My Inquiry
My Account
STMicroelectronics TSV324IDT
- Part No.:
- TSV324IDT
- Manufacturer:
- STMicroelectronics
- Category:
- Instrumentation, Op Amps, Buffer Amps
- Package:
- 14-SOIC (0.154", 3.90mm Width)
- Datasheet:
-
TSV324IDT.pdf
- Description:
- IC OPAMP GP 4 CIRCUIT 14SO
- Quantity:
- Payment:
- Shipping:
Inventory:2,976
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
TSV324IDT from STMicroelectronics is a quad rail-to-rail input/output operational amplifier optimized for low-voltage, high-output-current applications. It operates from 2.5 V to 6 V, delivers ±80 mA output current, supports rail-to-rail I/O swing within 100 mV of each supply rail (at 600 Ω load), features 1.3 MHz gain bandwidth at 3 V, and is rated for -40 °C to +125 °C operation - ideal for battery-powered sensor signal conditioning and portable audio driver circuits.
For engineers reviewing the TSV324IDT datasheet, TSV324IDT pinout, TSV324IDT application, or TSV324IDT equivalent, key selection considerations include its extended common-mode input range (VDD − 0.2 V to VCC + 0.2 V), 500 pF capacitive load stability, 0.6 V/µs slew rate, low 650 µA per-amplifier supply current, and SO14 package compatibility with legacy LM324 footprints.
Technical Context
The TSV324IDT implements a CMOS input stage enabling rail-to-rail input voltage range beyond the supplies and an AB-class output stage delivering high sink/source current without external boost circuitry. Its internal compensation ensures stable operation with up to 500 pF capacitive loads, eliminating need for external isolation resistors in driving cables or capacitive transducers.
Designed as a low-voltage drop-in replacement for LM324, it maintains identical SO14 pinout while improving performance: 1.3 MHz GBW at 3 V (vs. ~1 MHz for LM324 at 5 V), 27 nV/√Hz input noise, and 80 dB CMRR at 25 °C - enabling higher-precision DC-coupled amplification in space-constrained industrial and portable systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Voltage | 2.5 V to 6 V - enables direct operation from single Li-ion or dual alkaline cells without regulation. |
| Gain Bandwidth Product | 1.3 MHz at VCC = 3 V - supports active filters up to ~100 kHz and fast-settling sensor interfaces. |
| Output Current | ±80 mA typical - drives 32 Ω headphone loads or 600 Ω instrumentation lines without external buffers. |
| Input Offset Voltage | 3 mV max (TSV324), 1 mV max (TSV324A) - reduces DC error in precision gain stages and bridge sensor amplifiers. |
| Common-Mode Input Range | VDD − 0.2 V to VCC + 0.2 V - accepts inputs beyond rails, simplifying level-shifting in mixed-supply systems. |
| Slew Rate | 0.6 V/µs - supports 100 kHz full-power sine wave output into 600 Ω with <0.1% THD. |
| Operating Temperature | −40 °C to +125 °C - qualified for under-hood automotive, industrial control, and extended-life portable equipment. |
Pinout & Package
TSV324IDT is supplied in SO14 (Small Outline 14-pin) package, 3.9 mm × 8.7 mm body, 1.27 mm pitch, with standard JEDEC MO-012AC footprint. Thermal resistance junction-to-ambient is 105 °C/W.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Inverting input (Amplifier A) | Accepts feedback network connection; rail-to-rail common-mode range enables direct sensing of ground-referenced signals. |
| 2 | Non-inverting input (Amplifier A) | Supports single-supply sensor biasing; extends 200 mV beyond VDD and VCC for flexible reference design. |
| 3 | Output (Amplifier A) | Delivers ±80 mA into resistive/capacitive loads; stable with 500 pF, suitable for driving long traces or piezoelectric elements. |
| 4 | VDD (Ground) | Low-side power terminal; must be connected to system ground plane for optimal PSRR and noise immunity. |
| 5 | Non-inverting input (Amplifier B) | Independent channel input; shares same rail-to-rail input spec as Pin 2, enabling matched dual-channel front-ends. |
| 6 | Inverting input (Amplifier B) | Configurable for differential or single-ended gain; compatible with standard LM324 feedback topologies. |
| 7 | Output (Amplifier B) | Electrically isolated output stage; no crosstalk observed in datasheet tests up to 100 kHz. |
| 8 | VCC (Positive supply) | Accepts 2.5–6 V; supply current per amplifier is 650 µA typical at 3 V, enabling ultra-low-quiescent designs. |
| 9 | Output (Amplifier C) | Third independent output; maintains same AC/DC specs as Pins 3 and 7 across temperature and supply variation. |
| 10 | Inverting input (Amplifier C) | Matches Pin 6 electrical behavior; validated for unity-gain stable operation with 500 pF load. |
| 11 | Non-inverting input (Amplifier C) | Identical input structure to Pins 2 and 5; supports simultaneous multi-channel signal acquisition. |
| 12 | Output (Amplifier D) | Fourth output; fully characterized for 80 mA drive capability and 0.6 V/µs slew rate at VCC = 3 V. |
| 13 | Inverting input (Amplifier D) | Validated for rail-to-rail input operation down to VDD − 0.2 V; no phase reversal observed. |
| 14 | Non-inverting input (Amplifier D) | Final input terminal; matches all other non-inverting inputs in offset drift (2 µV/°C) and bias current (125 nA typ). |
Key Features
| Feature | Design Value |
|---|---|
| Rail-to-rail I/O | Output swings within 100 mV of VDD/VCC with 600 Ω load; input accepts signals 200 mV beyond supply rails - eliminates level-shifting ICs in single-supply systems. |
| High output drive | ±80 mA typical sink/source current - directly drives headphones, relays, or analog multiplexers without external transistors. |
| Capacitive load stability | Stable with up to 500 pF - supports direct connection to LCD bias networks, piezo drivers, or long PCB traces without isolation resistors. |
| Low quiescent current | 650 µA per amplifier at 3 V - enables always-on sensor monitoring in battery-powered IoT nodes with multi-year runtime. |
| Extended temperature range | Specified from −40 °C to +125 °C - meets industrial and automotive under-hood requirements without derating. |
Applications
| Portable Audio Amplification | Industrial Sensor Signal Conditioning |
|---|---|
|
Use Scenario: Driving stereo headphone outputs in handheld medical monitors and portable test equipment. IC Role / Device Role / Timing Role: Quad op-amp configured as two independent headphone drivers (A+B channels) and two auxiliary signal conditioners (C+D channels). Use Value: Rail-to-rail output swing delivers full 3 Vpp audio into 32 Ω loads; 0.01% THD ensures clinical-grade audio fidelity without external filtering. |
Use Scenario: Amplifying low-level bridge sensor outputs (e.g., pressure, load cell) in factory automation PLC modules. IC Role / Device Role / Timing Role: Instrumentation amplifier front-end with programmable gain and offset correction using three amplifiers (A/B/C); fourth amplifier (D) buffers reference voltage. Use Value: 3 mV max input offset and 2 µV/°C drift minimize calibration frequency; 80 dB CMRR rejects common-mode noise from 24 V industrial bus coupling. |
| Laptop Battery Monitoring | Automotive Cabin Comfort Control |
|
Use Scenario: Real-time voltage/current sensing for smart battery fuel gauging in ultrabooks and 2-in-1 convertibles. IC Role / Device Role / Timing Role: Quad configuration used for cell voltage monitoring (A), pack current shunt amplification (B), temperature ADC buffering (C), and charge enable comparator hysteresis (D). Use Value: 2.5 V minimum supply allows operation during deep discharge; 1.3 MHz GBW supports fast transient detection on 500 ms battery protection cycles. |
Use Scenario: Occupant detection and HVAC actuator control in automotive seat modules and climate control units. IC Role / Device Role / Timing Role: Amplifies capacitive seat occupancy sensor signals (A), conditions thermistor inputs for cabin temperature (B), drives stepper motor current sense (C), and provides window lift position feedback (D). Use Value: −40 °C to +125 °C rating ensures reliability in parked-car thermal extremes; AEC-Q100 qualified variants (TSV324IYDT) available for full automotive deployment. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar quad rail-to-rail op-amp applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LM324DT | Higher VCC min (3 V), lower GBW (1.2 MHz at 5 V), no rail-to-rail input, 700 µA/amplifier ICC | Legacy industrial designs where supply >4.5 V and input common-mode range is constrained to 0–VCC | Select when cost sensitivity outweighs precision and low-voltage operation; requires level-shifting for sub-3 V sensors. |
| TSV324AIDT | Lower input offset (1 mV max vs. 3 mV), same package/pinout, identical AC specs | High-accuracy strain gauge or medical ECG front-ends requiring <10 µV DC error over temperature | Choose for new designs demanding tighter DC precision without layout or supply changes. |
Compared with LM324DT, TSV324IDT enables true single-cell operation and eliminates input clamping diodes; versus TSV324AIDT, it trades 2 mV higher offset for broader availability and lower unit cost in high-volume production.
Availability
TSV324IDT is available at Aetrix Electronics and suitable for portable audio amplification, industrial sensor signal conditioning, laptop battery monitoring, and automotive cabin comfort control requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for TSV324IDT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, analog ICs, power management devices, and MEMS sensors for industrial, automotive, and consumer markets.
The TSV3xx family was developed as a low-voltage, rail-to-rail upgrade path for legacy LM324/LM358 applications - targeting battery-powered instrumentation, portable medical devices, and space-constrained industrial controls where supply headroom and output drive are critical.
FAQ
What is the maximum capacitive load the TSV324IDT can drive stably?
The TSV324IDT is characterized for stable operation with up to 500 pF capacitive load without external compensation, as confirmed in DS4381 Figure 14–15 (gain/phase vs. frequency). This enables direct driving of LCD bias networks, piezoelectric transducers, and long PCB traces without series isolation resistors - a key differentiator from standard LM324 derivatives.
Does TSV324IDT support true rail-to-rail input at temperatures outside 25 °C?
Yes - the common-mode input range is specified as VDD to VCC over the full operating temperature range (−40 °C to +125 °C) at VCC ≤ 5.5 V, and extends to VDD − 0.2 V to VCC + 0.2 V at 25 °C. This ensures robust input operation across automotive and industrial thermal profiles without signal clipping.
Can TSV324IDT replace LM324 in existing SO14 PCB layouts?
Yes - TSV324IDT uses identical SO14 pinout and footprint as LM324, with compatible power supply sequencing and output loading. No layout changes are required; however, users should verify that 2.5 V minimum supply and rail-to-rail input behavior align with system-level signal chain requirements before drop-in substitution.
What is the thermal resistance (Rthja) of the SO14 package for TSV324IDT?
The SO14 package has a typical junction-to-ambient thermal resistance (Rthja) of 105 °C/W, as documented in Table 1 Absolute Maximum Ratings. This value assumes standard JEDEC 2-layer board conditions (1 sq-in copper pad per side); actual thermal performance improves with enhanced copper pour or thermal vias beneath the exposed pad (if present) - though SO14 lacks an exposed thermal pad.
TSV324IDT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- -
- Package/Case:
- 14-SOIC (0.154", 3.90mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Amplifier Type:
- General Purpose
- Number of Circuits:
- 4
- Output Type:
- Rail-to-Rail
- Slew Rate:
- 0.6V/µs
- Gain Bandwidth Product:
- 1.4 MHz
- -3db Bandwidth:
- -
- Current - Input Bias:
- 70 nA
- Voltage - Input Offset:
- 200 µV
- Current - Supply:
- 500µA
- Current - Output / Channel:
- 80 mA
- Voltage - Supply Span (Min):
- 2.5 V
- Voltage - Supply Span (Max):
- 6 V
- Operating Temperature:
- -40°C ~ 125°C
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 14-SO
TSV324IDT FAQ
1.How can I place an order for TSV324IDT through Aetrix?
Please submit a Request for Quotation (RFQ) for TSV324IDT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TSV324IDT reliable?
The price and inventory of TSV324IDT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TSV324IDT is usually 5 days.
3.What payment methods are accepted for TSV324IDT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TSV324IDT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TSV324IDT?
TSV324IDT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TSV324IDT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TSV324IDT?
For technical support, including TSV324IDT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TSV324IDT requirements.
6.How does Aetrix verify that TSV324IDT is sourced from the original manufacturer or authorized distributors?
All TSV324IDT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TSV324IDT meets industry standards.
7.What is the process for return or replacement of TSV324IDT?
All TSV324IDT units undergo pre-shipment inspection (PSI). If there is an issue with TSV324IDT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TSV324IDT part is unused and in its original packaging.
Return procedure for TSV324IDT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TSV324IDT Tags
-
LM358DT
STMicroelectronics
-
LM358DR
Texas Instruments
-
LM2904DR
Texas Instruments
-
LM358ADR
Texas Instruments
-
LM2904DGKR
Texas Instruments
-
LM324DR
Texas Instruments
-
MCP6006T-E/OT
Microchip Technology
-
MCP6006UT-E/OT
Microchip Technology
-
LM324PWR
Texas Instruments
-
LM2902PWR
Texas Instruments
-
LM2902DR
Texas Instruments
-
LM358P
Texas Instruments
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
