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STMicroelectronics TSV622ID
- Part No.:
- TSV622ID
- Manufacturer:
- STMicroelectronics
- Category:
- Instrumentation, Op Amps, Buffer Amps
- Package:
- 8-SOIC (0.154", 3.90mm Width)
- Datasheet:
-
TSV622ID.pdf
- Description:
- IC CMOS 2 CIRCUIT 8SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:2,009
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Product details
Overview
TSV622ID from STMicroelectronics is a dual rail-to-rail input/output CMOS operational amplifier optimized for ultra-low-power, low-voltage operation. It delivers 420 kHz gain bandwidth at 29 µA supply current (5 V), supports 1.5–5.5 V supply range, features 800 µV max input offset voltage (A version), and operates across –40 °C to +125 °C - ideal for precision sensor signal conditioning in portable medical devices.
For engineers reviewing the TSV622ID datasheet, TSV622ID pinout, TSV622ID application, or TSV622ID equivalent, key selection criteria include its rail-to-rail I/O capability, 1 pA typical input bias current, shutdown mode (5 nA typ), EMI hardening (92 dB EMIRR at 1.8 GHz), and guaranteed unity-gain stability with 100 pF capacitive loads.
Technical Context
The TSV622ID uses complementary PMOS/NMOS input stages enabling true rail-to-rail input common-mode range (VCC− −0.1 V to VCC+ +0.1 V) without phase reversal. Its output stage drives within 35 mV of both rails under 10 kΩ load, maintaining linearity across full supply range.
Internally trimmed current consumption ensures tight dispersion (±17%) across GBP (350–420 kHz), slew rate (0.12–0.19 V/µs), and large-signal gain (85–98 dB), delivering consistent AC performance independent of process variation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Voltage | 1.5–5.5 V - enables direct integration into single-cell Li-ion (3.0–4.2 V), coin-cell (1.5–3.0 V), and 5 V legacy systems without LDO. |
| Quiescent Current | 29 µA typ (5 V) - allows >1-year battery life in always-on wearable sensors drawing <10 µA average system current. |
| Gain Bandwidth Product | 420 kHz typ - supports anti-aliasing filtering up to ~65 kHz and DC-coupled biosignal amplification (ECG, EEG) with stable phase margin. |
| Input Offset Voltage | 800 µV max (TSV622A variant) - ensures ≤0.8 mV error in 1 V full-scale bridge sensor outputs without trimming. |
| Input Bias Current | 1 pA typ - preserves high-impedance pH electrode and piezoelectric sensor signal integrity without loading-induced drift. |
| EMI Rejection Ratio | 92 dB at 1.8 GHz - suppresses cellular band interference in handheld diagnostic tools operating near GSM/UMTS antennas. |
| Shutdown Current | 5 nA typ - reduces standby power to negligible levels during sleep cycles in multi-channel data loggers. |
Pinout & Package
TSV622ID is housed in an 8-pin MiniSO8 package (3.0 × 4.9 mm, 0.65 mm pitch), optimized for space-constrained portable PCBs and compatible with standard SO8 reflow profiles.
| Pin | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Inverting Input (Op-Amp 1) | Accepts differential signal reference; high-impedance node (1 pA bias) minimizes loading on passive RC filters. |
| 2 | Non-inverting Input (Op-Amp 1) | Connects to sensor bridge mid-point or reference divider; rail-to-rail common-mode range supports 0–5 V input directly. |
| 3 | Output (Op-Amp 1) | Drives ADC input or next-stage filter; rail-to-rail swing (35 mV headroom) maximizes dynamic range at 3.3 V ADC reference. |
| 4 | VCC− (Ground) | Power return path; requires local 10 nF ceramic decoupling per datasheet Figure 23 to suppress 100 MHz+ switching noise. |
| 5 | VCC+ (Supply) | 1.5–5.5 V input; internal regulation maintains stable bias current across voltage drop in battery discharge curves. |
| 6 | Non-inverting Input (Op-Amp 2) | Independent channel for dual-sensor readout (e.g., temperature + humidity); no crosstalk due to separate input stages. |
| 7 | Inverting Input (Op-Amp 2) | Configurable as transimpedance input for photodiode current-to-voltage conversion with minimal dark-current error. |
| 8 | Output (Op-Amp 2) | High-Z state during shutdown (pin not present); enables multiplexed analog front-end architectures without external switches. |
Key Features
| Feature | Design Value |
|---|---|
| Rail-to-rail input and output | Enables full utilization of 1.8 V or 3.3 V ADC reference without level-shifting circuitry or supply boosting. |
| Unity-gain stable with 100 pF load | Eliminates need for external isolation resistors when driving ADC sample-and-hold capacitors or long PCB traces. |
| EMI-hardened architecture | Passes EN 61000-4-3 Level 3 (10 V/m) radiated immunity testing without external ferrite beads or shielding. |
| Low input offset drift | 2 µV/°C max ensures <10 µV total offset shift over –40 °C to +85 °C industrial temperature range. |
| Guaranteed min GBP & SR | 350 kHz min GBP and 0.12 V/µs min slew rate ensure predictable settling time (<5 µs to 0.1%) in production units. |
Applications
| Wearable Physiological Monitor | Portable Gas Sensor Interface |
|---|---|
|
Use Scenario: Amplifying microvolt-level ECG signals from dry electrodes in a wrist-worn device powered by a 300 mAh coin cell. IC Role / Device Role / Timing Role: Dual-channel instrumentation amplifier front-end with one op-amp for differential gain and second for right-leg drive (RLD) feedback. Use Value: 29 µA quiescent current extends battery life to 14 months; rail-to-rail output drives 12-bit SAR ADC directly at 3.0 V supply. |
Use Scenario: Conditioning output from electrochemical CO sensor requiring low-noise, low-drift amplification in handheld safety meter. IC Role / Device Role / Timing Role: Transimpedance amplifier converting pA-level sensor current to voltage, followed by active low-pass filtering. Use Value: 1 pA input bias current prevents baseline drift; 420 kHz GBP supports 10 Hz cutoff with 10 MΩ feedback resistor and 1.6 nF capacitor. |
| Wireless Temperature Logger | Low-Power Medical Pulse Oximeter |
|
Use Scenario: Signal conditioning for thermistor-based temperature sensing in a Bluetooth LE beacon logging every 5 minutes. IC Role / Device Role / Timing Role: Precision voltage follower buffering thermistor divider output before ADC sampling. Use Value: 800 µV max Vio contributes <0.2 °C error at 25 °C; shutdown mode reduces average current to 30 nA between measurements. |
Use Scenario: Dual-channel synchronous amplification of red/IR photodiode currents in battery-powered fingertip SpO₂ sensor. IC Role / Device Role / Timing Role: Two independent transimpedance amplifiers with matched GBP and offset for ratiometric saturation calculation. Use Value: Matched AC performance ensures identical pulse waveform fidelity; EMI hardening rejects RF interference from nearby BLE radio. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual rail-to-rail op-amp applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TSV612IST | Lower power (9 µA), lower speed (120 kHz GBP), same MiniSO8 package. | Better for sub-10 kHz sensor interfaces where bandwidth is secondary to battery life. | Select when >2-year battery life is required and signal bandwidth ≤10 kHz. |
| MCP6022-E/SN | Higher supply current (100 µA), higher GBP (1 MHz), SO8 package only. | Suitable for higher-speed active filters but increases power budget 3.4× vs. TSV622ID. | Choose when 1 MHz bandwidth is mandatory and 100 µA supply current is acceptable. |
Compared with TSV622ID, TSV612IST trades bandwidth for ultra-low power in identical footprint, while MCP6022-E/SN offers higher speed at significantly increased current draw and larger SO8 package - making TSV622ID optimal for balanced 420 kHz / 29 µA performance in MiniSO8 space-constrained designs.
Availability
TSV622ID is available at Aetrix Electronics and suitable for battery-powered medical wearables, portable environmental sensors, low-power industrial data loggers, and handheld diagnostic instruments requiring stable component supply across extended temperature ranges.
Supply support for TSV622ID includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, analog ICs, power management, and MEMS sensors for industrial, automotive, and consumer markets.
The TSV62x series belongs to ST's precision low-power op-amp product line, engineered specifically for energy-constrained, high-accuracy analog signal chains in portable and battery-operated equipment.
FAQ
What is the maximum capacitive load the TSV622ID can drive without external compensation?
The TSV622ID is unity-gain stable with capacitive loads up to 100 pF, as verified in the datasheet (Table 4, 7, and Section 4.6). This covers typical ADC input capacitance (10–20 pF) plus PCB trace capacitance (<5 pF/inch), eliminating need for series output resistors in most sensor interface designs.
Does the TSV622ID have a shutdown pin, and how is it controlled?
No - the TSV622ID (dual, no standby) lacks a shutdown pin. Shutdown functionality is only available on TSV623/TSV625 (dual/quad with SHDN pins) and their 'A' variants. TSV622ID remains always-active; for power gating, external FET control of VCC is required.
How does the TSV622ID perform at 1.5 V supply, and is it fully specified there?
At 1.5 V, the TSV622ID maintains rail-to-rail I/O operation, 275 kHz GBP (min), and 25 µA supply current (typ), with all key parameters characterized down to 1.5 V (Figures 2–4, Tables 4–7). Full specifications are guaranteed from 1.8 V, but functional operation is validated at 1.5 V for single-cell alkaline applications.
Is the TSV622ID suitable for driving ADC inputs directly, and what layout precautions apply?
Yes - its rail-to-rail output (35 mV headroom), low THD+noise (0.002%), and 100 pF capacitive load stability make it ideal for direct ADC driving. Layout requires 10 nF X7R ceramic decoupling caps placed ≤2 mm from VCC/GND pins (Section 4.7), plus ground plane under the MiniSO8 body to minimize thermal resistance (Rthja = 113 °C/W).
TSV622ID Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- -
- Package/Case:
- 8-SOIC (0.154", 3.90mm Width)
- Packaging:
- Tube
- Product Status:
- Obsolete
- Amplifier Type:
- CMOS
- Number of Circuits:
- 2
- Output Type:
- Rail-to-Rail
- Slew Rate:
- 0.14V/µs
- Gain Bandwidth Product:
- 420 kHz
- -3db Bandwidth:
- -
- Current - Input Bias:
- 1 pA
- Voltage - Input Offset:
- 4 mV
- Current - Supply:
- 29µA
- Current - Output / Channel:
- 74 mA
- Voltage - Supply Span (Min):
- 1.5 V
- Voltage - Supply Span (Max):
- 5.5 V
- Operating Temperature:
- -40°C ~ 125°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-SOIC
TSV622ID FAQ
1.How can I place an order for TSV622ID through Aetrix?
Please submit a Request for Quotation (RFQ) for TSV622ID on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TSV622ID reliable?
The price and inventory of TSV622ID are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TSV622ID is usually 5 days.
3.What payment methods are accepted for TSV622ID?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TSV622ID transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TSV622ID?
TSV622ID orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TSV622ID order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TSV622ID?
For technical support, including TSV622ID datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TSV622ID requirements.
6.How does Aetrix verify that TSV622ID is sourced from the original manufacturer or authorized distributors?
All TSV622ID products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TSV622ID meets industry standards.
7.What is the process for return or replacement of TSV622ID?
All TSV622ID units undergo pre-shipment inspection (PSI). If there is an issue with TSV622ID, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TSV622ID part is unused and in its original packaging.
Return procedure for TSV622ID:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TSV622ID Tags
-
LM358DT
STMicroelectronics
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LM358DR
Texas Instruments
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LM2904DR
Texas Instruments
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LM358ADR
Texas Instruments
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LM2904DGKR
Texas Instruments
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LM324DR
Texas Instruments
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MCP6006T-E/OT
Microchip Technology
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MCP6006UT-E/OT
Microchip Technology
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LM324PWR
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LM2902PWR
Texas Instruments
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LM2902DR
Texas Instruments
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LM358P
Texas Instruments
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