STMicroelectronics TSV358IDT
- Part No.:
- TSV358IDT
- Manufacturer:
- STMicroelectronics
- Category:
- Instrumentation, Op Amps, Buffer Amps
- Package:
- 8-SOIC (0.154", 3.90mm Width)
- Datasheet:
-
TSV358IDT.pdf
- Description:
- IC OPAMP GP 2 CIRCUIT 8SOIC
- Quantity:
- Payment:

- Shipping:

Inventory:23,456
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
TSV358IDT from STMicroelectronics is a dual rail-to-rail input/output operational amplifier in SO8 package, operating from 2.5 V to 6 V supply, delivering 1.3 MHz gain bandwidth and 80 mA output current per channel at 3 V, with extended common-mode range (VDD − 0.2 V to VCC + 0.2 V) and −40 °C to +125 °C temperature rating - used in battery-powered audio drivers and sensor signal conditioning circuits.
For engineers reviewing the TSV358IDT datasheet, TSV358IDT pinout, TSV358IDT application, or TSV358IDT equivalent, key selection factors include rail-to-rail I/O swing, 80 mA drive capability into 32 Ω loads, low 650 µA supply current per amplifier at 3 V, and guaranteed operation across automotive-grade temperature extremes.
Technical Context
The TSV358IDT implements a CMOS-input, rail-to-rail output op-amp architecture optimized for low-voltage portable systems. Its input stage supports common-mode voltage beyond rails by ±200 mV at 25 °C, while output swings within 100 mV of each rail under 600 Ω load - enabling full dynamic range utilization in single-supply 3 V systems.
It features internal compensation for unity-gain stability with up to 500 pF capacitive load, delivers 0.6 V/µs slew rate, and maintains 80 dB CMRR and 90 dB SVR over its full operating range - making it suitable for precision DC-coupled amplification and active filtering where supply rejection and offset drift matter.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Voltage | 2.5 V to 6 V - enables direct use in Li-ion (3.0–4.2 V), USB-powered (5 V), and dual-cell alkaline (3 V) systems without LDO pre-regulation. |
| Gain Bandwidth Product | 1.3 MHz at VCC = 3 V - supports stable closed-loop gain ≥10 up to ~130 kHz, sufficient for anti-aliasing filters and audio preamps. |
| Output Current | ±80 mA - drives 32 Ω headphone loads directly or 600 Ω sensors with <100 mV headroom to rails. |
| Input Offset Voltage | 3 mV max (TSV358), 1 mV max (TSV358A) - ensures ≤3 mV error in 1 V full-scale sensor interfaces without trimming. |
| Common-Mode Range | VDD − 0.2 V to VCC + 0.2 V - allows input signals to exceed supply rails slightly, easing level-shifting in mixed-supply systems. |
| Quiescent Current | 650 µA per amplifier at 3 V - enables dual-channel operation at <1.3 mA total, critical for multi-day battery life in portable devices. |
| Operating Temperature | −40 °C to +125 °C - qualified for under-hood automotive, industrial control, and ruggedized portable equipment. |
Pinout & Package
TSV358IDT is housed in an 8-pin SO8 (Small Outline Integrated Circuit) package with standard 1.27 mm pitch, 5.0 mm × 4.0 mm body, and 1.75 mm height - RoHS-compliant and ECOPACK® certified.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Inverting Input (A) | High-impedance node for feedback network connection; accepts signals from VDD − 0.2 V to VCC + 0.2 V. |
| 2 | Non-inverting Input (A) | High-Z input for reference or sensor signal; same extended common-mode range as Pin 1. |
| 3 | Output (A) | Rail-to-rail output capable of sourcing/sinking 80 mA; swings within 100 mV of VDD/VCC with 600 Ω load. |
| 4 | VDD (Ground) | Low-side supply rail - connected to system ground in single-supply configurations. |
| 5 | Non-inverting Input (B) | Second independent input channel; identical specs and biasing to Pin 2. |
| 6 | Inverting Input (B) | Second independent input channel; identical specs and biasing to Pin 1. |
| 7 | Output (B) | Second rail-to-rail output; electrically isolated from Output A, supports dual-path signal processing. |
| 8 | VCC (Supply) | Positive supply rail - accepts 2.5–6 V; supplies both amplifiers with shared quiescent current path. |
Key Features
| Feature | Design Value |
|---|---|
| Rail-to-rail I/O | Enables full-swing signal handling in 3 V single-supply systems without level-shifting circuitry. |
| Extended Common-Mode Range | Accepts inputs 200 mV beyond supply rails - simplifies interfacing with DACs or sensors operating at different reference voltages. |
| High Output Drive | 80 mA per channel drives 32 Ω headphones or 600 Ω instrumentation loads without external buffers. |
| Low Power Operation | 650 µA per amplifier at 3 V allows dual-channel analog front-end design with sub-1.3 mA total supply current. |
| Wide Temperature Range | Guaranteed performance from −40 °C to +125 °C supports deployment in automotive engine compartments and industrial PLCs. |
Applications
| Headphone Audio Driver | Sensor Signal Conditioning |
|---|---|
Use Scenario: Driving stereo 32 Ω headphones from a 3.3 V microcontroller DAC output in portable medical monitors. IC Role / Device Role / Timing Role: Dual-channel buffer and level-shifter, converting low-current DAC output to high-current, rail-to-rail audio waveform. Use Value: Eliminates need for discrete transistor buffers; 80 mA drive ensures >1 Vrms into 32 Ω at 3 V supply with <0.01% THD. |
Use Scenario: Amplifying millivolt-level thermocouple or bridge sensor outputs in battery-powered environmental sensors. IC Role / Device Role / Timing Role: Precision instrumentation amplifier front-end with rail-to-rail input to capture full sensor range near supply rails. Use Value: Extended Vicm (VDD − 0.2 V) captures near-ground signals without negative supply; 3 mV max Vio preserves µV-level resolution. |
| Laptop Battery Monitoring | Industrial Analog I/O Module |
Use Scenario: Measuring cell voltage and charge current in 2-cell Li-ion laptop battery packs with 3.3 V system supply. IC Role / Device Role / Timing Role: Dual-channel differential amplifier for voltage sensing and current shunt amplification in real-time BMS. Use Value: 80 dB CMRR rejects common-mode noise on shunt resistors; 1.3 MHz GBW supports fast transient detection during load switching. |
Use Scenario: Signal conditioning for 4–20 mA loop-powered transmitters in factory automation controllers operating at −40 °C to 85 °C. IC Role / Device Role / Timing Role: Low-power, high-accuracy input buffer and output driver in isolated analog input/output modules. Use Value: −40 °C to +125 °C rating ensures reliability in uncooled enclosures; 650 µA/quiescent current minimizes self-heating in sealed housings. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual rail-to-rail op-amp applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LMV358IDR | Higher 1.8 MHz GBW but only 45 mA output drive; 1.25 V minimum supply; no extended Vicm beyond rails. | Better for higher-frequency filtering but unsuitable for 32 Ω headphone loads or rail-exceeding sensor inputs. | Choose LMV358IDR when bandwidth >1.3 MHz is required and output load >600 Ω; avoid for low-Vcc headphone or wide-Vicm apps. |
| TSV852IST | Enhanced precision: 0.4 mV max Vio, 0.5 µV/°C drift, 2.4 MHz GBW; MiniSO8 package; 1.5–5.5 V supply. | Superior DC accuracy and speed, but lower 60 mA output drive and narrower supply range excludes 6 V operation. | Choose TSV852IST for precision sensor front-ends needing <0.5 mV offset and <1 µV/°C drift; not for 6 V or high-current loads. |
Compared with LMV358IDR and TSV852IST, TSV358IDT uniquely balances 80 mA drive, rail-exceeding Vicm, 6 V max supply, and −40 °C to +125 °C operation - making it optimal for robust, low-voltage, high-output analog stages where precision and power efficiency coexist.
Availability
TSV358IDT is available at Aetrix Electronics and suitable for battery-powered audio systems, industrial sensor nodes, and automotive cabin electronics requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for TSV358IDT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power ICs, analog chips, and MEMS sensors for industrial, automotive, and consumer markets.
The TSV3xx family was developed specifically for low-voltage, rail-to-rail general-purpose op-amp applications in portable and energy-constrained systems - emphasizing drive strength, wide temperature operation, and supply flexibility over ultra-low-noise or GHz-speed performance.
FAQ
What is the maximum capacitive load the TSV358IDT can drive stably?
The TSV358IDT is internally compensated for unity-gain stability with up to 500 pF capacitive load, as confirmed in the datasheet's absolute maximum ratings table. Driving larger loads requires external isolation resistance (e.g., 10–100 Ω in series with the output) to maintain phase margin above 53° and prevent oscillation.
Does TSV358IDT support true single-supply operation with input signals near ground?
Yes - its common-mode input range extends to VDD − 0.2 V at 25 °C, allowing inputs down to −200 mV relative to ground in single-supply configurations. This enables direct interfacing with grounded sensors or DACs without level-shifting circuitry, provided input current remains within ±1 mA limits.
How does the TSV358IDT differ from the TSV358AIDT variant?
The TSV358AIDT features tighter input offset voltage (1 mV max vs. 3 mV max for TSV358IDT) and lower offset drift (2 µV/°C typ.), achieved via enhanced laser trimming. Both share identical pinout, package, supply range, output drive, and temperature rating - making TSV358AIDT preferable for precision DC-coupled applications where offset error must be minimized.
Can TSV358IDT be used in automotive under-hood applications?
Yes - the TSV358IDT is rated for −40 °C to +125 °C operating temperature and meets ST's industrial reliability standards. While not AEC-Q100 qualified (that status applies to the "IY" automotive-grade variants like TSV358IYDT), its thermal and electrical specs fully support under-hood use in non-safety-critical subsystems such as cabin climate control or infotainment power management.
TSV358IDT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- -
- Package/Case:
- 8-SOIC (0.154", 3.90mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Amplifier Type:
- General Purpose
- Number of Circuits:
- 2
- Output Type:
- Rail-to-Rail
- Slew Rate:
- 0.6V/µs
- Gain Bandwidth Product:
- 1.4 MHz
- -3db Bandwidth:
- -
- Current - Input Bias:
- 70 nA
- Voltage - Input Offset:
- 200 µV
- Current - Supply:
- 500µA
- Current - Output / Channel:
- 80 mA
- Voltage - Supply Span (Min):
- 2.5 V
- Voltage - Supply Span (Max):
- 6 V
- Operating Temperature:
- -40°C ~ 125°C
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-SOIC
TSV358IDT FAQ
1.How can I place an order for TSV358IDT through Aetrix?
Please submit a Request for Quotation (RFQ) for TSV358IDT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TSV358IDT reliable?
The price and inventory of TSV358IDT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TSV358IDT is usually 5 days.
3.What payment methods are accepted for TSV358IDT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TSV358IDT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TSV358IDT?
TSV358IDT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TSV358IDT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TSV358IDT?
For technical support, including TSV358IDT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TSV358IDT requirements.
6.How does Aetrix verify that TSV358IDT is sourced from the original manufacturer or authorized distributors?
All TSV358IDT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TSV358IDT meets industry standards.
7.What is the process for return or replacement of TSV358IDT?
All TSV358IDT units undergo pre-shipment inspection (PSI). If there is an issue with TSV358IDT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TSV358IDT part is unused and in its original packaging.
Return procedure for TSV358IDT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TSV358IDT Tags

-
LM358DT
STMicroelectronics

-
LM358DR
Texas Instruments

-
LM2904DR
Texas Instruments

-
LM358ADR
Texas Instruments
-
LM2904DGKR
Texas Instruments
-
LM324DR
Texas Instruments

-
MCP6006T-E/OT
Microchip Technology

-
MCP6006UT-E/OT
Microchip Technology

-
LM324PWR
Texas Instruments

-
LM2902PWR
Texas Instruments
-
LM2902DR
Texas Instruments

-
LM358P
Texas Instruments
Tech Hub
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
