My Inquiry
My Account
STMicroelectronics TSV622IDT
- Part No.:
- TSV622IDT
- Manufacturer:
- STMicroelectronics
- Category:
- Instrumentation, Op Amps, Buffer Amps
- Package:
- 8-SOIC (0.154", 3.90mm Width)
- Datasheet:
-
TSV622IDT.pdf
- Description:
- IC CMOS 2 CIRCUIT 8SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:14,389
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
TSV622IDT from STMicroelectronics is a dual rail-to-rail input/output CMOS operational amplifier optimized for ultra-low-power, low-voltage operation. It delivers 420 kHz gain bandwidth at 29 µA supply current per amplifier, operates from 1.5 V to 5.5 V, and features 800 µV max input offset voltage (A-grade), 1 pA typical input bias current, and 5 nA shutdown current - enabling precision signal conditioning in space-constrained battery-powered medical sensors and portable instrumentation.
For engineers reviewing the TSV622IDT datasheet, TSV622IDT pinout, TSV622IDT application, or TSV622IDT equivalent, key selection criteria include its rail-to-rail I/O capability at sub-2-V supply, guaranteed unity-gain stability with 100 pF capacitive load, EMI-hardened performance up to 2.4 GHz, and MiniSO8 package compatibility with high-density PCB layouts.
Technical Context
The TSV622IDT employs complementary PMOS/NMOS input stages to achieve rail-to-rail input common-mode range from (VCC–) – 0.1 V to (VCC+) + 0.1 V and rail-to-rail output swing within 35 mV of both rails under 10 kΩ load. Its internal current-starved architecture tightly controls supply current dispersion (±17% around 29 µA typ), directly stabilizing GBP, slew rate, and large-signal gain across temperature and process variation.
It integrates EMI hardening for robust operation in noisy environments (EMIRR = 92 dB at 1.8 GHz), supports stable unity-gain configuration without external compensation, and provides full DC/AC characterization at 1.8 V, 3.3 V, and 5 V supplies - with guaranteed minimum GBP = 350 kHz and SR = 0.12 V/µs across –40 °C to +125 °C.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Voltage Range | 1.5 V to 5.5 V - enables direct integration with single-cell Li-ion, NiMH, and 3.3 V/5 V logic rails without level shifting. |
| Quiescent Current per Amp | 29 µA typ (5 V) - allows >1-year battery life in always-on sensor nodes powered by CR2032 coin cells. |
| Gain Bandwidth Product | 420 kHz typ (5 V) - supports accurate amplification of DC–100 kHz biosignals (ECG, EEG) with minimal phase lag. |
| Input Offset Voltage | 800 µV max (TSV622A variant) - ensures ≤0.02% error in 4–20 mA loop receivers and precision thermistor interfaces. |
| Input Bias Current | 1 pA typ - preserves signal integrity in high-impedance pH electrode and photodiode front-ends. |
| Output Swing | Within 35 mV of rails (10 kΩ load) - maximizes dynamic range in single-supply data acquisition systems. |
| EMI Rejection Ratio | 92 dB at 1.8 GHz - suppresses cellular-band interference in wearable health monitors without shielding. |
Pinout & Package
TSV622IDT is housed in an 8-pin MiniSO8 (SO8-compatible) surface-mount package measuring 3.0 mm × 4.9 mm × 1.05 mm (max height), with ECOPACK® RoHS-compliant lead-free finish and moisture sensitivity level MSL3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (OUT1) | Amplifier 1 output | Delivers rail-to-rail buffered signal; capable of ±40 mA sink/source at 5 V; high-Z in shutdown if applicable (not present on TSV622). |
| 2 (−IN1) | Inverting input, Amp 1 | High-impedance node (1 pA bias); accepts signals from (VCC–) – 0.1 V to (VCC+) + 0.1 V. |
| 3 (+IN1) | Non-inverting input, Amp 1 | Same rail-to-rail CM range as −IN1; differential pair transitions at VCC+ – 0.7 V without phase reversal. |
| 4 (VCC–) | Negative supply / ground reference | Connects to system GND or negative rail; decoupling capacitor (10 nF) required adjacent to pin. |
| 5 (+IN2) | Non-inverting input, Amp 2 | Independent input for second amplifier; identical specs and CM range as +IN1. |
| 6 (−IN2) | Inverting input, Amp 2 | Independent input with same 1 pA bias and rail-to-rail CM range as −IN1. |
| 7 (OUT2) | Amplifier 2 output | Functionally identical to OUT1; supports independent signal paths in dual-channel sensor interfaces. |
| 8 (VCC+) | Positive supply | Accepts 1.5–5.5 V; requires local 10 nF decoupling to minimize PSRR degradation and oscillation risk. |
Key Features
| Feature | Design Value |
|---|---|
| Rail-to-rail input and output | Enables full utilization of 1.5 V supply headroom - critical for maximizing SNR in single-supply analog front-ends. |
| Ultra-low 29 µA quiescent current | Reduces self-heating to <0.1°C rise at 5 V, preserving offset stability in thermally sensitive measurement chains. |
| Unity-gain stable with 100 pF load | Eliminates need for external compensation in active filters and transimpedance amplifiers driving long traces or cables. |
| EMI-hardened architecture | Rejects 1.8 GHz RF interference at 92 dB - prevents corruption of microvolt-level bio-potential signals in unshielded PCBs. |
| Guaranteed −40 °C to +125 °C operation | Validates use in automotive cabin sensors and industrial IoT edge nodes without derating or thermal management. |
Applications
| Portable ECG Monitor | Wireless Temperature Node |
|---|---|
|
Use Scenario: Amplifying microvolt-level cardiac signals from dry electrodes in a Bluetooth LE-enabled patch. IC Role / Device Role / Timing Role: Dual-channel instrumentation amplifier front-end (1st stage), providing rail-to-rail DC-coupled gain with <1 µV RMS noise. Use Value: 1 pA input bias avoids electrode polarization drift; 420 kHz GBP supports 150 Hz anti-aliasing filtering without phase distortion. |
Use Scenario: Conditioning output from a 10 kΩ NTC thermistor in a battery-powered smart thermostat. IC Role / Device Role / Timing Role: Precision voltage follower and buffer driving ADC reference divider network. Use Value: 800 µV max Vio limits temperature error to <0.2°C over 0–70°C; 29 µA ICC extends 2xAA battery life to 5+ years. |
| Industrial Current Loop Receiver | Low-Power Active Filter |
|
Use Scenario: Converting 4–20 mA loop current to 0–2.5 V for SAR ADC sampling in a PLC analog input module. IC Role / Device Role / Timing Role: Low-drift transimpedance amplifier with precision gain-setting resistor. Use Value: Rail-to-rail output ensures full 0–2.5 V span at 3.3 V supply; 74 dB CMRR rejects common-mode noise on long field wiring. |
Use Scenario: Implementing 2nd-order Sallen-Key low-pass filter (fc = 10 kHz) in a hearing aid audio path. IC Role / Device Role / Timing Role: Unity-gain stable active filter stage with minimal power overhead. Use Value: 100 pF capacitive load tolerance eliminates need for isolation resistors; 0.12 V/µs slew rate prevents slew-induced distortion at 2 Vpp. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual low-power rail-to-rail op-amp applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCP6002T-I/SN (Microchip) | Lower GBP (1 MHz) but higher ICC (100 µA); no EMI hardening; Vio = 1.5 mV max. | Better for higher-speed DC-coupled apps where EMI immunity is secondary and supply current <100 µA is acceptable. | Choose when needing faster settling than 420 kHz GBP allows, and board-level RF filtering is already implemented. |
| LMV358IDR (TI) | Wider supply range (2.7–5.5 V); higher ICC (80 µA); Vio = 3 mV max; no 1.5 V operation or EMI rating. | Suitable for legacy 3.3 V systems where 1.5 V start-up or cellular-band immunity is not required. | Select only if existing design uses LMV358 footprint and 1.5 V operation is unnecessary - otherwise TSV622IDT offers superior low-voltage fidelity. |
Compared with MCP6002T-I/SN and LMV358IDR, the TSV622IDT uniquely combines 1.5 V operation, 29 µA quiescent current, 92 dB EMI rejection at 1.8 GHz, and guaranteed rail-to-rail I/O down to 1.5 V - making it the only option qualified for next-generation ultra-low-power, RF-noisy, single-cell medical and environmental sensing nodes.
Availability
TSV622IDT is available at Aetrix Electronics and suitable for portable medical devices, battery-powered sensor nodes, and industrial 4–20 mA loop receivers requiring stable component supply across extended temperature and voltage ranges.
Supply support for TSV622IDT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing silicon solutions for automotive, industrial, and consumer markets since 1987.
The TSV62x series belongs to ST's precision analog portfolio, engineered specifically for ultra-low-power, rail-to-rail signal conditioning in energy-constrained, high-reliability applications such as wearables, remote sensors, and smart industrial endpoints.
FAQ
Is TSV622IDT pin-compatible with other MiniSO8 dual op-amps like LMV358 or MCP602?
No - TSV622IDT uses standard MiniSO8 pinout (OUT1, −IN1, +IN1, VCC–, +IN2, −IN2, OUT2, VCC+), matching industry convention, but LMV358 and MCP602 share this layout. However, electrical differences (e.g., 1.5 V operation, EMI hardening, 29 µA ICC) require validation of gain, stability, and noise performance in final circuit implementation.
Does TSV622IDT support true shutdown functionality?
No - TSV622IDT is the non-shutdown version of the family. Shutdown pins (SHDN1/SHDN2) exist only on TSV623/TSV623A (MiniSO10) and TSV625/TSV625A (TSSOP16). TSV622/TSV622A lack dedicated shutdown control and draw 29 µA continuously when powered.
What is the maximum capacitive load TSV622IDT can drive without external compensation?
TSV622IDT is unity-gain stable with up to 100 pF capacitive load at the output, as verified in ST's datasheet Figure 6 and Section 4.6. Driving >100 pF requires a series resistor (e.g., 10–100 Ω) between output and load to restore phase margin - exact value depends on load capacitance and PCB parasitics.
Can TSV622IDT operate reliably at 1.5 V supply with full specifications guaranteed?
Yes - TSV622IDT is fully characterized and specified from 1.5 V to 5.5 V. Key parameters including GBP (≥350 kHz), SR (≥0.12 V/µs), and rail-to-rail I/O are guaranteed across this range and over –40 °C to +125 °C, as confirmed in Tables 4–7 and Section 4.1 of the official datasheet.
TSV622IDT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- -
- Package/Case:
- 8-SOIC (0.154", 3.90mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Amplifier Type:
- CMOS
- Number of Circuits:
- 2
- Output Type:
- Rail-to-Rail
- Slew Rate:
- 0.14V/µs
- Gain Bandwidth Product:
- 420 kHz
- -3db Bandwidth:
- -
- Current - Input Bias:
- 1 pA
- Voltage - Input Offset:
- 4 mV
- Current - Supply:
- 29µA
- Current - Output / Channel:
- 74 mA
- Voltage - Supply Span (Min):
- 1.5 V
- Voltage - Supply Span (Max):
- 5.5 V
- Operating Temperature:
- -40°C ~ 125°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-SOIC
TSV622IDT FAQ
1.How can I place an order for TSV622IDT through Aetrix?
Please submit a Request for Quotation (RFQ) for TSV622IDT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TSV622IDT reliable?
The price and inventory of TSV622IDT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TSV622IDT is usually 5 days.
3.What payment methods are accepted for TSV622IDT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TSV622IDT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TSV622IDT?
TSV622IDT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TSV622IDT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TSV622IDT?
For technical support, including TSV622IDT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TSV622IDT requirements.
6.How does Aetrix verify that TSV622IDT is sourced from the original manufacturer or authorized distributors?
All TSV622IDT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TSV622IDT meets industry standards.
7.What is the process for return or replacement of TSV622IDT?
All TSV622IDT units undergo pre-shipment inspection (PSI). If there is an issue with TSV622IDT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TSV622IDT part is unused and in its original packaging.
Return procedure for TSV622IDT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TSV622IDT Tags
-
LM358DT
STMicroelectronics
-
LM358DR
Texas Instruments
-
LM2904DR
Texas Instruments
-
LM358ADR
Texas Instruments
-
LM2904DGKR
Texas Instruments
-
LM324DR
Texas Instruments
-
MCP6006T-E/OT
Microchip Technology
-
MCP6006UT-E/OT
Microchip Technology
-
LM324PWR
Texas Instruments
-
LM2902PWR
Texas Instruments
-
LM2902DR
Texas Instruments
-
LM358P
Texas Instruments
Tech Hub
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
