STMicroelectronics TSV358AIST

Overview

TSV358AIST from STMicroelectronics is a dual rail-to-rail input/output operational amplifier in MiniSO8 package, designed for low-voltage signal conditioning with 2.5 V to 6 V supply operation, ±1 mV max input offset voltage (–40 °C to +125 °C), 1.3 MHz gain bandwidth, and 80 mA output drive capability-used in battery-powered audio and sensor interfaces.

For engineers reviewing the TSV358AIST datasheet, TSV358AIST pinout, TSV358AIST application, or TSV358AIST equivalent, key selection criteria include rail-to-rail I/O swing at 3 V, extended common-mode range (VDD – 0.2 V to VCC + 0.2 V), thermal stability up to 125 °C, and compatibility with 32 Ω headphone loads.

Technical Context

The TSV358AIST implements a CMOS-input dual op-amp architecture optimized for low-voltage operation, supporting rail-to-rail input common-mode range beyond supply rails by ±200 mV and rail-to-rail output swing within 100 mV of each rail under 600 Ω load. Its internal compensation ensures stable unity-gain operation with ≥53° phase margin at 100 pF capacitive load.

It delivers 80 mA continuous output current per channel independent of supply voltage, supports 2.5–6 V single-supply operation, and maintains <1 µV/°C input offset drift across –40 °C to +125 °C-enabling precision DC-coupled amplification in portable industrial and automotive subsystems.

Key Specifications

Pinout & Package

TSV358AIST is housed in a MiniSO8 (3 mm × 3 mm, 0.65 mm pitch) thermally enhanced package with exposed pad for improved power dissipation. Pinout follows standard dual op-amp configuration (SO8-compatible).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual rail-to-rail op-amp applications.

Compared with LMV358IDR, TSV358AIST provides tighter offset, higher drive, and extended input range-critical for precision portable systems; versus TSV852IST, it trades bandwidth and noise for 5× lower supply current, making it optimal for always-on sensor nodes.

Availability

TSV358AIST is available at Aetrix Electronics and suitable for battery-powered audio interfaces, industrial sensor signal conditioning, and automotive cabin sensor modules requiring stable component supply across extended temperature ranges.

Supply support for TSV358AIST includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, delivering silicon solutions for automotive, industrial, and consumer markets since 1987.

The TSV3xxA family targets low-voltage, high-precision analog signal conditioning in space-constrained portable and harsh-environment applications-emphasizing rail-to-rail operation, thermal robustness, and supply flexibility.

FAQ

What is the maximum capacitive load the TSV358AIST can drive stably?

The TSV358AIST maintains ≥53° phase margin with up to 500 pF capacitive load at unity gain, as verified in DS4381 Figure 14 and Table 3. It remains stable driving typical PCB traces (≤100 pF) and small ceramic decoupling caps without external compensation, but larger loads require series isolation resistor or feedback network adjustment.

Does the TSV358AIST support true single-supply operation down to 2.5 V?

Yes-TSV358AIST operates from 2.5 V to 6 V with full rail-to-rail input and output functionality. At 2.5 V, it retains 1.1 MHz GBP, ±80 mA output drive, and extended common-mode range (VDD – 0.2 V to VCC + 0.2 V), enabling direct use with coin-cell or two-alkaline battery sources without voltage boosting.

How does the "A" suffix in TSV358AIST affect performance versus TSV358IST?

The "A" denotes enhanced input offset voltage grade: TSV358AIST specifies 0.1 mV typical / 1 mV max (–40 °C to +125 °C), while TSV358IST is 0.2 mV typical / 3 mV max. All other parameters-including GBP, output drive, and temperature range-are identical, making the "A" version preferred for precision DC-coupled applications.

Is the MiniSO8 package of TSV358AIST pin-compatible with standard SO8 footprints?

No-the MiniSO8 (3 mm × 3 mm) has 0.65 mm pitch and smaller body than SO8 (4.9 mm × 6.0 mm, 1.27 mm pitch). It is not mechanically or solder-reflow compatible with SO8 land patterns. Layout requires dedicated MiniSO8 footprint per ST's DS4381 Figure 21 and Table 7, including 2.8–3.2 mm D dimension and 0.4–0.8 mm L lead length.