STMicroelectronics TSV324ID

Overview

TSV324ID from STMicroelectronics is a quad rail-to-rail input/output operational amplifier designed for low-voltage, high-precision signal conditioning in space-constrained industrial and portable systems. It operates from 2.5 V to 6 V, delivers 1.3 MHz gain bandwidth at 3 V, drives 600 Ω loads within 100 mV of rails, and supports –40 °C to +125 °C operation - enabling use in battery-powered sensor front-ends and notebook audio subsystems.

For engineers reviewing the TSV324ID datasheet, TSV324ID pinout, TSV324ID application, or TSV324ID equivalent, key selection criteria include its rail-to-rail I/O swing at low supply, 80 mA output current capability, ±100 mV output voltage error under 600 Ω load, extended common-mode range (VDD – 0.2 V to VCC + 0.2 V), and SO14 package thermal resistance of 105 °C/W.

Technical Context

The TSV324ID implements a CMOS input stage with rail-to-rail input common-mode range extending 200 mV beyond supply rails and rail-to-rail output swing limited to 100 mV from each rail under 600 Ω load. Its internal compensation ensures stability with up to 500 pF capacitive load without external compensation.

It features a 1.3 MHz gain-bandwidth product at VCC = 3 V and 1.4 MHz at VCC = 5 V, 0.42–0.6 V/µs slew rate, and 80 dB typical CMRR and PSRR - making it suitable for DC-coupled sensor amplification and single-supply active filters where phase margin ≥53° must be maintained across temperature.

Key Specifications

Pinout & Package

TSV324ID is supplied in SO14 (Small Outline 14-pin) package per JEDEC MS-012, with 1.27 mm pitch, 8.55–8.75 mm body length, and 5.8–6.2 mm body width. Thermal resistance junction-to-ambient is 105 °C/W on standard 2-layer FR-4 PCB.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar quad rail-to-rail op-amp applications.

Compared with LMV324IDR, TSV324ID provides superior rail extension and thermal robustness; compared with TSV854IPT, it trades bandwidth and noise for wider temperature range and lower power - making it optimal for cost-sensitive, high-reliability industrial analog front-ends.

Availability

TSV324ID is available at Aetrix Electronics and suitable for industrial sensor signal conditioning, portable audio line driving, laptop battery monitoring, and automotive cabin temperature control requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for TSV324ID includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing analog, MCU, power, and sensor solutions for industrial, automotive, and consumer markets.

The TSV3xx family was developed as a low-voltage, rail-to-rail upgrade to the LM324/LM358 legacy op-amp series - targeting portable, battery-powered, and space-constrained embedded systems requiring precision analog signal conditioning at 2.5–6 V.

FAQ

What is the maximum capacitive load the TSV324ID can drive without oscillation?

The TSV324ID maintains ≥53° phase margin with up to 500 pF capacitive load at unity gain, per datasheet Figure 14 and Table 3. This eliminates need for isolation resistors in most ADC driver or cable-driving applications. For loads >500 pF, external compensation (e.g., feedback capacitor) is required to ensure stability.

Can TSV324ID operate with a single 2.5 V supply and still achieve rail-to-rail output swing?

Yes - at VCC = 2.5 V, the output swings within 100 mV of both rails into a 600 Ω load, per Table 3. However, VOL rises to ~130 mV and VOH drops to ~2.37 V at min-spec conditions, so true 0–2.5 V swing requires light loading or post-regulation. Input common-mode range extends to VDD – 0.2 V (–0.2 V) and VCC + 0.2 V (2.7 V).

How does the input offset voltage drift affect long-term accuracy in uncalibrated systems?

TSV324ID exhibits ΔVio/ΔT = 2 µV/°C (typical). Over a –40 °C to +125 °C range (165 °C ΔT), this contributes ≤330 µV drift - negligible in 12-bit systems (Vref = 2.5 V → LSB = 610 µV) but significant in 16-bit designs. For high-accuracy applications, system-level calibration or selection of TSV324A (1 µV/°C max) is recommended.

Is the SO14 package of TSV324ID compatible with lead-free reflow profiles?

Yes - TSV324ID is qualified for standard JEDEC J-STD-020 lead-free reflow, with peak temperature up to 260 °C for 10 seconds. The device uses ECOPACK®2-compliant packaging and meets RoHS/REACH requirements. Recommended profile includes ramp rate ≤3 °C/s, soak at 150–200 °C for 60–120 s, and time above liquidus (217 °C) of 60–90 s.