: Enables 12-bit effective resolution at 20 kHz sampling with <45 nV/√Hz noise floor and rail-to-rail output swing into ADC reference.

Valve Driver Interface Industrial LED Power Stage

Use Scenario: Driving 24 V solenoid valves with PWM-modulated analog current setpoints in hydraulic control units.

IC Role / Device Role / Timing Role: High-current buffer converting DAC output to 0–200 mA valve coil current with integrated current limit and thermal foldback.

Use Value: Replaces discrete MOSFET + op amp + sense resistor solution; reduces BOM count by 7 parts and improves short-circuit survival time by 3×.

Use Scenario: Constant-current regulation for high-brightness LED strings in smart lighting and signage systems.

IC Role / Device Role / Timing Role: Precision current source using Out1 as IOUT and Out2 as sensing comparator in closed-loop configuration.

Use Value: Maintains ±1% LED brightness uniformity across 40–125 °C ambient with 200 mA compliance and <3 mV full-range offset drift.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-current, high-voltage op amp applications.

Alternative Part Technical Difference Application Difference Selection Advice
TSC2010IDT Single-channel, 150 mA output, 2.5 MHz GBW, no thermal shutdown Lacks dual-channel capability and internal protection - requires external current limiting and thermal monitoring circuitry Select only when single-channel operation suffices and board space allows added protection components.
LM7332MME/NOPB Dual-channel, 60 mA output, 20 MHz GBW, rail-to-rail I/O, no current limiting Higher speed but insufficient output current for resolver/valve loads; not AEC-Q101 qualified Prefer for high-bandwidth signal conditioning only; unsuitable for direct inductive load driving.

Compared with TSC2010IDT and LM7332MME/NOPB, the TSB582IDT uniquely combines dual 200 mA outputs, automotive qualification, integrated thermal/current protection, and 36 V operation - making it the only drop-in solution for safety-critical, high-power analog output stages in automotive and industrial motion control.

Availability

TSB582IDT is available at Aetrix Electronics and suitable for servo driver design, valve actuation systems, and industrial process control requiring stable component supply across extended temperature and voltage ranges.

Supply support for TSB582IDT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, specializing in automotive, industrial, and power management ICs with vertical manufacturing and AEC-Q100/Q101 qualification expertise.

The TSB582IDT belongs to ST's high-reliability precision analog portfolio, engineered specifically for automotive and industrial motion control applications demanding robust high-current amplification with integrated protection and extended temperature operation.

FAQ

What is the maximum continuous output current per channel for TSB582IDT?

The TSB582IDT delivers up to 200 mA per channel continuously under thermal limits. At 36 V supply and 25 °C ambient, this corresponds to ~1.5 W dissipation in SO8 (RthJA = 45 °C/W), requiring ≥4 cm² of 2-oz copper on the PCB. Derating applies above 85 °C ambient per Figure 29/30 SOA curves.

Can TSB582IDT drive capacitive loads greater than 100 pF?

Yes - with stability maintained up to 100 pF in unity-gain configuration. For larger loads, insert a 10–30 Ω series resistor (RISO) between output and load. At RISO = 30 Ω, stability is guaranteed regardless of capacitance, though output voltage drop must be accounted for in precision applications.

Is the exposed pad electrically connected internally?

No - the exposed pad is thermally conductive but electrically isolated. It may be left floating or connected to VCC− for optimal thermal performance. ST recommends soldering it to a large copper pour tied to VCC− to achieve the rated RthJA of 40 °C/W (DFN8) or 45 °C/W (SO8).

How does the internal thermal shutdown behave during overload?

When junction temperature exceeds 168–180 °C, the output stage disables automatically. Output resumes when die cools to 130–146 °C. This cycle prevents permanent damage but is not intended for continuous operation - system design must ensure average power stays within SOA limits using PCB copper area or heatsinking.

TSB582IDT Specifications

Product attributes
Attribute value
Manufacturer:
STMicroelectronics
Series:
-
Package/Case:
8-SOIC (0.154", 3.90mm Width) Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Active
Amplifier Type:
CMOS
Number of Circuits:
2
Output Type:
Rail-to-Rail
Slew Rate:
2V/µs
Gain Bandwidth Product:
3.1 MHz
-3db Bandwidth:
-
Current - Input Bias:
2 nA
Voltage - Input Offset:
2.4 mV
Current - Supply:
2.5mA (x2 Channels)
Current - Output / Channel:
200 mA
Voltage - Supply Span (Min):
4 V
Voltage - Supply Span (Max):
36 V
Operating Temperature:
-40°C ~ 125°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-SO

TSB582IDT FAQ

1.How can I place an order for TSB582IDT through Aetrix?

Please submit a Request for Quotation (RFQ) for TSB582IDT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TSB582IDT reliable?

The price and inventory of TSB582IDT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TSB582IDT is usually 5 days.

3.What payment methods are accepted for TSB582IDT?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TSB582IDT transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TSB582IDT?

TSB582IDT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TSB582IDT order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TSB582IDT?

For technical support, including TSB582IDT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TSB582IDT requirements.

6.How does Aetrix verify that TSB582IDT is sourced from the original manufacturer or authorized distributors?

All TSB582IDT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TSB582IDT meets industry standards.

7.What is the process for return or replacement of TSB582IDT?

All TSB582IDT units undergo pre-shipment inspection (PSI). If there is an issue with TSB582IDT, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TSB582IDT part is unused and in its original packaging.

Return procedure for TSB582IDT:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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