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Renesas TSE2002GB2A1NCG

Part No.:
TSE2002GB2A1NCG
Manufacturer:
Renesas
Category:
Thermal Management
Package:
8-WFDFN Exposed Pad
Datasheet:
AetrixTSE2002GB2A1NCG.pdf
Description:
IC TEMP SENS EEPROM DFN-8
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,984

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Product details

Overview

TSE2002GB2A1 from Integrated Device Technology (IDT) is a digital temperature sensor with integrated 256-byte serial EEPROM, designed for DDR2/DDR3 DIMM modules requiring JEDEC JC42.4-compliant thermal monitoring and SPD data storage. It delivers ±0.5°C accuracy from +75°C to +95°C, supports I²C/SMBus up to 400 kHz, and features an open-drain EVENT pin for memory throttling or microprocessor interrupt signaling.

For engineers reviewing the TSE2002GB2A1 datasheet, TSE2002GB2A1 pinout, TSE2002GB2A1 application, or TSE2002GB2A1 equivalent, key selection considerations include its dual-function architecture (temperature sensing + SPD EEPROM), programmable resolution (0.0625°C–0.5°C), hysteresis options (0/1.5/3/6°C), SMBus timeout compliance (25–35 ms), and PSON-8 (DFN-8) package compatibility with memory module space constraints.

Technical Context

The TSE2002GB2A1 integrates two independent functional blocks: a sigma-delta ADC-based temperature sensor with configurable conversion resolution (9–12 bit) and a 2Kbit (256×8) EEPROM organized as one block with software write protection. Its I²C/SMBus interface uses three device-type identifiers (0011b for TS registers, 1010b for SPD memory, 0110b for write-protection commands) and leverages SA0–SA2 pins to set 3-bit slave address bits, enabling up to eight devices on one bus.

Temperature event signaling operates in three modes-Interrupt, Comparator, or Critical-Only-controlled via configuration registers and modulated by user-defined upper/lower/critical limits and hysteresis. The EVENT pin's open-drain output requires external pull-up and supports active-high or active-low polarity, with self-clearing behavior in Comparator Mode and latched assertion in Interrupt Mode until cleared via status register write.

Key Specifications

ParameterValue and Actual Design Meaning
Temp Accuracy±0.5°C (typ) / ±1.0°C (max) from +75°C to +95°C - enables precise thermal throttling in DDR memory modules
ResolutionProgrammable 0.0625°C to 0.5°C (12-bit to 9-bit) - allows trade-off between precision and conversion time (100 ms max)
EEPROM Size256 bytes (2Kbit), organized as single block - stores SPD data including DRAM access speed, size, and organization
Voltage Range2.3 V to 3.6 V - compatible with DDR2/DDR3 module supply rails and low-power system requirements
I²C/SMBus Speed10–400 kHz - supports standard and fast-mode operation while meeting SMBus timeout spec (25–35 ms)
Hysteresis OptionsSelectable 0°C, 1.5°C, 3°C, or 6°C - prevents chatter during temperature threshold crossings in thermostat or throttling use cases
Operating Temp−20°C to +125°C ambient - covers full industrial range required for server and laptop memory subsystems

Pinout & Package

Package: PSON-8 (also labeled DFN-8 or TDFN-8), 2 mm × 3 mm, 0.5 mm pitch, exposed thermal pad (pin 4 = VSSSPD ground).

Pin/TerminalCircuit RoleDesign Meaning
1 (SA0)Select Address 0Part of 3-bit slave address; also used to detect high-voltage (≥7 V) for SWP/CWP/PSWP command decoding
2 (SA1)Select Address 1Part of 3-bit slave address; logic level (VDDSPD/VSSSPD) sets bit b2 of I²C slave address
3 (SA2)Select Address 2Part of 3-bit slave address; logic level (VDDSPD/VSSSPD) sets bit b3 of I²C slave address
4 (VSSSPD)GroundPrimary ground reference for both temperature sensor and EEPROM; connects to exposed thermal pad
5 (SDA)Serial Data I/OOpen-drain bidirectional I²C/SMBus data line; requires external pull-up to VDDSPD
6 (SCL)Serial Clock InputInput-only I²C/SMBus clock; accepts 10–400 kHz; Schmitt-triggered with noise filtering
7 (EVENT)Temperature Event OutputOpen-drain output for critical/upper/lower limit alerts; configurable as interrupt or comparator with polarity select
8 (VDDSPD)Supply VoltageSingle 2.3–3.6 V supply powering both sensor and EEPROM; decoupling capacitor recommended

Key Features

FeatureDesign Value
JEDEC JC42.4 ComplianceFully compliant with JEDEC JC42.4 Component Specification - ensures interoperability in standardized memory modules
Dual-Function IntegrationCombines high-accuracy temperature sensor and SPD EEPROM in one PSON-8 package - eliminates board space and BOM count vs. discrete solutions
SMBus Timeout SupportMeets strict SMBus timeout spec (25 ms min / 35 ms max) in all operating modes - guarantees bus recovery during EEPROM writes or sensor shutdown
Software Write ProtectionThree-tier protection: reversible SWP/CWP and permanent PSWP for lower 128 bytes (0x00–0x7F) - secures SPD configuration data against accidental overwrite
Configurable EVENT Polarity & ModeSupports active-high or active-low EVENT output with Interrupt, Comparator, or Critical-Only mode selection - adapts to host controller signal requirements without external logic

Applications

Memory Module Thermal ManagementServer Memory Subsystem Monitoring

Use Scenario: Real-time temperature monitoring of DDR3 DIMMs in enterprise servers to trigger dynamic memory throttling before thermal derating occurs.

IC Role / Device Role / Timing Role: Primary JEDEC-compliant temperature sensor and SPD EEPROM for DRAM module identification and thermal control loop feedback.

Use Value: Enables precise +75°C to +95°C thermal response (±0.5°C) and reliable SMBus communication under high-noise server backplane conditions.

Use Scenario: Embedded thermal supervision in multi-channel memory controllers where DIMM temperature must be reported to BMC/IPMI for system-level thermal management.

IC Role / Device Role / Timing Role: Slave device on SMBus providing calibrated temperature readings and SPD data to baseboard management controller.

Use Value: Delivers guaranteed 100 ms max conversion time and interrupt-capable EVENT pin to synchronize throttling actions across multiple DIMMs.

Laptop DDR2/DDR3 Module CalibrationIndustrial Memory-Based Edge Controller

Use Scenario: Temperature-compensated SPD data storage in ultra-portable laptop memory modules where thermal headroom is constrained.

IC Role / Device Role / Timing Role: Dual-role IC storing vendor-defined memory timing parameters and reporting real-time die temperature to CPU power management unit.

Use Value: Integrates 256-byte EEPROM with write-protected lower sector (0x00–0x7F) and 0.0625°C resolution sensor - supports fine-grained thermal compensation algorithms.

Use Scenario: Ruggedized memory modules in industrial edge controllers requiring long-term SPD data integrity and wide-temperature operation.

IC Role / Device Role / Timing Role: JEDEC-compliant thermal sensor and nonvolatile configuration store for memory subsystems operating from −20°C to +125°C ambient.

Use Value: Combines −20°C to +125°C operating range, permanent software write protection (PSWP), and 2.3–3.6 V supply tolerance - ensures reliability in uncontrolled environments.

Equivalent & Alternatives

The following parts are listed as comparable options for similar temperature-sensing-with-SPD-EEPROM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
AT30TS74-MA8Y±0.5°C accuracy over 0°C–+85°C only; no integrated SPD EEPROM; separate 256-byte EEPROM requiredRequires external EEPROM and additional PCB area; lacks JEDEC JC42.4 compliance and EVENT pin functionalityUse only if SPD storage is handled elsewhere and JEDEC compliance is not required
LM75BIMM/NOPB±2°C accuracy over −25°C–+100°C; no EEPROM; no EVENT pin; I²C-only (no SMBus timeout support)Cannot replace SPD function; unsuitable for DIMM thermal throttling due to accuracy and missing event signalingConsider only for basic ambient temperature monitoring where SPD and JEDEC compliance are irrelevant

Compared with AT30TS74-MA8Y and LM75BIMM/NOPB, the TSE2002GB2A1 uniquely integrates JEDEC-compliant temperature sensing, SPD EEPROM, and configurable EVENT signaling in a single PSON-8 package - eliminating design complexity and ensuring drop-in compatibility in DDR2/DDR3 memory modules.

Availability

TSE2002GB2A1 is available at Aetrix Electronics and suitable for DDR2/DDR3 DIMM modules, server memory subsystems, and industrial edge controllers requiring stable component supply, JEDEC compliance, and integrated thermal + SPD functionality.

Supply support for TSE2002GB2A1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT) was a fabless semiconductor company specializing in timing, memory interface, RF, and sensor solutions before its acquisition by Renesas Electronics in 2019. IDT pioneered JEDEC-compliant thermal sensors for memory modules.

The TSE2002GB2A1 belongs to IDT's temperature sensor + SPD EEPROM product line, engineered specifically for DDR2/DDR3 DIMM modules to meet JEDEC JC42.4 requirements for thermal monitoring and serial presence detect data storage.

FAQ

What is the primary application of the TSE2002GB2A1?

The TSE2002GB2A1 is primarily used in DDR2 and DDR3 memory modules as a JEDEC JC42.4-compliant digital temperature sensor with integrated 256-byte SPD EEPROM. It provides accurate thermal monitoring (±0.5°C from +75°C to +95°C) and stores critical DRAM configuration data such as access speed, size, and organization. Its EVENT pin enables direct integration into memory throttling systems, making the TSE2002GB2A1 essential for thermal management in servers, laptops, and high-performance computing platforms.

Does the TSE2002GB2A1 support SMBus timeout functionality?

Yes, the TSE2002GB2A1 fully supports SMBus timeout functionality with guaranteed 25 ms minimum and 35 ms maximum timeout periods. This feature is active in all operational modes-including active temperature sensing, EEPROM standby, and sensor shutdown-and ensures robust bus recovery during EEPROM write cycles or communication faults. The timeout capability is verified per SMBus specification and is critical for reliable operation in server and industrial memory subsystems where bus contention must be resolved deterministically.

How is write protection implemented in the TSE2002GB2A1's EEPROM?

The TSE2002GB2A1 implements three software-controlled write protection mechanisms for its 256-byte EEPROM: Set Write Protection (SWP), Clear Write Protection (CWP), and Permanently Set Write Protection (PSWP). SWP and CWP are reversible and persist across power cycles, while PSWP permanently locks the lower 128 bytes (0x00–0x7F) - commonly used for SPD data - against any future writes. These functions require specific I²C command sequences and voltage levels on SA0 (e.g., ≥7 V for SWP/CWP), ensuring secure, tamper-resistant storage of critical memory configuration information.

What are the supported I²C/SMBus addressing options for the TSE2002GB2A1?

The TSE2002GB2A1 supports up to eight unique I²C/SMBus addresses via three hardware-selectable pins: SA0, SA1, and SA2. Each pin must be hard-wired to VDDSPD or VSSSPD (not pulled via resistors) to define a 3-bit slave address extension. Combined with device-type identifiers (0011b for temperature registers, 1010b for SPD memory, 0110b for write-protection commands), this enables concurrent access to temperature data, SPD storage, and protection settings on the same bus - allowing up to eight TSE2002GB2A1 devices to coexist without address conflict in multi-DIMM systems.

Can the EVENT pin of the TSE2002GB2A1 operate in both active-high and active-low configurations?

Yes, the EVENT pin of the TSE2002GB2A1 can be configured for either active-high or active-low operation via a dedicated polarity bit in the configuration register. In active-low mode, the open-drain pin pulls low when a temperature limit is exceeded; in active-high mode, it requires point-to-point wiring to avoid masking by other devices on a shared bus. The pin supports three functional modes - Interrupt (latched until cleared), Comparator (self-clearing), and Critical-Only (asserted only above TCRIT limit minus hysteresis) - giving system designers flexibility to match host controller interface requirements without external logic.

TSE2002GB2A1NCG Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
8-WFDFN Exposed Pad
Packaging:
Tube
Product Status:
Obsolete
Function:
Temp Monitoring System (Sensor)
Sensor Type:
Internal
Sensing Temperature:
-20°C ~ 125°C
Accuracy:
±2°C
Topology:
ADC, Register Bank
Output Type:
I2C/SMBus
Output Alarm:
No
Output Fan:
No
Voltage - Supply:
2.3V ~ 3.6V
Operating Temperature:
-20°C ~ 125°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-VFQFPN (2x3)

TSE2002GB2A1NCG FAQ

1.How can I place an order for TSE2002GB2A1NCG through Aetrix?

Please submit a Request for Quotation (RFQ) for TSE2002GB2A1NCG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TSE2002GB2A1NCG reliable?

The price and inventory of TSE2002GB2A1NCG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TSE2002GB2A1NCG is usually 5 days.

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Once your TSE2002GB2A1NCG order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TSE2002GB2A1NCG?

For technical support, including TSE2002GB2A1NCG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TSE2002GB2A1NCG requirements.

6.How does Aetrix verify that TSE2002GB2A1NCG is sourced from the original manufacturer or authorized distributors?

All TSE2002GB2A1NCG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TSE2002GB2A1NCG meets industry standards.

7.What is the process for return or replacement of TSE2002GB2A1NCG?

All TSE2002GB2A1NCG units undergo pre-shipment inspection (PSI). If there is an issue with TSE2002GB2A1NCG, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TSE2002GB2A1NCG part is unused and in its original packaging.

Return procedure for TSE2002GB2A1NCG:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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