Renesas TSE2002B3CNCG

Overview

TSE2002B3CNCG from Integrated Device Technology (IDT) is a JEDEC JC42.4-compliant digital temperature sensor with integrated 256-byte serial EEPROM, designed for SPD applications in DDR2/DDR3 DIMM modules. It delivers ±0.5°C accuracy from –20°C to +125°C, supports programmable resolution down to 0.0625°C, and features an open-drain EVENT pin for memory throttling in server and laptop memory subsystems.

For engineers reviewing the TSE2002B3CNCG datasheet, TSE2002B3CNCG pinout, TSE2002B3CNCG application, or TSE2002B3CNCG equivalent, key selection criteria include SMBus timeout compliance (25–35 ms), software-write-protectable EEPROM addressing (0x00–0x7F locked, 0x80–0xFF user-writable), I²C/SMBus interface (10–400 kHz), and event-mode configurability (interrupt/comparator/TCRIT-only).

Technical Context

The TSE2002B3CNCG integrates two independent functional blocks: a high-accuracy ADC-based temperature sensor with configurable hysteresis (0/1.5/3/6°C) and resolution (9–12 bit), and a 2Kbit EEPROM organized as one 256-byte block with dual write-protection schemes (reversible SWP and permanent PSWP). Both blocks share a single I²C/SMBus interface but use distinct Device Type Identifier Codes (0011b for TS registers, 1010b for SPD memory, 0110b for protection control).

Its EVENT pin operates in three modes-Interrupt (latched until cleared via Status Register), Comparator (self-clearing on limit recovery), or TCRIT-Only (asserted only above critical threshold minus hysteresis)-and requires external pull-up. The device supports up to eight slaves on one bus via SA0–SA2 address pins and meets strict SMBus timeout specifications across all operational states (active, shutdown, standby).

Key Specifications

Pinout & Package

Package: DFN-8 (3 mm × 2 mm, 0.5 mm pitch), RoHS-compliant, moisture-sensitive level 1.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar temperature-sensing-with-SPD-memory applications.

Compared with AT30TS74-MA8Y and NCP1022DR2G, the TSE2002B3CNCG uniquely combines JEDEC JC42.4 compliance, permanent EEPROM write protection, and SMBus timeout enforcement - making it the only drop-in solution for DDR2/DDR3 SPD+sensor requirements in production memory modules.

Availability

TSE2002B3CNCG is available at Aetrix Electronics and suitable for DDR2/DDR3 DIMM manufacturing, server motherboard design, and industrial memory subsystem development requiring stable component supply, long-lifecycle support, and JEDEC-compliant thermal management.

Supply support for TSE2002B3CNCG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, is a fabless semiconductor company specializing in timing, memory interface, RF, and sensor solutions for computing and communications infrastructure.

The TSE2002B3CNCG belongs to IDT's memory interface sensor family, engineered specifically to meet JEDEC JC42.4 requirements for integrated temperature sensing and SPD storage in high-reliability DRAM modules.

FAQ

What is the primary function of the TSE2002B3CNCG in a DDR3 memory module?

The TSE2002B3CNCG serves as the JEDEC JC42.4-compliant temperature sensor and SPD EEPROM in DDR3 DIMMs. It monitors DRAM die temperature with ±0.5°C accuracy and stores module configuration data (speed, size, organization) in its 256-byte EEPROM - enabling memory controllers to perform thermal throttling and initialization based on validated SPD contents. Its EVENT pin directly signals critical temperature events to the MCH.

Does the TSE2002B3CNCG support permanent write protection of SPD data?

Yes, the TSE2002B3CNCG supports permanent write protection via the PSWP (Permanently Set Write Protection) command. When executed, this instruction locks the lower 128 bytes (0x00–0x7F) of its EEPROM against all future writes - including power cycles and software resets. Once set, PSWP cannot be reversed, ensuring factory-programmed SPD data remains tamper-proof throughout the module's lifetime.

How does the EVENT pin operate in Interrupt Mode versus Comparator Mode on the TSE2002B3CNCG?

In Interrupt Mode, the TSE2002B3CNCG's EVENT pin remains asserted until the host writes '1' to the Clear Event bit in the Status Register - enabling OS-level polling and precise event sequencing. In Comparator Mode, the pin self-clears when the temperature returns within hysteresis bounds of the programmed limit - ideal for hardware-triggered thermal regulation without software intervention. Mode selection is register-configurable and independent of polarity setting.

What are the SMBus timing requirements that the TSE2002B3CNCG guarantees?

The TSE2002B3CNCG guarantees SMBus timeout compliance: tTIMEOUT,min = 25 ms and tTIMEOUT,max = 35 ms. It also meets all AC timing specs for 10–400 kHz operation, including SDA rise/fall times (≤300 ns), clock pulse widths (tHIGH ≥600 ns, tLOW ≤1300 ns), and setup/hold times (e.g., tSU:STA ≥600 ns). These ensure interoperability with standard SMBus masters without clock stretching.

Can multiple TSE2002B3CNCG devices share the same I²C bus, and how is addressing managed?

Yes, up to eight TSE2002B3CNCG devices can share one I²C/SMBus. Addressing is controlled by hard-wiring the SA0, SA1, and SA2 pins to VDDSPD or VSSSPD - each combination generates a unique 3-bit slave address suffix. The full 7-bit address includes a fixed 4-bit Device Type Identifier (0011b for TS registers, 1010b for SPD memory), allowing independent access to temperature and EEPROM functions without address conflict.