STMicroelectronics TSB622IDT
- Part No.:
- TSB622IDT
- Manufacturer:
- STMicroelectronics
- Category:
- Instrumentation, Op Amps, Buffer Amps
- Package:
- 8-SOIC (0.154", 3.90mm Width)
- Datasheet:
-
TSB622IDT.pdf
- Description:
- LOW POWER, 1.7MHZ, RAIL-TO-RAIL
- Quantity:
- Payment:

- Shipping:

Inventory:2,100
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
TSB622IDT from STMicroelectronics is a dual-channel, rail-to-rail output operational amplifier optimized for automotive and industrial applications. It delivers 1.7 MHz gain bandwidth, ≤1 mV input offset voltage at 25 °C, 375 μA per channel supply current at 36 V, and operates across ±0.1 V to (VCC − 1 V) input common-mode range with −40 to 125 °C temperature rating.
For engineers reviewing the TSB622IDT datasheet, TSB622IDT pinout, TSB622IDT application, or TSB622IDT equivalent, key selection criteria include its AEC-Q100-qualified SO8 package, 36 V wide supply capability, low-power high-precision amplification in battery monitoring, sensor signal conditioning, and power supply feedback loops.
Technical Context
The TSB622IDT implements a bipolar-input, unity-gain-stable op-amp architecture with rail-to-rail output swing and input common-mode voltage extending to ground. Its 1.7 MHz GBP and 0.6 V/µs slew rate support stable closed-loop operation up to 100 kHz with capacitive loads ≤100 pF.
Designed for harsh environments, it features 4 kV HBM ESD tolerance, EMI hardening, and guaranteed performance over −40 to 125 °C. The device maintains <1.6 mV max offset drift (−40 to 125 °C) and >105 dB CMRR at 36 V supply, enabling precision DC-coupled sensing in automotive body control modules and industrial PLC analog I/O.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Gain Bandwidth Product | 1.7 MHz - Enables stable unity-gain buffer or 10× inverting amplifier up to ~170 kHz with phase margin ≥45°. |
| Input Offset Voltage | ≤1 mV at 25 °C - Ensures ≤10 mV error in 10 V full-scale 12-bit ADC front-end without trimming. |
| Supply Current per Channel | 375 μA max at 36 V - Allows dual-opamp operation in 1 mA total system budget for always-on automotive sensors. |
| Rail-to-Rail Output | Swings within 46 mV of VCC and 60 mV of VEE at 25 °C - Maximizes dynamic range in single-supply 3.3 V or 5 V systems. |
| Common-Mode Input Range | Includes ground (VEE − 0.1 V) to VCC − 1 V - Supports direct connection to shunt resistors and bridge sensors referenced to system ground. |
| Operating Temperature | −40 to 125 °C - Qualified per AEC-Q100 Grade 1 for under-hood and transmission control unit deployment. |
| ESD Tolerance | 4 kV HBM - Reduces need for external protection in exposed automotive harness interfaces. |
Pinout & Package
TSB622IDT is supplied in an industry-standard SO8 (Small Outline 8-pin) package with 1.27 mm pitch, 5.0 mm × 4.0 mm footprint, and wettable flanks option available. Thermal resistance θJA = 125 °C/W enables operation at full rating without forced airflow.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | OUT1 | Dual op-amp Channel 1 output - Drives feedback networks or ADC inputs with 35 mA sink/source capability. |
| 2 | IN1− | Inverting input for Channel 1 - Accepts differential signals or configured as summing node in active filters. |
| 3 | IN1+ | Non-inverting input for Channel 1 - Interfaces directly with grounded sensors or voltage dividers. |
| 4 | VCC− | Negative supply rail - Supports true dual-supply operation down to ±1.35 V or single-supply 0 V ground reference. |
| 5 | IN2+ | Non-inverting input for Channel 2 - Enables independent signal paths for multi-sensor systems (e.g., temp + pressure). |
| 6 | IN2− | Inverting input for Channel 2 - Configurable for transimpedance or difference amplification with matched layout. |
| 7 | OUT2 | Dual op-amp Channel 2 output - Provides redundancy or parallel gain stages without external IC duplication. |
| 8 | VCC+ | Positive supply rail - Accepts up to 36 V, allowing direct connection to 24 V automotive battery rails with no LDO pre-regulation. |
Key Features
| Feature | Design Value |
|---|---|
| Rail-to-rail output swing | Delivers full 3.3 V or 5 V output range in single-supply systems, eliminating level-shifting circuitry. |
| 1.7 MHz GBP at 36 V | Enables fast transient response in motor current sensing while maintaining <375 μA/channel quiescent current. |
| AEC-Q100 qualified | Validated for automotive Grade 1 (−40 to 125 °C), including HTOL, TC, and ESD stress per JEDEC JESD47. |
| EMI-hardened design | Reduces susceptibility to radiated RF interference (e.g., 800–2500 MHz cellular bands) without external filtering. |
| Input common-mode includes ground | Allows direct interfacing with low-side current shunts and grounded thermistors without biasing resistors. |
Applications
| Battery Management System (BMS) | Automotive Cabin Pressure Sensor |
|---|---|
Use Scenario: Monitoring cell voltage and pack current in 12 V/48 V hybrid vehicle battery stacks. IC Role / Device Role / Timing Role: Dual op-amp performs simultaneous high-side voltage sensing (via resistor divider) and low-side shunt amplification with matched gain and offset. Use Value: ≤1 mV offset ensures ≤0.01% full-scale error in 16 V cell measurement; rail-to-rail output maximizes ADC utilization in 3.3 V microcontroller interface. |
Use Scenario: Conditioning piezoresistive pressure transducer output in HVAC control modules. IC Role / Device Role / Timing Role: First-stage instrumentation amplifier (in-amp configuration using both channels) rejects common-mode noise from engine bay wiring harnesses. Use Value: >105 dB CMRR at 36 V supply suppresses ignition noise; −40 to 125 °C operation guarantees calibration stability across cabin temperature extremes. |
| Industrial Power Supply Feedback | Motor Control Current Sensing |
Use Scenario: Providing isolated voltage feedback to PWM controller in 24 V industrial SMPS units. IC Role / Device Role / Timing Role: Buffering optocoupler output signal while driving compensation network with low output impedance. Use Value: 35 mA output drive sustains loop stability with 1 nF compensation capacitor; 1.7 MHz GBP supports >100 kHz loop bandwidth. |
Use Scenario: Amplifying bidirectional current sense signals in BLDC motor gate drivers. IC Role / Device Role / Timing Role: Dual-channel configuration enables real-time phase current acquisition (INx+/INx−) with matched thermal tracking. Use Value: Matched offset drift (<2 µV/°C) minimizes torque ripple; 0.6 V/µs slew rate resolves 10 kHz PWM edge transitions without distortion. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-channel, rail-to-rail output operational amplifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TSB622IST | Same die, MiniSO8 package (3.0 × 3.0 mm vs SO8's 5.0 × 4.0 mm); θJA = 190 °C/W vs 125 °C/W. | Better suited for space-constrained PCBs where thermal margin allows higher junction temperature rise. | Select when board area is critical and ambient temperature remains <85 °C; verify thermal derating per layout. |
| TSB622IQ3T | Same die, DFN8 3×3 mm wettable flanks package; θJA = 40 °C/W; requires solder paste volume control for void-free reflow. | Optimized for automated optical inspection (AOI) and high-reliability automotive modules requiring IPC Class 3 assembly. | Choose for production lines with X-ray inspection capability and strict IPC-A-610E solder joint acceptance criteria. |
Compared with TSB622IDT, the IST variant trades thermal performance for footprint reduction, while the IQ3T offers superior thermal dissipation and process traceability at the cost of tighter assembly control-making IDT the balanced choice for mainstream automotive and industrial designs requiring proven SO8 manufacturability.
Availability
TSB622IDT is available at Aetrix Electronics and suitable for battery management systems, automotive cabin sensors, industrial power supply feedback circuits, and motor control current sensing requiring stable component supply with AEC-Q100 compliance and long-term automotive lifecycle support.
Supply support for TSB622IDT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power ICs, sensors, and analog components for automotive, industrial, and consumer markets.
The TSB622IDT belongs to ST's precision rail-to-rail op-amp product line, engineered specifically for automotive-grade signal conditioning where wide supply range, low offset, and robust EMI immunity are mandatory in safety-critical subsystems.
FAQ
Is TSB622IDT pin-compatible with other dual op-amps in SO8 packages?
No-TSB622IDT uses a non-standard SO8 pinout: VCC− is on Pin 4 (not Pin 4 GND), and VCC+ is on Pin 8 (not Pin 8 VCC). Substituting with generic dual op-amps (e.g., LM358, TL072) will cause incorrect biasing or damage. Always verify pin mapping against Figure 2 and Table 2 in DS13848 Rev 3.
Does TSB622IDT support true dual-supply operation with negative voltage?
Yes-TSB622IDT operates with VCC− as low as −18 V and VCC+ as high as +18 V (total supply ≤36 V), enabling ±15 V operation. Input common-mode range extends to VCC− − 0.1 V, allowing inputs below ground in dual-supply configurations without phase reversal.
What is the maximum capacitive load the TSB622IDT can drive while remaining stable?
TSB622IDT maintains ≥45° phase margin with ≤100 pF capacitive load at unity gain (per Figure 19–21, DS13848 Rev 3). Driving >100 pF requires isolation resistor (≥100 Ω) between output and load to preserve stability-critical for driving long traces or ADC input capacitance.
How does the 4 kV HBM ESD rating impact system-level protection design?
The 4 kV HBM rating applies to individual pins during handling-not system-level surge immunity. For ISO 10605 or IEC 61000-4-2 compliance, external TVS diodes (e.g., SMAJ5.0A) remain mandatory on all exposed inputs/outputs; the internal ESD structure protects only against assembly-line electrostatic discharge.
TSB622IDT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- -
- Package/Case:
- 8-SOIC (0.154", 3.90mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Amplifier Type:
- General Purpose
- Number of Circuits:
- 2
- Output Type:
- Rail-to-Rail
- Slew Rate:
- 0.6V/µs
- Gain Bandwidth Product:
- 1.7 MHz
- -3db Bandwidth:
- -
- Current - Input Bias:
- 15 nA
- Voltage - Input Offset:
- 1 mV
- Current - Supply:
- 310µA
- Current - Output / Channel:
- 45 mA
- Voltage - Supply Span (Min):
- 2.7 V
- Voltage - Supply Span (Max):
- 36 V
- Operating Temperature:
- -40°C ~ 125°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-SO
TSB622IDT FAQ
1.How can I place an order for TSB622IDT through Aetrix?
Please submit a Request for Quotation (RFQ) for TSB622IDT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TSB622IDT reliable?
The price and inventory of TSB622IDT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TSB622IDT is usually 5 days.
3.What payment methods are accepted for TSB622IDT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TSB622IDT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TSB622IDT?
TSB622IDT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TSB622IDT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TSB622IDT?
For technical support, including TSB622IDT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TSB622IDT requirements.
6.How does Aetrix verify that TSB622IDT is sourced from the original manufacturer or authorized distributors?
All TSB622IDT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TSB622IDT meets industry standards.
7.What is the process for return or replacement of TSB622IDT?
All TSB622IDT units undergo pre-shipment inspection (PSI). If there is an issue with TSB622IDT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TSB622IDT part is unused and in its original packaging.
Return procedure for TSB622IDT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TSB622IDT Tags

-
LM358DT
STMicroelectronics

-
LM358DR
Texas Instruments

-
LM2904DR
Texas Instruments

-
LM358ADR
Texas Instruments
-
LM2904DGKR
Texas Instruments
-
LM324DR
Texas Instruments

-
MCP6006T-E/OT
Microchip Technology

-
MCP6006UT-E/OT
Microchip Technology

-
LM324PWR
Texas Instruments

-
LM2902PWR
Texas Instruments
-
LM2902DR
Texas Instruments

-
LM358P
Texas Instruments
Tech Hub
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
