STMicroelectronics TSB582IQ2T

Overview

TSB582IQ2T from STMicroelectronics is a dual, unity-gain-stable, high-voltage (4–36 V), high-output-current (200 mA per channel) operational amplifier with rail-to-rail output and low-rail input capability. It integrates thermal shutdown, output current limiting, 4 kV HBM ESD tolerance, and enhanced RF noise immunity. Designed for driving inductive loads such as angle resolvers and piezo actuators in automotive-grade industrial systems.

For engineers reviewing the TSB582IQ2T datasheet, TSB582IQ2T pinout, TSB582IQ2T application, or TSB582IQ2T equivalent, key selection criteria include its 3.1 MHz gain bandwidth, 2 V/µs slew rate, -40 °C to +125 °C operating range, 45 nV/√Hz input noise at 1 kHz, and dual-channel parallel/bridge-tied drive capability.

Technical Context

The TSB582IQ2T employs a BiCMOS process enabling both high voltage operation (up to 36 V supply) and robust output current delivery (200 mA per channel). Its internal protection architecture includes thermal shutdown triggered at 168–180 °C junction temperature and current limiting active during overload conditions.

It features dual independent amplifiers with matched input offset voltage (≤3 mV over full temperature range), high common-mode rejection (≥81 dB), and supply voltage rejection (≥116 dB), supporting precision signal conditioning in noisy automotive and industrial environments where rail-to-rail output swing and low input bias current (<5 nA) are critical.

Key Specifications

Pinout & Package

TSB582IQ2T is packaged in DFN8 (3 × 3 mm) with wettable flanks and exposed pad, optimized for thermal performance (R_thJA = 40 °C/W) and automated optical inspection in automotive PCB assembly.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-current, high-voltage op-amp applications.

Compared with TSC2010IDT and LM7332MA/NOPB, TSB582IQ2T uniquely combines dual-channel 200 mA drive, automotive qualification, integrated thermal/current protection, and 36 V operation-making it the only option for robust, high-power analog actuation in safety-critical systems.

Availability

TSB582IQ2T is available at Aetrix Electronics and suitable for servo driver, valve driver, and industrial process control applications requiring stable component supply, long-term lifecycle assurance, and automotive-grade traceability.

Supply support for TSB582IQ2T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power ICs, sensors, and analog components for automotive, industrial, and consumer markets.

The TSB582IQ2T belongs to ST's high-voltage, high-output-current operational amplifier product line-engineered specifically for ruggedized analog actuation in automotive electrification and industrial automation where reliability under overload and thermal stress is mandatory.

FAQ

What is the maximum continuous output current per channel for TSB582IQ2T?

The TSB582IQ2T delivers up to 200 mA per channel continuously under specified thermal conditions (T_A ≤ 85 °C, PCB copper area ≥ 200 mm², R_thJA = 40 °C/W). At higher ambient temperatures or reduced copper area, derating applies per Figure 29–30 SOA curves. Output current remains limited to prevent junction temperature exceeding 150 °C.

Can TSB582IQ2T drive capacitive loads without external compensation?

Yes, the TSB582IQ2T is unity-gain stable and supports ≥100 pF capacitive loads without oscillation. For loads >100 pF, adding a 10–30 Ω series resistor (R_ISO) at the output ensures stability across all conditions; 30 Ω guarantees stability regardless of capacitance value while preserving DC accuracy for purely capacitive loads.

Is the exposed pad on the DFN8 package electrically connected?

Yes-the exposed pad is internally connected to V_CC– and must be soldered to a PCB copper pour tied to the negative supply plane. Leaving it floating degrades thermal performance (R_thJA increases by ~15 °C/W) and reduces ESD/EMI immunity. Wettable flanks ensure reliable automated optical inspection during SMT assembly.

How does the thermal shutdown mechanism behave during sustained overload?

When junction temperature exceeds 168–180 °C, the output stage disables until die temperature falls below 130–146 °C, then automatically resumes operation. This cycle prevents permanent damage but is not intended for continuous operation. System design must ensure average power dissipation stays within SOA limits-external fusing or PTCs are recommended for fault-prone applications.