Renesas TSE2004GB2B0NCG8

Overview

TSE2004GB2B0 from Integrated Device Technology is a JEDEC JC42.4-compliant digital temperature sensor with integrated 4Kbit (512-byte) serial EEPROM, designed for DDR4 DIMM modules. It delivers ±0.5°C accuracy from +75°C to +95°C, supports I²C/SMBus up to 1 MHz, features programmable hysteresis (0/1.5/3/6°C), and uses an open-drain EVENT pin for thermal throttling in memory subsystems.

For engineers reviewing the TSE2004GB2B0 datasheet, TSE2004GB2B0 pinout, TSE2004GB2B0 application, or TSE2004GB2B0 equivalent, key selection criteria include SPD EEPROM compatibility, SMBus timeout compliance (25–35 ms), JEDEC B-grade accuracy, 8-DFN package integration on DIMM PCBs, and dual-function register access via DTIC-based addressing (0011 for TS, 1010 for EEPROM).

Technical Context

The TSE2004GB2B0 implements a dual-domain architecture: a temperature-sensing core with 125 ms max conversion time and 0.0625°C resolution, and a 512-byte EEPROM organized as two 256-byte pages with four independently software-lockable 128-byte blocks. Both domains share a single 2.2–3.6 V supply and operate under strict SMBus timing constraints including guaranteed 25–35 ms clock-low timeout detection.

It uses three address pins (SA0–SA2) to generate an I²C slave address alongside device-type identifier codes (0011 for TS registers, 1010 for SPD reads/writes, 0110 for write-protection commands), enabling up to eight devices per bus while supporting backward compatibility with TSE2002av firmware through page-select command mapping.

Key Specifications

Pinout & Package

Package: 8-DFN (2.0 × 3.0 × 0.75 mm) with exposed thermal paddle on underside, recommended to be connected to ground for optimal DIMM PCB thermal coupling.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar digital temperature sensor + SPD EEPROM applications.

Compared with AT30TS74-MA8Y-T and MAX6604ATA+, the TSE2004GB2B0 uniquely integrates JEDEC-certified B-grade thermal sensing, 512-byte SPD EEPROM, and configurable EVENT signaling in a single 8-DFN package-enabling drop-in DDR4 module compliance without redesigning memory controller firmware or adding discrete components.

Availability

TSE2004GB2B0 is available at Aetrix Electronics and suitable for DDR4 DIMM manufacturing, server motherboard design, and industrial embedded memory modules requiring stable component supply and JEDEC-compliant thermal intelligence.

Supply support for TSE2004GB2B0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, is a fabless semiconductor company specializing in timing, memory interface, RF, and sensor solutions for high-performance computing and communications infrastructure.

The TSE2004GB2B0 belongs to IDT's JEDEC-compliant thermal sensor family, engineered specifically for DDR4 memory module SPD and real-time thermal management in servers, laptops, and industrial systems.

FAQ

What is the primary application of the TSE2004GB2B0?

The TSE2004GB2B0 is primarily designed for DDR4 DIMM modules as a JEDEC JC42.4-compliant temperature sensor with integrated 512-byte SPD EEPROM. It provides accurate thermal monitoring and secure storage of memory configuration data, enabling memory throttling via its EVENT pin in servers, laptops, and industrial systems. The TSE2004GB2B0 meets strict SMBus timing and accuracy requirements essential for DDR4 qualification.

Does the TSE2004GB2B0 support I²C and SMBus protocols?

Yes, the TSE2004GB2B0 supports both I²C and SMBus protocols through a 2-wire serial interface operating from 10 kHz to 1 MHz. It complies with SMBus timeout specifications (25–35 ms), includes Schmitt-trigger inputs, and supports standard I²C ACK/NACK handshaking. The TSE2004GB2B0 does not implement clock stretching but fully supports SMBus Alert and host notify functions via its EVENT pin.

How is the EEPROM in the TSE2004GB2B0 protected from unintended writes?

The TSE2004GB2B0 EEPROM features reversible software write protection across four independent 128-byte blocks. Protection is enabled using SMBus commands (SWPn) with VHV voltage (7–10 V) applied to the SA0 pin; it is cleared using the CWP command, also requiring VHV. This mechanism allows field-updatable SPD data security without permanent fusing. The TSE2004GB2B0 does not support permanent write protection like earlier TSE2002av devices.

What are the accuracy specifications of the TSE2004GB2B0 across temperature ranges?

The TSE2004GB2B0 offers JEDEC JC42.4 B-grade accuracy: ±0.5°C typical / ±1.0°C maximum from +75°C to +95°C; ±1.0°C typical / ±2.0°C maximum from +40°C to +125°C; and ±2.0°C typical / ±3.0°C maximum from -40°C to +125°C. These values are measured under specified operating conditions (VDDSPD = 2.2–3.6 V, TA = ambient), and the TSE2004GB2B0 maintains resolution down to 0.0625°C with 125 ms max conversion time.

Can multiple TSE2004GB2B0 devices share the same SMBus?

Yes, up to eight TSE2004GB2B0 devices can operate on a single SMBus segment. Each device uses SA0, SA1, and SA2 pins to configure a unique 3-bit Logical Serial Address (LSA), combined with device-type identifier codes (0011, 1010, 0110) to form full 7-bit slave addresses. This enables concurrent access to temperature registers, SPD EEPROM, and write-protection controls without address conflict - a key capability for multi-DIMM server memory subsystems using the TSE2004GB2B0.